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1. 发明申请

US20070237384A1 MASK DEFECT ANALYSIS SYSTEM 失效
标题翻译：掩蔽缺陷分析系统
公开(公告)号：US20070237384A1
公开(公告)日：2007-10-11
申请号：US11761856
申请日：2007-06-12
申请人： James BRUCE , Orest BULA , Edward CONRAD , William LEIPOLD , Michael HIBBS , Joshua KRUEGER
发明人： James BRUCE , Orest BULA , Edward CONRAD , William LEIPOLD , Michael HIBBS , Joshua KRUEGER
IPC分类号： G06K9/00
CPC分类号： G03F1/84
摘要： An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.
摘要翻译：提出了一种用于分析半导体制造过程中的掩模缺陷的自动化系统。该系统将来自检查工具的结果和来自被检查的每个掩模层的设计数据存储库的设计布局数据与计算机程序和预定规则集相结合，以确定给定掩模层上的缺陷何时发生。掩模检查结果包括缺陷的存在，位置和类型（透明或不透明）。最终，根据缺陷是否可能导致产品故障，确定是否废除，修理或接受给定的掩模。将缺陷检查数据应用于被检查的每个掩模层的设计布局数据防止当所识别的缺陷不在掩模的关键区域时被报废。

2. 发明申请

US20070248257A1 MASK DEFECT ANALYSIS SYSTEM 失效
公开(公告)号：US20070248257A1
公开(公告)日：2007-10-25
申请号：US11769431
申请日：2007-06-27
申请人： James BRUCE , Orest BULA , Edward CONRAD , William LEIPOLD , Michael HIBBS , Joshua KRUEGER
发明人： James BRUCE , Orest BULA , Edward CONRAD , William LEIPOLD , Michael HIBBS , Joshua KRUEGER
IPC分类号： G06K9/00
CPC分类号： G03F1/84
摘要： An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.

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