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1. 发明授权

US07621134B2 Air re-cool for electronic equipment 有权
标题翻译：空气再冷却电子设备
公开(公告)号：US07621134B2
公开(公告)日：2009-11-24
申请号：US11530284
申请日：2006-09-08
申请人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
发明人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： A method for selectively cooling one or more heat-generating electronic components in an enclosure. Air is passed through an enclosure that houses one or more heat-generating components. Heated air is separated into at least first and second parallel airstreams within the enclosure. The first airstream is passed through a first heat exchanger in thermal contact with a first side of a thermoelectric cooling module. The second airstream is passed through a second heat exchanger in thermal contact with a second side of the thermoelectric cooling module. A voltage is applied to the thermoelectric cooling module to cool the first side and heat the second side of the thermoelectric cooling module. A temperature at a location in the enclosure in sensed and the voltage applied to the thermoelectric cooling module is varied in response to the sensed temperature.
摘要翻译：一种用于选择性地冷却外壳中的一个或多个发热电子部件的方法。空气通过容纳一个或多个发热部件的外壳。加热空气在外壳内分成至少第一和第二平行气流。第一气流通过与热电冷却模块的第一侧热接触的第一热交换器。第二气流通过与热电冷却模块的第二侧热接触的第二热交换器。电压被施加到热电冷却模块以冷却第一侧并加热热电冷却模块的第二侧。感测到的外壳中的位置处的温度和施加到热电冷却模块的电压响应于感测到的温度而变化。

2. 发明申请

US20080271464A1 AIR RE-COOL FOR ELECTRONIC EQUIPMENT 有权
标题翻译：电子设备的空气冷却器
公开(公告)号：US20080271464A1
公开(公告)日：2008-11-06
申请号：US12173351
申请日：2008-07-15
申请人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
发明人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译：实施例包括用于选择性地冷却外壳中的发热电子部件的系统和方法。根据一个实施例，外壳容纳多个发热电子部件。空气进入前部的外壳，并在后部排空。在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。第一气流由具有热电冷却模块的冷却系统再次冷却。热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。

3. 发明授权

US07134288B2 System, method, and apparatus for providing a thermal bypass in electronic equipment 有权
标题翻译：用于在电子设备中提供热旁路的系统，方法和装置
公开(公告)号：US07134288B2
公开(公告)日：2006-11-14
申请号：US10842284
申请日：2004-05-10
申请人： Martin Joseph Crippen , Jason Aaron Matteson , William Joseph Piazza
发明人： Martin Joseph Crippen , Jason Aaron Matteson , William Joseph Piazza
IPC分类号： F25B21/02
CPC分类号： H05K7/20 , F25B21/02 , F25B2321/0251
摘要： A system enclosure uses two heat exchangers and a thermoelectric cooling module to manage heat within the system. An airflow enters the system and is heated by server blades. Portions of the airflow split and travel to various portions of the system enclosure. Some heat is removed from the airflow by passing through the first heat exchanger before circulating around downstream subsystems. The first heat exchanger contacts the cold side of a TEC module, to reduce the temperature of that airflow. The air then enters the network switch module or other subsystem where it is further heated. Thereafter, the second heat exchanger ‘bypasses’ those components by reinserting the upstream heat back into the downstream airflow. The second heat exchanger contacts the hot side of the TEC module. The mixture of all heated air is then expelled from the system enclosure.
摘要翻译：系统机箱使用两个热交换器和热电冷却模块来管理系统内的热量。气流进入系统并由服务器刀片加热。气流的一部分分流并移动到系统外壳的各个部分。在下游子系统周围循环之前，通过第一热交换器从气流中除去一些热量。第一个热交换器接触TEC模块的冷端，以降低气流的温度。空气然后进入网络交换机模块或进一步加热的其他子系统。此后，第二热交换器通过将上游热量重新插入下游气流中来绕过这些部件。第二个热交换器接触TEC模块的热侧。然后将所有加热空气的混合物从系统外壳排出。

4. 发明授权

US06889908B2 Thermal analysis in a data processing system 失效
标题翻译：数据处理系统中的热分析
公开(公告)号：US06889908B2
公开(公告)日：2005-05-10
申请号：US10610303
申请日：2003-06-30
申请人： Martin Joseph Crippen , Jason Aaron Matteson , William Joseph Piazza
发明人： Martin Joseph Crippen , Jason Aaron Matteson , William Joseph Piazza
IPC分类号： F24F11/00 , G05B23/02 , G06F1/20 , G06F11/30 , F24F7/00
CPC分类号： G06F11/3006 , F24F11/30 , F24F11/32 , F24F11/62 , G05B23/0235 , G06F1/206 , G06F11/3051 , G06F11/3058 , H05K7/20727 , H05K7/20836
摘要： Methods, systems, and media for thermal analysis are disclosed. Embodiments of the invention receive temperatures associated with elements of a system. The temperatures received are dependant upon airflow and heating patterns of the elements. Differences between the temperatures received and expected temperatures are detected. Potential airflow and heating patterns associated with a thermal problem are then determined, the potential airflow and heating patterns being substantially consistent with the temperatures received, to identify a root cause of the thermal problem as a probable source of the differences. More specifically, embodiments collect temperature readings from temperature sensors within an enclosure of the system; identify and upward temperature gradient or temperature that exceeds a threshold temperature; and select a failure scenario associated with a root cause of a thermal problem that is similar to the thermal problem described by the temperature readings collected.
摘要翻译：公开了用于热分析的方法，系统和介质。本发明的实施例接收与系统的元件相关联的温度。接收的温度取决于元件的气流和加热模式。检测到接收到的温度和预期温度之间的差异。然后确定与热问题相关联的潜在气流和加热模式，潜在气流和加热模式与接收的温度基本一致，以将热问题的根本原因识别为差异的可能来源。更具体地，实施例从系统的外壳内的温度传感器收集温度读数; 识别和向上的温度梯度或温度超过阈值温度; 并选择与热问题的根本原因相关联的故障情景，其类似于所收集的温度读数描述的热问题。

5. 发明授权

US07735326B2 Air re-cool for electronic equipment 有权
标题翻译：空气再冷却电子设备
公开(公告)号：US07735326B2
公开(公告)日：2010-06-15
申请号：US12173351
申请日：2008-07-15
申请人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
发明人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译：实施例包括用于选择性地冷却外壳中的发热电子部件的系统和方法。根据一个实施例，外壳容纳多个发热电子部件。空气进入前部的外壳，并在后部排空。在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。第一气流由具有热电冷却模块的冷却系统再次冷却。热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。

6. 发明申请

US20090296342A1 Reducing Maximum Power Consumption Using Environmental Control Settings 有权
标题翻译：使用环境控制设置降低最大功耗
公开(公告)号：US20090296342A1
公开(公告)日：2009-12-03
申请号：US12130443
申请日：2008-05-30
申请人： Jason Aaron Matteson , William Joseph Piazza
发明人： Jason Aaron Matteson , William Joseph Piazza
IPC分类号： G06F1/20
CPC分类号： G06F1/206 , H05K7/20836 , Y02D10/16
摘要： A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.
摘要翻译：风扇控制器使风扇组件以可变气流速度使空气流过计算机系统以冷却计算机系统。检测到到计算机系统的环境空气温度，并且控制器在具有上限的环境温度范围内改变作为环境温度的函数的气流速率。响应于来自用户或软件对象的电子输入，可以从风扇速度控制算法使用的定义的环境温度范围的上限选择性地减小默认值。相应地，控制器将空气流量限制为对应于减小的上限的减小的值。减少环境温度上限导致的绞合功率的减少可能被重新分配，例如数据中心中的其他机架。

7. 发明授权

US08140195B2 Reducing maximum power consumption using environmental control settings 有权
标题翻译：使用环境控制设置降低最大功耗
公开(公告)号：US08140195B2
公开(公告)日：2012-03-20
申请号：US12130443
申请日：2008-05-30
申请人： Jason Aaron Matteson , William Joseph Piazza
发明人： Jason Aaron Matteson , William Joseph Piazza
IPC分类号： G05D23/00 , G06F1/20 , H05K7/20 , H02B1/01 , H02B1/00
CPC分类号： G06F1/206 , H05K7/20836 , Y02D10/16
摘要： A fan controller causes a fan assembly to flow air through a computer system at a variable airflow rate to cool the computer system. The ambient air temperature to the computer system is detected, and the controller varies the airflow rate as a function of the ambient temperature within an ambient temperature range having an upper limit. The upper limit on the defined ambient temperature range that is used by a fan speed control algorithm may be selectively reduced from a default value in response to electronic input, such from a user or a software object. Correspondingly, the controller limits the air flow rate to a reduced value corresponding to the reduced upper limit. The reduction in stranded power that results from reducing the upper limit on the ambient temperature may be re-allocated, such as to other racks in the data center.
摘要翻译：风扇控制器使风扇组件以可变气流速度使空气流过计算机系统以冷却计算机系统。检测到到计算机系统的环境空气温度，并且控制器在具有上限的环境温度范围内改变作为环境温度的函数的气流速率。响应于来自用户或软件对象的电子输入，可以从风扇速度控制算法使用的定义的环境温度范围的上限选择性地减小默认值。相应地，控制器将空气流量限制为对应于减小的上限的减小的值。减少环境温度上限导致的绞合功率的减少可能被重新分配，例如数据中心中的其他机架。

8. 发明申请

US20080060363A1 AIR RE-COOL FOR ELECTRONIC EQUIPMENT 有权
标题翻译：电子设备的空气冷却器
公开(公告)号：US20080060363A1
公开(公告)日：2008-03-13
申请号：US11530284
申请日：2006-09-08
申请人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
发明人： Martin Joseph Crippen , Albert Vincent Makley , Jason Aaron Matteson , William Joseph Piazza
IPC分类号： F25B21/02 , F25D23/12
CPC分类号： F25B21/02 , F25B2321/0212 , F25B2700/21 , H05K7/20754
摘要： Systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.
摘要翻译：用于选择性地冷却外壳中的发热电子部件的系统和方法。根据一个实施例，外壳容纳多个发热电子部件。空气进入前部的外壳，并在后部排空。在通过一个或多个上游部件之后，空气在外壳内至少分散到第一和第二气流中。第一气流由具有热电冷却模块的冷却系统再次冷却。热电冷却模块被构造成使得第一侧被冷却，并且第二侧被响应于所施加的电压而被加热。电压调节器可以响应于在机架系统内感测到的一个或多个温度来控制电压。

9. 发明授权

US07385816B1 Dual impeller push-pull axial fan heat sink 有权
公开(公告)号：US07385816B1
公开(公告)日：2008-06-10
申请号：US11940126
申请日：2007-11-14
申请人： Jimmy Grant Foster, Sr. , Michael Sean June , Albert Vincent Makley , Jason Aaron Matteson
发明人： Jimmy Grant Foster, Sr. , Michael Sean June , Albert Vincent Makley , Jason Aaron Matteson
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

10. 发明授权

US07359196B2 Dual impeller push-pull axial fan heat sink 有权
公开(公告)号：US07359196B2
公开(公告)日：2008-04-15
申请号：US11770991
申请日：2007-06-29
申请人： Jimmy Grant Foster, Sr. , Michael Sean June , Albert Vincent Makley , Jason Aaron Matteson
发明人： Jimmy Grant Foster, Sr. , Michael Sean June , Albert Vincent Makley , Jason Aaron Matteson
IPC分类号： H05K7/20 , F04D29/44
CPC分类号： H01L23/467 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

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