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    • 5. 发明授权
    • Nanoscale modulation doping method
    • 纳米级调制掺杂法
    • US5192709A
    • 1993-03-09
    • US761308
    • 1991-09-17
    • Pierre M. Petroff
    • Pierre M. Petroff
    • H01L21/20H01L21/265H01L21/335
    • H01L21/2654H01L21/26586H01L29/66462H01L21/02395H01L21/02463H01L21/02546
    • A method for modulation doping of semiconductor heterostructures includes forming a semiconductor heterostructure comprising a substrate layer, a narrow band-gap quantum well layer, and a donor implantation layer. A focused ion beam writes across the surface of the donor implantation layer, at a maximum angle of incident less than that of the channeling half-angle .alpha. of the donor implantation layer. Channeled dopant ions penetrate deep within the donor implantation layer, far from surface damage sites, and away from the quantum well layer. The addition of a dechanneling layer within the donor implantation layer, and of a series of spacer layers, further localizes the implanted donor ions and separates these ions from the quantum well layer. Once activated by a thermal annealing process, the donor ions release carriers into the quantum well layer where carrier mobility is unimpeded by donor ion collisions. An alternative embodiment implants the donor ions before the heterostructure is completely formed. Another alternative embodiment deposits concentrations of dopant ions partially into the quantum layer, where the ions serve as point defects causing interdiffusion of the donor implantation layer material and that of the quantum well layer. Quantum well regions are formed, separated by interdiffusion regions containing donor ions.
    • 半导体异质结构的调制掺杂的方法包括形成包括衬底层,窄带隙量子阱层和施主注入层的半导体异质结构。 聚焦离子束跨入供体注入层的表面,入射的最大角度小于供体注入层的沟道半角α的入射角。 掺杂的掺杂剂离子深入供体植入层内,远离表面损伤位点,远离量子阱层。 在供体注入层和一系列间隔层中添加去蜿蜒层,进一步定位植入的施主离子并将这些离子与量子阱层分离。 一旦通过热退火工艺激活,供体离子将载体释放到量子阱层中,其中载流子迁移率被供体离子碰撞不受阻碍。 替代实施例在异质结构完全形成之前投入供体离子。 另一替代实施例将掺杂剂离子的浓度部分地沉积到量子层中,其中离子用作引起供体注入层材料和量子阱层材料相互扩散的点缺陷。 形成量子阱区,由包含供体离子的相互扩散区​​分离。