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1. 发明授权

US07286436B2 High-density memory module utilizing low-density memory components 有权
标题翻译：高密度存储器模块利用低密度存储器组件
公开(公告)号：US07286436B2
公开(公告)日：2007-10-23
申请号：US11075395
申请日：2005-03-07
申请人： Jayesh R. Bhakta , Jeffrey Solomon , William M. Gervasi
发明人： Jayesh R. Bhakta , Jeffrey Solomon , William M. Gervasi
IPC分类号： G11C8/00
CPC分类号： G11C5/066 , G11C5/04 , G11C7/1048 , G11C2207/105
摘要： A memory module comprises a plurality of memory components. Each memory component has a first bit width. The plurality of memory components are configured as one or more pairs of memory components. Each pair of memory components simulates a single virtual memory component having a second bit width which is twice the first bit width.
摘要翻译：存储器模块包括多个存储器组件。每个存储器组件具有第一位宽度。多个存储器组件被配置为一对或多对存储器组件。每对存储器组件模拟具有第二位宽度的第二位宽度的两倍的单个虚拟存储器组件。

2. 发明授权

US07630202B2 High density module having at least two substrates and at least one thermally conductive layer therebetween 有权
标题翻译：高密度模块具有至少两个基板和其间的至少一个导热层
公开(公告)号：US07630202B2
公开(公告)日：2009-12-08
申请号：US12052678
申请日：2008-03-20
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and a first set of the plurality of electrical contacts.
摘要翻译：模块可电连接到计算机系统。模块包括可电连接到计算机系统的多个电触点。该模块还包括具有安装在第一表面上的第一表面和第一多个部件的第一基板。第一组多个组件与电触点电连通。该模块还包括具有安装在第二表面上的第二表面和第二多个部件的第二基板。第二组件与电触点电连通。第二基板的第二表面面向第一基板的第一表面。模块还包括位于第一多个部件和第二多个部件之间的至少一个导热层。所述至少一个导热层与所述第一多个部件，所述第二多个部件和所述多个电触点的第一组热连通。

3. 发明申请

US20080316712A1 HIGH DENSITY MODULE HAVING AT LEAST TWO SUBSTRATES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN 有权
标题翻译：至少两个基板和至少一个导热层的高密度模块
公开(公告)号：US20080316712A1
公开(公告)日：2008-12-25
申请号：US12052678
申请日：2008-03-20
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and a first set of the plurality of electrical contacts.
摘要翻译：模块可电连接到计算机系统。模块包括可电连接到计算机系统的多个电触点。该模块还包括具有安装在第一表面上的第一表面和第一多个部件的第一基板。第一组多个组件与电触点电连通。该模块还包括具有安装在第二表面上的第二表面和第二多个部件的第二基板。第二组件与电触点电连通。第二基板的第二表面面向第一基板的第一表面。模块还包括位于第一多个部件和第二多个部件之间的至少一个导热层。所述至少一个导热层与所述第一多个部件，所述第二多个部件和所述多个电触点的第一组热连通。

4. 发明授权

US07254036B2 High density memory module using stacked printed circuit boards 有权
标题翻译：使用堆叠印刷电路板的高密度存储模块
公开(公告)号：US07254036B2
公开(公告)日：2007-08-07
申请号：US11101155
申请日：2005-04-07
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a frame having an edge connector with a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the frame. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is electrically coupled to the electrical contacts of the edge connector. The module further includes a second printed circuit board coupled to the frame. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is electrically coupled to the electrical contacts of the edge connector. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is thermally coupled to the first plurality of components, to the second plurality of components, and to the electrical contacts of the edge connector.
摘要翻译：模块可电连接到计算机系统。该模块包括具有边缘连接器的框架，该边缘连接器具有可与计算机系统电连接的多个电触点。模块还包括耦合到框架的第一印刷电路板。第一印刷电路板具有安装在第一表面上的第一表面和第一多个部件。第一多个部件电耦合到边缘连接器的电触头。模块还包括耦合到框架的第二印刷电路板。第二印刷电路板具有安装在第二表面上的第二表面和第二多个部件。第二多个部件电耦合到边缘连接器的电触头。第二印刷电路板的第二表面面向第一印刷电路板的第一表面。模块还包括位于第一多个部件和第二多个部件之间的至少一个导热层。所述至少一个导热层热耦合到所述第一多个部件，所述第二多个部件以及所述边缘连接器的所述电触头。

5. 发明授权

US08345427B2 Module having at least two surfaces and at least one thermally conductive layer therebetween 有权
标题翻译：模块具有至少两个表面和其间的至少一个导热层
公开(公告)号：US08345427B2
公开(公告)日：2013-01-01
申请号：US12939915
申请日：2010-11-04
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.
摘要翻译：模块可电连接到计算机系统。模块包括耦合到第一表面的第一表面和第一多个电路封装。该模块还包括耦合到第二表面的第二表面和第二多个电路封装。第二表面面向第一表面。模块还包括位于第一表面和第二表面之间的至少一个热导管。所述至少一个热导管与所述第一多个电路封装件和所述第二多个电路封装体热连通。

6. 发明申请

US20110110047A1 MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN 有权
标题翻译：具有至少两个表面和至少一个导热层的模块
公开(公告)号：US20110110047A1
公开(公告)日：2011-05-12
申请号：US12939915
申请日：2010-11-04
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.
摘要翻译：模块可电连接到计算机系统。模块包括耦合到第一表面的第一表面和第一多个电路封装。该模块还包括耦合到第二表面的第二表面和第二多个电路封装。第二表面面向第一表面。模块还包括位于第一表面和第二表面之间的至少一个热导管。所述至少一个热导管与所述第一多个电路封装件和所述第二多个电路封装体热连通。

7. 发明申请

US20100110642A1 MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN 有权
标题翻译：具有至少两个表面和至少一个导热层的模块
公开(公告)号：US20100110642A1
公开(公告)日：2010-05-06
申请号：US12606136
申请日：2009-10-26
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20 , F28F13/00 , H01L23/34
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.
摘要翻译：模块可电连接到计算机系统。模块包括可电连接到计算机系统的多个电触点。模块还包括耦合到第一表面的第一表面和第一多个电路。第一组多个电路与电触点电连通。模块还包括耦合到第二表面的第二表面和第二多个电路。第二组电路与电触点电连通。第二表面面向第一表面。模块还包括位于第一表面和第二表面之间的至少一个导热层。所述至少一个导热层与所述第一多个电路，所述第二多个电路和所述多个电触头的第一组热连通。

8. 发明授权

US07375970B2 High density memory module using stacked printed circuit boards 有权
标题翻译：使用堆叠印刷电路板的高密度存储模块
公开(公告)号：US07375970B2
公开(公告)日：2008-05-20
申请号：US11775125
申请日：2007-07-09
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and the electrical contacts.
摘要翻译：模块可电连接到计算机系统。模块包括至少一个多层结构，其具有可电连接到计算机系统的多个电触点。该模块还包括耦合到至少一个多层结构的第一印刷电路板。第一印刷电路板具有安装在第一表面上的第一表面和第一多个部件。第一组多个组件与电触点电连通。该模块还包括耦合到至少一个多层结构的第二印刷电路板。第二印刷电路板具有安装在第二表面上的第二表面和第二多个部件。第二组件与电触点电连通。第二印刷电路板的第二表面面向第一印刷电路板的第一表面。模块还包括位于第一多个部件和第二多个部件之间的至少一个导热层。所述至少一个导热层与所述第一多个部件，所述第二多个部件和所述电触点热连通。

9. 发明授权

US07839645B2 Module having at least two surfaces and at least one thermally conductive layer therebetween 有权
标题翻译：模块具有至少两个表面和其间的至少一个导热层
公开(公告)号：US07839645B2
公开(公告)日：2010-11-23
申请号：US12606136
申请日：2009-10-26
申请人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
发明人： Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
IPC分类号： H05K7/20
CPC分类号： H05K1/0203 , H05K1/144 , H05K2201/10189 , H05K2201/1056 , H05K2201/2018 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913
摘要： A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.
摘要翻译：模块可电连接到计算机系统。模块包括可电连接到计算机系统的多个电触点。模块还包括耦合到第一表面的第一表面和第一多个电路。第一组多个电路与电触点电连通。模块还包括耦合到第二表面的第二表面和第二多个电路。第二组电路与电触点电连通。第二表面面向第一表面。模块还包括位于第一表面和第二表面之间的至少一个导热层。所述至少一个导热层与所述第一多个电路，所述第二多个电路和所述多个电触头的第一组热连通。

10. 发明授权

US08065475B2 Registered dual in-line memory module having an extended register feature set 有权
标题翻译：具有扩展寄存器特征集的注册双列直插式存储器模块
公开(公告)号：US08065475B2
公开(公告)日：2011-11-22
申请号：US11259539
申请日：2005-10-25
申请人： William M. Gervasi
发明人： William M. Gervasi
IPC分类号： G06F12/00
CPC分类号： G11C5/00
摘要： A registered dual in-line memory module is configured with multiple random access memory chips and a DRAM register configured to receive address and control signals from a memory controller. The DRAM register distributes the address and control signals to the random access memory chips, thereby providing the memory controller access to the chips. The module further includes a control register configured to store control bits for setting operating modes of the registered dual in-line memory module. The control bits are software programmable using signals received from the memory controller.
摘要翻译：配置有多个随机存取存储器芯片和配置成从存储器控制器接收地址和控制信号的DRAM寄存器的已配准双列直插存储器模块。 DRAM寄存器将地址和控制信号分配给随机存取存储器芯片，从而为存储器控制器提供对芯片的访问。该模块还包括控制寄存器，该控制寄存器被配置为存储用于设置所登记的双列直插存储器模块的操作模式的控制位。控制位可使用从存储器控制器接收的信号进行软件编程。

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