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    • 1. 发明授权
    • Reduced S/D contact resistance of III-V MOSFET using low temperature metal-induced crystallization of n+ Ge
    • 使用n + Ge的低温金属诱导结晶降低了III-V MOSFET的S / D接触电阻
    • US08536043B2
    • 2013-09-17
    • US13017127
    • 2011-01-31
    • Jeehwan KimJin-Hong ParkDevendra SadanaKuen-Ting Shiu
    • Jeehwan KimJin-Hong ParkDevendra SadanaKuen-Ting Shiu
    • H01L21/28
    • H01L29/20H01L21/26513H01L21/28575H01L29/0847H01L29/267H01L29/41783H01L29/452H01L29/66522H01L29/66628H01L29/78
    • Embodiments of this invention provide a method to fabricate an electrical contact. The method includes providing a substrate of a compound Group III-V semiconductor material having at least one electrically conducting doped region adjacent to a surface of the substrate. The method further includes fabricating the electrical contact to the at least one electrically conducting doped region by depositing a single crystal layer of germanium over the surface of the substrate so as to at least partially overlie the at least one electrically conducting doped region, converting the single crystal layer of germanium into a layer of amorphous germanium by implanting a dopant, forming a metal layer over exposed surfaces of the amorphous germanium layer, and performing a metal-induced crystallization (MIC) process on the amorphous germanium layer having the overlying metal layer to convert the amorphous germanium layer to a crystalline germanium layer and to activate the implanted dopant. The electrical contact can be a source or a drain contact of a transistor.
    • 本发明的实施例提供一种制造电接触的方法。 该方法包括提供化合物III-V族半导体材料的衬底,其具有与衬底的表面相邻的至少一个导电掺杂区域。 该方法还包括通过在衬底的表面上沉积锗的单晶层以至少部分地覆盖在至少一个导电掺杂区域上来将至少一个导电掺杂区域的电接触制造到该至少一个导电掺杂区域, 通过注入掺杂剂,在非晶锗层的暴露表面上形成金属层,并对具有上覆金属层的非晶锗层进行金属诱导结晶(MIC)工艺,将锗的晶体层分解成无定形锗层, 将无定形锗层转化为结晶锗层并激活注入的掺杂剂。 电接触可以是晶体管的源极或漏极接触。