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1. 发明授权

US07606050B2 Compact module system and method 有权
标题翻译：紧凑型模块系统和方法
公开(公告)号：US07606050B2
公开(公告)日：2009-10-20
申请号：US11187269
申请日：2005-07-22
申请人： James W. Cady , James Douglas Wehrly, Jr. , Paul Goodwin
发明人： James W. Cady , James Douglas Wehrly, Jr. , Paul Goodwin
IPC分类号： H05K7/00
CPC分类号： H05K1/189 , H05K2201/056 , H05K2201/10159 , H05K2201/10189
摘要： A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.
摘要翻译：柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置为机械地适应应用环境。

2. 发明授权

US07737549B2 Circuit module with thermal casing systems 失效
标题翻译：具有热套管系统的电路模块
公开(公告)号：US07737549B2
公开(公告)日：2010-06-15
申请号：US12263060
申请日：2008-10-31
申请人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
IPC分类号： H01L23/34 , H05K7/20 , H01L21/00
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs), and contacts are distributed along the flexible circuitry to provide connection to an application environment. The flexible circuitry is disposed about a rigid substrate, placing the ICs on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate is preferably devised from thermally-conductive materials and one or more thermal spreaders are in thermal contact with at least some of the ICs. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路采用集成电路（IC），并且触点沿柔性电路分布，以提供与应用环境的连接。柔性电路围绕刚性衬底设置，将IC放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。衬底优选地由导热材料设计，并且一个或多个热扩散器与至少一些IC热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

3. 发明授权

US07626259B2 Heat sink for a high capacity thin module system 有权
标题翻译：散热器用于高容量薄模块系统
公开(公告)号：US07626259B2
公开(公告)日：2009-12-01
申请号：US12258189
申请日：2008-10-24
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

4. 发明授权

US07446410B2 Circuit module with thermal casing systems 有权
标题翻译：具有热套管系统的电路模块
公开(公告)号：US07446410B2
公开(公告)日：2008-11-04
申请号：US11283355
申请日：2005-11-18
申请人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , James Wilder , Mark Wolfe , Paul Goodwin
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧上，在衬底的一侧或两侧上具有一层或多层集成电路。衬底形式优选地由导热材料设计，并且一个或多个热扩散器设置成与模块的组成集成电路中的至少一些热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的扩大表面。

5. 发明授权

US07616452B2 Flex circuit constructions for high capacity circuit module systems and methods 有权
标题翻译：用于高容量电路模块系统和方法的Flex电路结构
公开(公告)号：US07616452B2
公开(公告)日：2009-11-10
申请号：US11331969
申请日：2006-01-13
申请人： James Douglas Wehrly, Jr. , Paul Goodwin , Russell Rapport
发明人： James Douglas Wehrly, Jr. , Paul Goodwin , Russell Rapport
IPC分类号： H05K1/11
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.
摘要翻译：所提供的电路模块采用装有集成电路（IC）的灵活电路。柔性电路围绕刚性衬底设置。沿柔性电路分布的触点提供模块与应用环境之间的连接。柔性电路的应变消除部分优选地比柔性电路的布置集成电路的部分更少的层，并且还可以表现出比装有集成电路的柔性电路的部分更多的灵活性。底物形式优选地由导热材料设计。

6. 发明授权

US07459784B2 High capacity thin module system 有权
公开(公告)号：US07459784B2
公开(公告)日：2008-12-02
申请号：US11961477
申请日：2007-12-20
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

7. 发明授权

US07289327B2 Active cooling methods and apparatus for modules 失效
标题翻译：主动冷却方式和模块装置
公开(公告)号：US07289327B2
公开(公告)日：2007-10-30
申请号：US11364489
申请日：2006-02-27
申请人： Paul Goodwin , James Douglas Wehrly, Jr.
发明人： Paul Goodwin , James Douglas Wehrly, Jr.
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： G11C5/00 , G06F1/20 , G11C5/143 , H01L23/427 , H01L23/473 , H01L2224/16 , H01L2224/73253
摘要： A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling component. The integrated cooling component reduces thermal variation and cools the circuit module. Flex circuitry populated with a plurality of ICs and exhibiting a connective facility that comprises plural contacts for use with an edge connector is wrapped about the edge of the thermally-conductive substrate. Heat from the plurality of ICs is thermally-conducted by the thermally-conductive substrate to the integrated cooling component.
摘要翻译：一种电路模块，包括用于减少热变化并冷却电路模块的系统。在优选实施例中，模块包括具有第一和第二横向侧面，边缘和集成冷却部件的导热刚性基板。集成冷却组件减少热变化并冷却电路模块。填充有多个IC并且展现包括用于边缘连接器的多个触点的连接设备的柔性电路围绕导热基板的边缘缠绕。来自多个IC的热量被导热基板热传导到集成冷却部件。

8. 发明授权

US07443023B2 High capacity thin module system 有权
标题翻译：大容量薄模块系统
公开(公告)号：US07443023B2
公开(公告)日：2008-10-28
申请号：US11231418
申请日：2005-09-21
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H01L23/34 , H01L21/00 , H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

9. 发明授权

US07542297B2 Optimized mounting area circuit module system and method 有权
标题翻译：优化安装区电路模块系统及方法
公开(公告)号：US07542297B2
公开(公告)日：2009-06-02
申请号：US11255061
申请日：2005-10-19
申请人： James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
发明人： James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
IPC分类号： H05K1/00
CPC分类号： H05K1/189 , H01L25/0652 , H01L25/105 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572 , H01L2924/00
摘要： A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。刚性基板被配置为在其上布置有人造弹性体的一侧上提供空间，而在一些实施例中，热管理或冷却结构布置在模块的一侧以减轻模块中的热积聚。

10. 发明申请

US20090046431A1 High Capacity Thin Module System 有权
标题翻译：大容量薄模块系统
公开(公告)号：US20090046431A1
公开(公告)日：2009-02-19
申请号：US12258189
申请日：2008-10-24
申请人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
发明人： James Douglas Wehrly, Jr. , James Wilder , Paul Goodwin , Mark Wolfe
IPC分类号： H05K7/20
CPC分类号： H05K1/189 , H05K1/0203 , H05K1/11 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
摘要翻译：灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。沿柔性电路分布的触点提供模块与应用环境之间的连接。电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

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