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    • 3. 发明授权
    • Method for fabricating high density ultrasound array
    • 高密度超声阵列制造方法
    • US5497540A
    • 1996-03-12
    • US362338
    • 1994-12-22
    • Subramaniam VenkataramaniRobert F. KwasnickPeter W. Lorraine
    • Subramaniam VenkataramaniRobert F. KwasnickPeter W. Lorraine
    • B06B1/06H01L41/22
    • B06B1/0622Y10T29/42
    • A high yield method of fabricating an ultrasound array having densely packed ultrasound elements with smooth surface finishes includes the steps of: 1) applying an acoustic matching material to opposites faces (or surfaces) of a piezo electric material ceramic block; 2) cutting the block in a plane perpendicular to the two faces of the block so as to form a plurality of wafers having the acoustic matching material disposed on opposite ends; 3) assembling the wafers to form a laminated body having respective portions of the matching layer on opposite surfaces and with the wafers each being separated from an adjacent wafer by a selected gap distance and bonded together by a polymeric adhesive material; 4) cutting the laminated body along a longitudinal axis so as to form a first laminate body subassembly and a second laminate body subassembly, each of the subassemblies having a front surface having the acoustic matching material disposed thereon and a back surface where the laminate body was cut; 5) applying a backing layer to each laminate body subassembly; and 6) removing the polymeric adhesive material disposed between the wafers, whereby each subassembly comprises an ultrasound array having transducer elements separated by the selected array gap distance.
    • 制造具有光滑表面光洁度的密集超声波元件的超声阵列的高屈服方法包括以下步骤:1)将声匹配材料施加到压电陶瓷块的相对面(或表面)上; 2)在与块的两个面垂直的平面中切割块,以便形成多个晶片,其中声学匹配材料设置在相对端; 3)组装晶片以形成具有相对表面上的匹配层的相应部分的层叠体,并且晶片各自与相邻晶片分离选定的间隙距离,并通过聚合物粘合材料结合在一起; 4)沿着纵向轴线切割层压体以形成第一层压体子组件和第二层压体子组件,每个子组件具有设置在其上的声匹配材料的前表面和层叠体的后表面 切; 5)将背衬层施加到每个层叠体子组件; 以及6)去除设置在晶片之间的聚合物粘合剂材料,由此每个子组件包括具有由所选阵列间隙距离分开的换能器元件的超声阵列。