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    • 1. 发明授权
    • Compact laser package with integrated temperature control
    • 紧凑型激光封装,集成温度控制
    • US07092418B2
    • 2006-08-15
    • US11011807
    • 2004-12-14
    • James StewartJan LipsonAndreas Weber
    • James StewartJan LipsonAndreas Weber
    • H01S3/04
    • H01S5/02212H01L2224/48091H01L2924/3011H01S5/02415H01S5/183H01L2924/00014H01L2924/00
    • This disclosure concerns optical packages such as may be used in optical transceivers and transmitters. In one example, an optical package includes a header assembly having a base portion to which is attached a header structure that is split into first and second portions that are separated from each other by a space. The header structure further includes one or more electrical leads extending through the base portion and into one of the first and second portions of the header structure. An active temperature control device is included in the optical package and resides in the space between the first and second portions of the header structure. Finally, an optical element, such as a laser, is provided that is arranged for thermal communication with the active temperature control device so that operation of the optical element can be controlled by way of the active temperature control device.
    • 本公开涉及诸如可以用在光收发器和发射机中的光学封装。 在一个示例中,光学封装包括具有基部的插座组件,附接有头部结构,该头部结构被分割成彼此分开的空间的第一和第二部分。 插头结构还包括延伸穿过基座部分并且插入插头结构的第一和第二部分之一的一个或多个电引线。 主动温度控制装置包括在光学封装中并且位于头部结构的第一和第二部分之间的空间中。 最后,提供了诸如激光器的光学元件,其被布置成与主动温度控制装置进行热连通,使得可以通过主动温度控制装置来控制光学元件的操作。
    • 2. 发明申请
    • Compact laser package with integrated temperature control
    • 紧凑型激光封装,集成温度控制
    • US20050100064A1
    • 2005-05-12
    • US11011807
    • 2004-12-14
    • James StewartJan LipsonAndreas Weber
    • James StewartJan LipsonAndreas Weber
    • H01L23/38H01L23/36H01S5/022H01S5/024H01S5/183H01S3/04
    • H01S5/02212H01L2224/48091H01L2924/3011H01S5/02415H01S5/183H01L2924/00014H01L2924/00
    • This disclosure concerns optical packages such as may be used in optical transceivers and transmitters. In one example, an optical package includes a header assembly having a base portion to which is attached a header structure that is split into first and second portions that are separated from each other by a space. The header structure further includes one or more electrical leads extending through the base portion and into one of the first and second portions of the header structure. An active temperature control device is included in the optical package and resides in the space between the first and second portions of the header structure. Finally, an optical element, such as a laser, is provided that is arranged for thermal communication with the active temperature control device so that operation of the optical element can be controlled by way of the active temperature control device.
    • 本公开涉及诸如可以用在光收发器和发射机中的光学封装。 在一个示例中,光学封装包括具有基部的插座组件,附接有头部结构,该头部结构被分割成彼此分开的空间的第一和第二部分。 插头结构还包括延伸穿过基座部分并且插入插头结构的第一和第二部分之一的一个或多个电引线。 主动温度控制装置包括在光学封装中并且位于头部结构的第一和第二部分之间的空间中。 最后,提供了诸如激光器的光学元件,其被布置成与主动温度控制装置进行热连通,使得可以通过主动温度控制装置来控制光学元件的操作。
    • 4. 发明授权
    • Optoelectronic module with thermally isolated components
    • 具有隔热元件的光电模块
    • US06880983B2
    • 2005-04-19
    • US10101247
    • 2002-03-18
    • James StewartJan Lipson
    • James StewartJan Lipson
    • G02B6/42G02B6/36
    • G02B6/4292G02B6/4246G02B6/4263G02B6/4266G02B6/4271G02B6/4273
    • A temperature-controlled optoelectronic module that includes a module housing, a laser mount structure for affixing a laser package in the module housing, an optical fiber receptacle structure disposed adjacent to the laser mount structure, a thermal isolator affixed between the laser mount structure and the optical fiber receptacle structure, and a temperature controller coupled to the laser mount structure and operable to regulate temperature of the laser package is disclosed. In the absence of the thermal isolator, a “thermal short” may be created between the module housing and the laser package, substantially reducing the efficiency of the temperature controller. The presence of the thermal isolator eliminates the “thermal short,” substantially increases the effectiveness of the temperature controller and enables the miniaturization of temperature-controlled optoelectronic transceiver modules.
    • 一种温度控制的光电子模块,包括模块壳体,用于将激光器封装固定在模块外壳中的激光器安装结构,邻近激光器安装结构设置的光纤插座结构,固定在激光安装结构和 光纤插座结构以及耦合到激光安装结构并且可操作以调节激光器封装温度的温度控制器被公开。 在没有热隔离器的情况下,可能在模块外壳和激光封装之间产生“热短路”,从而大大降低了温度控制器的效率。 热隔离器的存在消除了“热短路”,大大提高了温度控制器的有效性,并实现了温度控制的光电收发器模块的小型化。