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1. 发明授权

US08814054B2 Inclusion of chip elements in a sheathed wire 有权
标题翻译：将芯片元件包含在护套电线中
公开(公告)号：US08814054B2
公开(公告)日：2014-08-26
申请号：US13703255
申请日：2011-06-23
申请人： Jean Brun , Laurent Lancon , Dominique Vicard
发明人： Jean Brun , Laurent Lancon , Dominique Vicard
IPC分类号： G06K19/06 , D02G3/36 , G06K19/077 , H01L25/00 , H01L23/00
CPC分类号： G06K19/07749 , D02G3/362 , D10B2401/18 , G06K19/07718 , G06K19/07758 , G06K19/07786 , H01L24/78 , H01L24/85 , H01L25/0655 , H01L25/50 , H01L2224/78 , H01L2224/8517 , H01L2224/858 , H01L2924/00014 , H01L2924/01014 , H01L2924/01058 , Y10T29/49002 , H01L2224/48 , H01L2224/45099 , H01L2224/05599
摘要： A method for forming a sheathed wire includes the steps of: axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.
摘要翻译：一种用于形成护套线的方法包括以下步骤：使芯通过护套区域轴向推进; 在护套区域围绕芯部缠绕护套纤维; 并且在护套区域中提供一系列各自设置有线部分的微电子芯片元件，使得围绕芯部包覆的护套纤维也缠绕在芯片元件及其线部分上以形成护套线结合间隔开的芯片元件。

2. 发明授权

US08654540B2 Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element 有权
标题翻译：用于组装至少一个具有线元件的芯片的方法，具有可变形链接元件的电子芯片，多个芯片的制造方法，以及至少一个芯片与线元件
公开(公告)号：US08654540B2
公开(公告)日：2014-02-18
申请号：US12977460
申请日：2010-12-23
申请人： Jean Brun , Dominique Vicard
发明人： Jean Brun , Dominique Vicard
IPC分类号： H05K7/00 , H05K1/00 , H05K1/03 , H05K7/12 , H01L21/00
CPC分类号： G06K19/077 , H01L23/58 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/83 , H01L24/85 , H01L24/94 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/0401 , H01L2224/29109 , H01L2224/29116 , H01L2224/32057 , H01L2224/4899 , H01L2224/49 , H01L2224/83385 , H01L2224/83855 , H01L2224/8388 , H01L2224/85007 , H01L2224/85138 , H01L2224/85203 , H01L2225/06527 , H01L2225/06551 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , Y10T29/49169 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.
摘要翻译：用于组装具有电子芯片的线元件的方法的第一步包括将线元件布置在由第一元件和第二元件所描绘的沟槽中，第二元件由包括可塑性变形的材料的连接元件连接，步骤包括夹紧第一和第二元件以使连杆元件变形，直到线元件固定在槽中。

3. 发明授权

US08471773B2 Assembly of radiofrequency chips 有权
标题翻译：组装射频芯片
公开(公告)号：US08471773B2
公开(公告)日：2013-06-25
申请号：US12665419
申请日：2008-06-18
申请人： Dominique Vicard , Jean Brun , Benoît Lepine
发明人： Dominique Vicard , Jean Brun , Benoît Lepine
IPC分类号： H01Q1/24
CPC分类号： H01L25/50 , G06K19/07718 , G06K19/07754 , G06K19/07779 , G06K19/07786 , H01L21/6835 , H01L23/5387 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/94 , H01L25/0655 , H01L2223/6677 , H01L2224/24137 , H01L2224/45015 , H01L2224/451 , H01L2224/4519 , H01L2224/48139 , H01L2224/8585 , H01L2224/94 , H01L2924/00014 , H01L2924/14 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , Y10T29/49016 , H01L2224/85 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.
摘要翻译：本发明涉及射频发送/接收设备的制造。本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

4. 发明申请

US20110001237A1 ASSEMBLY OF A WIRE ELEMENT WITH A MICROELECTRONIC CHIP WITH A GROOVE COMPRISING AT LEAST ONE BUMP SECURING THE WIRE ELEMENT 有权
标题翻译：具有包含至少一个保护电线元件的保护栅的微电子芯片的电线元件的组装
公开(公告)号：US20110001237A1
公开(公告)日：2011-01-06
申请号：US12919512
申请日：2008-10-21
申请人： Jean Brun , Dominique Vicard , Sophie Verrun
发明人： Jean Brun , Dominique Vicard , Sophie Verrun
IPC分类号： H01L23/498
CPC分类号： H01L25/0655 , H01L21/6835 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L25/50 , H01L2223/6677 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/48 , H01L2224/78301 , H01L2224/85001 , H01L2224/85365 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T29/41 , H01L2924/20752 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.
摘要翻译：组件包括至少一个具有两个平行的主表面和侧表面的微电子芯片，至少一个侧面包括容纳具有平行于凹槽的纵向轴线的线的线元件的纵向槽。凹槽由至少两个侧壁描绘。线元件在布置在一个侧壁上的至少一个凸块与与凸起相对的凹槽的侧壁之间的夹紧区域的水平处固定到芯片。夹紧区域具有比线元件的直径更小的高度，并且沿凹槽的纵向轴线横向布置凸块的自由区域。自由区域具有与分离两个侧壁的距离相对应的高度，该高度大于线元件的直径。

5. 发明申请

US20100136746A1 METHOD FOR PRODUCING A SET OF CHIPS MECHANICALLY INTERCONNECTED BY MEANS OF A FLEXIBLE CONNECTION 有权
标题翻译：通过灵活连接机械地连接的一组夹具的制造方法
公开(公告)号：US20100136746A1
公开(公告)日：2010-06-03
申请号：US12452137
申请日：2008-06-20
申请人： Jean Brun , Bruno Mourey , Dominique Vicard
发明人： Jean Brun , Bruno Mourey , Dominique Vicard
IPC分类号： H01L21/60
CPC分类号： H01L25/50 , G06K19/07718 , G06K19/07754 , G06K19/07779 , G06K19/07786 , H01L21/6835 , H01L23/5387 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/94 , H01L25/0655 , H01L2223/6677 , H01L2224/24137 , H01L2224/45015 , H01L2224/451 , H01L2224/4519 , H01L2224/48139 , H01L2224/8585 , H01L2224/94 , H01L2924/00014 , H01L2924/14 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , Y10T29/49016 , H01L2224/85 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.
摘要翻译：该方法涉及通过柔性连接机械地互连的一组芯片的生产。集成在基板上的芯片各自包括接收区域。组合的芯片通过连接元件串联连接在接收区域中。芯片然后被释放，连接元件形成柔性连接。

6. 发明授权

US08782880B2 Apparatus for assembling chip devices on wires 有权
标题翻译：用于在芯片上组装芯片的装置
公开(公告)号：US08782880B2
公开(公告)日：2014-07-22
申请号：US13115419
申请日：2011-05-25
申请人： Dominique Vicard , Jean Brun
发明人： Dominique Vicard , Jean Brun
IPC分类号： B23P19/00 , H01R43/00 , B65B15/00 , H01L25/065
CPC分类号： B65B15/00 , H01L25/0655 , H01L2924/0002 , Y10T29/5187 , Y10T29/5193 , Y10T29/53178 , Y10T29/53213 , Y10T29/53261 , H01L2924/00
摘要： An apparatus for assembling chip devices on a wire, each chip device comprising two substantially parallel lateral walls, and a groove in one of the lateral walls for receiving said wire. The apparatus includes a pinching device having two opposing surfaces, the distance between the opposing surfaces being substantially constant and substantially equal to the distance between the two lateral walls of a chip device. A wire feeder is adapted to continuously feed the wire in contact with one of the opposing surfaces of the pinching device. A chip device feeder is adapted to drive chip devices, one at a time, between the opposing surfaces, with their grooves turned towards the wire. The pinching device may comprise two cylindrical rollers having rotation axes substantially perpendicular to the wire, the opposing surfaces being formed by respective surfaces of the rollers.
摘要翻译：一种用于在线上组装芯片器件的装置，每个芯片器件包括两个基本上平行的侧壁，以及用于接收所述线的一个侧壁中的凹槽。该装置包括具有两个相对表面的夹持装置，相对表面之间的距离基本上恒定并且基本上等于芯片装置的两个侧壁之间的距离。供线器适于连续地将电线与夹持装置的相对表面中的一个接触。芯片装置馈送器适于在相对的表面之间一次一个地驱动芯片装置，并且它们的槽朝向导线。夹持装置可以包括具有基本上垂直于线的旋转轴的两个圆柱形辊，相对的表面由辊的相应表面形成。

7. 发明授权

US08611101B2 Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly 有权
标题翻译：具有带有线材形式的线元件的凹槽的微电子芯片的组装，以及组装方法
公开(公告)号：US08611101B2
公开(公告)日：2013-12-17
申请号：US13124762
申请日：2009-10-21
申请人： Jean Brun , Sophie Verrun , Dominique Vicard
发明人： Jean Brun , Sophie Verrun , Dominique Vicard
IPC分类号： H01R9/00 , H01R43/00
CPC分类号： H01L25/0657 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/85 , H01L25/065 , H01L25/50 , H01L2224/32014 , H01L2224/45015 , H01L2224/45028 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48699 , H01L2224/49111 , H01L2224/858 , H01L2225/06527 , H01L2225/06555 , H01L2225/06575 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , Y10T29/49194 , H01L2924/00 , H01L2924/01049 , H01L2924/01006 , H01L2224/85399 , H01L2224/05599
摘要： Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand.
摘要翻译：组装具有线元件的至少一个微电子芯片，该芯片包括用于嵌入线元件的凹槽。线元件是具有基本上平行于凹槽的轴线的纵向轴线的线，包括至少两个被绝缘体覆盖的导电线。该芯片包括凹槽中的至少一个导电凸块，该凸起与该线束的单根导电线的剥离区域电接触。

8. 发明申请

US20100245182A1 Assembly of Radiofrequency Chips 有权
标题翻译：射频芯片组装
公开(公告)号：US20100245182A1
公开(公告)日：2010-09-30
申请号：US12665419
申请日：2008-06-18
申请人： Dominique Vicard , Jean Brun , Benoit Lepine
发明人： Dominique Vicard , Jean Brun , Benoit Lepine
IPC分类号： H01Q1/24 , H01L21/98
CPC分类号： H01L25/50 , G06K19/07718 , G06K19/07754 , G06K19/07779 , G06K19/07786 , H01L21/6835 , H01L23/5387 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/94 , H01L25/0655 , H01L2223/6677 , H01L2224/24137 , H01L2224/45015 , H01L2224/451 , H01L2224/4519 , H01L2224/48139 , H01L2224/8585 , H01L2224/94 , H01L2924/00014 , H01L2924/14 , H01L2924/19042 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/2283 , Y10T29/49016 , H01L2224/85 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.
摘要翻译：本发明涉及射频发送/接收设备的制造。本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

9. 发明授权

US09093289B2 Method for assembling at least one chip using a fabric, and fabric including a chip device 有权
标题翻译：使用织物组装至少一个芯片的方法，以及包括芯片装置的织物
公开(公告)号：US09093289B2
公开(公告)日：2015-07-28
申请号：US13521589
申请日：2011-02-02
申请人： Dominique Vicard , Jean Brun
发明人： Dominique Vicard , Jean Brun
IPC分类号： H05K7/06 , F21V21/00 , H05K13/00 , H01L29/06 , D03D1/00 , D03D9/00 , D03D15/00 , H01L23/00 , H01L25/065 , H01L25/00
CPC分类号： H01L29/0657 , D03D1/0088 , D03D9/00 , D03D15/00 , D10B2401/16 , D10B2401/18 , D10B2501/00 , H01L24/48 , H01L24/49 , H01L24/72 , H01L25/0655 , H01L25/50 , H01L2224/4807 , H01L2224/49 , H01L2224/858 , H01L2924/00014 , H01L2924/01014 , H01L2924/01029 , H01L2924/01058 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , Y10T29/49002 , H01L2924/00 , H01L2224/45099
摘要： A method for assembling a device on two substantially parallel taut threads. The device includes an electronic chip and two substantially parallel grooves open on opposite sides of the device. The distance separating the grooves corresponds to the distance separating the threads. The device presents a penetrating shape along an axis perpendicular to the plane of the grooves, having a base at the level of the grooves and an apex of smaller size than the distance separating the threads. The method includes the steps consisting in placing the apex of the device between the two threads; in moving the device between the two threads resulting in the threads being separated from one another by the penetrating shape of the device; and in continuing movement of the device until the threads penetrate into the grooves reverting to their initial separation distance.
摘要翻译：一种用于在两个基本上平行的拉紧螺纹上组装装置的方法。该装置包括电子芯片和在装置的相对侧上开放的两个基本上平行的凹槽。分离槽的距离对应于分开螺纹的距离。该装置沿着垂直于凹槽平面的轴线具有穿透形状，在凹槽的水平处具有基部，并且具有比分开螺纹的距离更小的顶点。该方法包括将装置的顶点放置在两个螺纹之间的步骤; 在所述两个螺纹之间移动所述装置，导致所述螺纹通过所述装置的穿透形状彼此分离; 并且在设备的持续运动中，直到螺纹穿透到凹槽中，从而恢复到其初始间隔距离。

10. 发明授权

US08723312B2 Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element 有权
标题翻译：具有微电子芯片的线元件的组装，所述微电子芯片具有凹槽，所述凹槽包括固定所述线元件的至少一个凸块
公开(公告)号：US08723312B2
公开(公告)日：2014-05-13
申请号：US12919512
申请日：2008-10-21
申请人： Jean Brun , Dominique Vicard , Sophie Verrun
发明人： Jean Brun , Dominique Vicard , Sophie Verrun
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02
CPC分类号： H01L25/0655 , H01L21/6835 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L25/50 , H01L2223/6677 , H01L2224/45015 , H01L2224/451 , H01L2224/45139 , H01L2224/45144 , H01L2224/48 , H01L2224/78301 , H01L2224/85001 , H01L2224/85365 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , Y10T29/41 , H01L2924/20752 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.
摘要翻译：组件包括至少一个具有两个平行的主表面和侧表面的微电子芯片，至少一个侧面包括容纳具有平行于凹槽的纵向轴线的线的线元件的纵向槽。凹槽由至少两个侧壁描绘。线元件在布置在一个侧壁上的至少一个凸块与与凸起相对的凹槽的侧壁之间的夹紧区域的水平处固定到芯片。夹紧区域具有比线元件的直径更小的高度，并且沿凹槽的纵向轴线横向布置凸块的自由区域。自由区域具有与分离两个侧壁的距离相对应的高度，该高度大于线元件的直径。

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