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1. 发明授权

US5994770A Portable electronic data carrier 失效
标题翻译：便携式电子数据载体
公开(公告)号：US5994770A
公开(公告)日：1999-11-30
申请号：US847533
申请日：1997-04-24
申请人： Bradley M. Harrington , Hal Kurkowski , James P. Cusey
发明人： Bradley M. Harrington , Hal Kurkowski , James P. Cusey
IPC分类号： G01K1/02 , G01K7/24 , G06F1/20 , G06F21/00 , G06K19/07 , G11C8/20 , G06K19/06
CPC分类号： G06F21/73 , G01K1/028 , G01K7/245 , G06F1/206 , G06K19/07 , G06K19/0723 , G11C8/20
摘要： An apparatus includes a circuit positioned in a housing, which circuit includes an input/output module having a parasitic power sub-module. The circuit further includes a scratchpad memory, coupled to the input/output module; a programmable memory, coupled to the scratchpad memory; and a control module, coupled to the input/output module, the scratchpad memory and the programmable memory. In certain variations, the input/output module further includes at least one of a one-wire bus and a three-wire bus in addition to a bus arbitrator.
摘要翻译：一种装置包括位于壳体中的电路，该电路包括具有寄生电力子模块的输入/输出模块。电路还包括耦合到输入/输出模块的暂存器存储器; 可编程存储器，耦合到暂存器存储器; 以及耦合到输入/输出模块，便携式存储器和可编程存储器的控制模块。在某些变型中，除了总线仲裁器之外，输入/输出模块还包括单线总线和三线总线中的至少一个。

2. 发明授权

US06986057B1 Security device and method 有权
标题翻译：安全设备和方法
公开(公告)号：US06986057B1
公开(公告)日：2006-01-10
申请号：US09644031
申请日：2000-08-22
申请人： James P. Cusey , Hal Kurkowski
发明人： James P. Cusey , Hal Kurkowski
IPC分类号： H04L9/00 , H04L9/32 , H04K1/00 , G06F11/30 , G06F12/14
CPC分类号： G07F7/1008 , G06Q20/341 , G06Q20/4097 , G07F7/0866
摘要： A security device is disclosed. In one embodiment, the security device includes a memory device comprising having a first memory portion configured to store a device ID; and a second memory portion configured to store a device secret. The security device further includes a processor connected to the memory device wherein the processor is configured to read the stored device ID from the first memory portion and the stored device secret from the second memory portion and perform a nonreversible computation using the stored device ID, the stored device secret, and a challenge as seeds. Additionally, the security device includes a communication circuit connected to the processor, the communication circuit configured to receive the challenge from a host device and to communicate a result of the nonreversible computation performed by the processor.
摘要翻译：公开了一种安全装置。在一个实施例中，安全设备包括存储器设备，包括具有被配置为存储设备ID的第一存储器部分; 以及被配置为存储设备秘密的第二存储器部分。安全设备还包括连接到存储器设备的处理器，其中处理器被配置为从第一存储器部分读取所存储的设备ID和从第二存储器部分读取所存储的设备密码，并使用存储的设备ID执行不可逆计算，存储设备的秘密，和挑战作为种子。此外，安全装置包括连接到处理器的通信电路，通信电路被配置为从主机设备接收挑战并传送由处理器执行的不可逆计算的结果。

3. 发明申请

US20080197504A1 SINGLE-SIDED, FLAT, NO LEAD, INTEGRATED CIRCUIT PACKAGE 有权
标题翻译：单面，平面，无引线，集成电路封装
公开(公告)号：US20080197504A1
公开(公告)日：2008-08-21
申请号：US11697260
申请日：2007-04-05
申请人： Jeff Alan Gordon , Steven Hass , Hal Kurkowski , Scott Jones
发明人： Jeff Alan Gordon , Steven Hass , Hal Kurkowski , Scott Jones
IPC分类号： H01L23/50 , H01L21/00
CPC分类号： H01L24/46 , H01L23/32 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H05K3/325 , H05K2201/10636 , H05K2203/168 , Y02P70/611 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
摘要翻译：一种集成电路封装，包括包括绝缘壳体，第一电触头和第二电触头的外壳。绝缘壳体，第一电触点和第二电触头被配置成形成外壳的接触侧。此外，第一和第二电触头的尺寸被设计成基本对准不对终端用途设备的相应触点进行机电连接的对准。封装封装集成电路管芯，该集成电路管芯电耦合到第一和第二电触点。对准不敏感的第一和第二电触点可以电机械连接到最终用途设备（例如打印机）的相应触点。此外，集成电路封装可以由外围设备（例如，打印机墨盒）托管。

4. 发明授权

US06217213B1 Temperature sensing systems and methods 失效
标题翻译：温度传感系统和方法
公开(公告)号：US06217213B1
公开(公告)日：2001-04-17
申请号：US09084516
申请日：1998-05-26
申请人： Stephen M. Curry , Michael L. Bolan , Kevin E. Deierling , William Lee Payne, II , Hal Kurkowski
发明人： Stephen M. Curry , Michael L. Bolan , Kevin E. Deierling , William Lee Payne, II , Hal Kurkowski
IPC分类号： G01K304
CPC分类号： H01L23/58 , G01K1/028 , G01K3/10 , G01K7/245 , G06F1/206 , G06F3/0383 , G06F3/04897 , G06F21/73 , G06F21/79 , G06K7/0021 , G06K19/07 , G11C5/066 , G11C5/143 , G11C7/065 , G11C7/24 , G11C8/20 , H01L2924/0002 , H01L2924/3011 , Y02D10/16 , H01L2924/00
摘要： A temperature-controlled counter/clock arrangement is provided where th rate or frequency of the counting is temperature dependent. This allows for a measuring of thermal accumulation and/or history. The temperature sensing is based upon the use of the varying current that will flow through a toward biased semiconductor diode. In one embodiment a constant voltage source is used so that the current variation will follow Arrhenius's law.
摘要翻译：提供温度控制的计数器/时钟布置，其中计数的速率或频率是温度依赖性的。这允许测量热积累和/或历史。温度检测基于使用将流过偏压半导体二极管的变化电流。在一个实施例中，使用恒定电压源，使得电流变化将遵循Arrhenius定律。

5. 发明授权

US6112275A Method of communicating over a single wire bus between a host device and a module device which measures thermal accumulation over time 失效
标题翻译：在主机设备和测量热累积的模块设备之间通过单线总线进行通信的方法
公开(公告)号：US6112275A
公开(公告)日：2000-08-29
申请号：US365252
申请日：1994-12-28
申请人： Stephen M. Curry , Michael L. Bolan , Kevin E. Deierling , William Lee Payne, II , Hal Kurkowski , Donald R. Dias , Gary V. Zanders , Robert D. Lee , Guenter H. Lehmann
发明人： Stephen M. Curry , Michael L. Bolan , Kevin E. Deierling , William Lee Payne, II , Hal Kurkowski , Donald R. Dias , Gary V. Zanders , Robert D. Lee , Guenter H. Lehmann
IPC分类号： G01K1/02 , G01K3/10 , G01K7/24 , G06F1/00 , G06F1/20 , G06F3/023 , G06F3/038 , G06K7/00 , G06K19/07 , G11C5/00 , G11C5/06 , G11C7/06 , G11C7/24 , G11C8/20 , H01L23/58 , H03K7/08
CPC分类号： H01L23/58 , G01K1/028 , G01K3/10 , G01K7/245 , G06F1/206 , G06F21/73 , G06F21/79 , G06F3/0383 , G06F3/04897 , G06K19/07 , G06K7/0021 , G11C5/066 , G11C5/143 , G11C7/065 , G11C7/24 , G11C8/20 , H01L2924/0002 , H01L2924/3011 , Y02B60/1275
摘要： A method of communicating information between a host device and a potentially portable module device which measures thermal accumulation over time via a temperature controlled counter. The temperature controlled counter may operate using substantially Arrhenius' law. The host device communicates with the portable module via a single wire bidirectional data bus. The single wire bus and one-wire communication protocol allows data flow between a host and a plurality of devices connected to the single wire bus. The single wire bus allows for a great versatility of uses for the portable module.
摘要翻译：一种在主机设备和经由温度控制计数器测量随时间的热积累的潜在便携式模块设备之间传送信息的方法。温度控制计数器可以使用基本上的Arrhenius定律来操作。主机通过单线双向数据总线与便携式模块进行通信。单线总线和单线通信协议允许主机与连接到单线总线的多个设备之间的数据流。单线总线允许用于便携式模块的很大的通用性。

6. 发明授权

US5619066A Memory for an electronic token 失效
标题翻译：内存为电子令牌
公开(公告)号：US5619066A
公开(公告)日：1997-04-08
申请号：US299040
申请日：1994-08-31
申请人： Stephen M. Curry , Michael L. Bolan , Kevin E. Deierling , William L. Payne, II , Hal Kurkowski , Donald R. Dias , Gary V. Zanders , Robert D. Lee , Guenther H. Lehmann
发明人： Stephen M. Curry , Michael L. Bolan , Kevin E. Deierling , William L. Payne, II , Hal Kurkowski , Donald R. Dias , Gary V. Zanders , Robert D. Lee , Guenther H. Lehmann
IPC分类号： G01K1/02 , G01K3/10 , G01K7/24 , G06F1/00 , G06F1/20 , G06F3/023 , G06F3/038 , G06K7/00 , G06K19/07 , G11C5/00 , G11C5/06 , G11C7/06 , G11C7/24 , G11C8/20 , H01L23/58 , G06K19/06
CPC分类号： H01L23/58 , G01K1/028 , G01K3/10 , G01K7/245 , G06F1/206 , G06F21/73 , G06F21/79 , G06F3/0383 , G06F3/04897 , G06K19/07 , G06K7/0021 , G11C5/066 , G11C5/143 , G11C7/065 , G11C7/24 , G11C8/20 , H01L2924/0002 , H01L2924/3011 , Y02B60/1275
摘要： A serial-port memory is positioned in a substantially token-shaped body. The substantially token-shaped body has a perimeter and a flange extending from a portion of the perimeter. The serial-port memory comprises a serial port, a scratchpad memory coupled to the serial port, a second memory coupled to the scratchpad memory; and control logic coupled to the serial port and the scratchpad and second memories. The control logic transfers information from the scratchpad memory to the second memory as a block pursuant to a block transfer command received at the serial port. The electronic token has a first electrically conductive surface and a second electrically conductive surface that combines to create a hollow cavity and the serial port, scratchpad memory, second memory, and control logic positioned inside the hollow cavity, the first conductive surface and the second conductive surface can be electrically coupled to transmit electrical signals generated by the serial port, scratchpad memory, second memory, and control logic and to receive externally generated electrical signals. The first electrically conductive surface and the second electrically conductive surface are preferably planar. The control logic includes a cyclic redundancy check generator. Third and fourth memories can be coupled to the scratchpad memory, wherein the control logic transfers information as a block from the scratchpad memory to one of the second, third, and fourth memories pursuant to a block transfer command received at the serial port.
摘要翻译：串行端口存储器位于基本上令牌形的主体中。基本上令牌形的主体具有从周边的一部分延伸的周边和凸缘。串行端口存储器包括串行端口，耦合到串行端口的暂存器存储器，耦合到暂存器存储器的第二存储器; 以及耦合到串行端口和暂存器和第二存储器的控制逻辑。控制逻辑根据在串行端口处接收到的块传送命令，将信息从暂存器存储器传送到第二存储器作为块。电子令牌具有第一导电表面和第二导电表面，其组合以产生中空空腔，以及定位在空腔内部的串行端口，暂存器存储器，第二存储器和控制逻辑，第一导电表面和第二导电表面可以电耦合以传输由串行端口，暂存器存储器，第二存储器和控制逻辑产生的电信号，并且接收外部产生的电信号。第一导电表面和第二导电表面优选是平面的。控制逻辑包括循环冗余校验生成器。第三和第四存储器可以耦合到暂存器存储器，其中控制逻辑根据在串行端口接收的块传送命令，将作为块的信息从暂存器存储器传送到第二，第三和第四存储器之一。

7. 发明授权

US5974504A Metal token having units of value stored therein using a single wire communication method 失效
标题翻译：使用单线通信方式存储有值的单位的金属令牌
公开(公告)号：US5974504A
公开(公告)日：1999-10-26
申请号：US116020
申请日：1998-07-15
申请人： Robert D. Lee , Stephen M. Curry , Michael L. Bolan , Hal Kurkowski , Donald R. Diaz , Francis A. Scherpenberg , Kevin E. Peirling
发明人： Robert D. Lee , Stephen M. Curry , Michael L. Bolan , Hal Kurkowski , Donald R. Diaz , Francis A. Scherpenberg , Kevin E. Peirling
IPC分类号： G05B23/02 , G06F3/023 , G06F3/038 , G06F13/18 , G06K7/00 , G06K19/04 , G06K19/06 , G06K19/07 , G06K19/077 , G08C19/00 , G11C5/00 , G11C5/06 , G11C7/24 , G11C8/20 , G06K19/067 , H01L23/02
CPC分类号： G11C8/20 , G06F3/0383 , G06F3/04897 , G06K19/04 , G06K19/047 , G06K19/07 , G06K19/0706 , G06K19/0723 , G06K19/07735 , G06K19/07743 , G06K7/0008 , G06K7/0021 , G06K7/0086 , G11C11/41 , G11C5/005 , G11C5/066 , G11C5/141 , G11C7/24 , G11C8/10
摘要： A secured metal token using a single wire communication system is employed to dispense units of value and to provide a secure storage device for controlling the dispensing of articles or service items. The metal token can be formed of two pieces with a simplified electronic circuit inside which can contain units of value for the dispensing of items using the memory within the metal token as a secure vault. The token uses a simple two wire (ground and combined clock/data) arrangment. As goods are purchased or services rendered the value of those good or services is deducted from a prestored amount within the token.
摘要翻译：采用使用单线通信系统的安全金属令牌来分配有价值的单元，并且提供用于控制物品或服务项目的分配的安全存储装置。金属标记可以由具有简化的电子电路的两个部件形成，其中可以包含使用金属标记内的存储器作为安全库的物品的分配的单位。令牌使用简单的双线（地面和组合时钟/数据）排列。由于购买商品或提供服务，这些商品或服务的价值将从令牌内的预先存入的金额中扣除。

8. 发明授权

US5235548A Memory with power supply intercept in redundancy logic 失效
标题翻译：具有冗余逻辑电源拦截的内存
公开(公告)号：US5235548A
公开(公告)日：1993-08-10
申请号：US554978
申请日：1990-07-12
申请人： Hal Kurkowski
发明人： Hal Kurkowski
IPC分类号： G11C29/00
CPC分类号： G11C29/83 , G11C29/832
摘要： A low-power SRAM with redundant rows in each of the subarrays. Conventional redundancy logic permits defective rows to be electrically replaced by redundant rows. In addition, power supply disconnect logic permits the V.sub.DD supply voltage line for the bad row to be disconnected.
摘要翻译：每个子阵列中具有冗余行的低功耗SRAM。传统的冗余逻辑允许有缺陷的行被冗余行电替换。此外，电源断开逻辑允许坏电源的VDD电源线断开。

9. 发明授权

US07675166B2 Integrated circuit package device comprising electrical contacts making solderless and bondless electrical-mechanical connection 有权
标题翻译：集成电路封装器件，其包括使无焊接和无粘结的机电连接的电触头
公开(公告)号：US07675166B2
公开(公告)日：2010-03-09
申请号：US11128052
申请日：2005-05-11
申请人： Jeff Alan Gordon , Steven N. Hass , Hal Kurkowski , Scott Jones
发明人： Jeff Alan Gordon , Steven N. Hass , Hal Kurkowski , Scott Jones
IPC分类号： H01L23/34
CPC分类号： H01L24/46 , H01L23/32 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H05K3/325 , H05K2201/10636 , H05K2203/168 , Y02P70/611 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
摘要翻译：一种集成电路封装，包括包括绝缘壳体，第一电触头和第二电触头的外壳。绝缘壳体，第一电触点和第二电触头被构造成形成外壳的接触侧。此外，第一和第二电触头的尺寸被设计成基本对准不对终端用途设备的相应触点进行机电连接的对准。封装封装集成电路管芯，该集成电路管芯电耦合到第一和第二电触点。对准不敏感的第一和第二电触点可以电机械连接到最终用途设备（例如打印机）的相应触点。此外，集成电路封装可以由外围设备（例如，打印机墨盒）托管。

10. 发明申请

US20060255467A1 Single-sided, flat, no lead, integrated circuit package 有权
标题翻译：单面，平面，无引线，集成电路封装
公开(公告)号：US20060255467A1
公开(公告)日：2006-11-16
申请号：US11128052
申请日：2005-05-11
申请人： Jeff Gordon , Steven Hass , Hal Kurkowski , Scott Jones
发明人： Jeff Gordon , Steven Hass , Hal Kurkowski , Scott Jones
IPC分类号： H01L23/48
CPC分类号： H01L24/46 , H01L23/32 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H05K3/325 , H05K2201/10636 , H05K2203/168 , Y02P70/611 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
摘要翻译：一种集成电路封装，包括包括绝缘壳体，第一电触头和第二电触头的外壳。绝缘壳体，第一电触点和第二电触头被构造成形成外壳的接触侧。此外，第一和第二电触头的尺寸被设计成基本对准不对终端用途设备的相应触点进行机电连接的对准。封装封装集成电路管芯，该集成电路管芯电耦合到第一和第二电触点。对准不敏感的第一和第二电触点可以电机械连接到最终用途设备（例如打印机）的相应触点。此外，集成电路封装可以由外围设备（例如，打印机墨盒）托管。

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