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    • 5. 发明授权
    • Adjustable resistor
    • 可调电阻
    • US08729668B2
    • 2014-05-20
    • US13552973
    • 2012-07-19
    • Pascal FornaraArnaud Regnier
    • Pascal FornaraArnaud Regnier
    • H01L21/02
    • H01L28/20H01L27/0629H01L27/11526H01L27/11531
    • An adjustable resistor formed on a first insulating layer of a substrate, including: a first polysilicon layer covered with a second insulating layer of a first thickness, except in a region where the first polysilicon layer is covered with a thin insulator layer of a second thickness smaller than the first thickness; a second polysilicon layer covering the second insulating layer and the thin insulator layer; on each side of the second insulating layer and at a distance from it, a first and a second conductive vias providing access to the terminals of the resistor on the first polysilicon layer; and a third conductive via providing access to a contacting area on the second polysilicon layer.
    • 一种形成在基板的第一绝缘层上的可调电阻器,包括:第一多晶硅层,其被第一厚度的第二绝缘层覆盖,除了第一多晶硅层被第二厚度的薄绝缘层覆盖的区域之外 小于第一厚度; 覆盖所述第二绝缘层和所述薄绝缘体层的第二多晶硅层; 在所述第二绝缘层的每一侧上与所述第二绝缘层相距一定距离处的第一和第二导电通孔提供对所述第一多晶硅层上的所述电阻器的端子的访问; 以及第三导电通孔,其提供对所述第二多晶硅层上的接触区域的接近。
    • 6. 发明申请
    • ADJUSTABLE RESISTOR
    • 可调电阻
    • US20130032926A1
    • 2013-02-07
    • US13552973
    • 2012-07-19
    • Pascal FORNARAArnaud Regnier
    • Pascal FORNARAArnaud Regnier
    • H01L27/08
    • H01L28/20H01L27/0629H01L27/11526H01L27/11531
    • An adjustable resistor formed on a first insulating layer of a substrate, including: a first polysilicon layer covered with a second insulating layer of a first thickness, except in a region where the first polysilicon layer is covered with a thin insulator layer of a second thickness smaller than the first thickness; a second polysilicon layer covering the second insulating layer and the thin insulator layer; on each side of the second insulating layer and at a distance from it, a first and a second conductive vias providing access to the terminals of the resistor on the first polysilicon layer; and a third conductive via providing access to a contacting area on the second polysilicon layer.
    • 一种形成在基板的第一绝缘层上的可调电阻器,包括:第一多晶硅层,其被第一厚度的第二绝缘层覆盖,除了第一多晶硅层被第二厚度的薄绝缘层覆盖的区域之外 小于第一厚度; 覆盖所述第二绝缘层和所述薄绝缘体层的第二多晶硅层; 在所述第二绝缘层的每一侧上与所述第二绝缘层相距一定距离处的第一和第二导电通孔提供对所述第一多晶硅层上的所述电阻器的端子的访问; 以及第三导电通孔,其提供对所述第二多晶硅层上的接触区域的接近。