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1. 发明授权

US07014538B2 Article for polishing semiconductor substrates 失效
标题翻译：用于抛光半导体衬底的文章
公开(公告)号：US07014538B2
公开(公告)日：2006-03-21
申请号：US10382079
申请日：2003-03-05
申请人： James V. Tietz , Shijian Li , Manoocher Birang , John M. White , Sandra L. Rosenberg, legal representative , Marty Scales , Ramin Emami
发明人： Lawrence M. Rosenberg, deceased
IPC分类号： B24D11/00
CPC分类号： B24B37/205 , B24B53/017 , B24D3/00 , B24D3/28 , B24D3/34
摘要： A method and apparatus for using fixed abrasive polishing pads that contain posts for chemical mechanical polishing (CMP). The posts have different shapes, different sizes, different heights, different materials, different distribution of abrasive particles and different process chemicals. This invention also includes preconditioning fixed abrasive articles comprising a plurality of posts so that the posts have equal heights above the backing to achieve a uniform texture. This invention relates to improvements with respect to in situ rate measurement (ISRM) devices. The invention resides in providing a mechanical means, such as a notch, to determine when approaching the end of the abrasive web roll. The invention resides in coding the web throughout its length to enable determining the location of different portions of the web. This invention resides in providing perforations in the sides or end of the web for improved handling.
摘要翻译：一种用于使用固定研磨抛光垫的方法和装置，其包含用于化学机械抛光（CMP）的柱。柱具有不同的形状，不同的尺寸，不同的高度，不同的材料，不同的磨料颗粒分布和不同的工艺化学品。本发明还包括预处理包括多个柱的固定磨料制品，使得柱在背衬上方具有相等的高度以实现均匀的质地。本发明涉及对现场速率测量（ISRM）装置的改进。本发明在于提供一种机械装置，例如凹口，以确定何时接近研磨织物卷筒的端部。本发明在于对其整个长度进行编码以确定网的不同部分的位置。本发明在于在腹板的侧面或端部提供穿孔以改善处理。

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