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    • 2. 发明申请
    • Circuit device including vertical transistors connected to buried bitlines and method of manufacturing the same
    • 电路装置包括连接到埋地位线的垂直晶体管及其制造方法
    • US20070075359A1
    • 2007-04-05
    • US11541756
    • 2006-10-02
    • Jae-man YoonDong-gun ParkKang-yoon LeeChoong-ho LeeBong-soo KimSeong-goo KimHyeoung-won SeoSeung-bae Park
    • Jae-man YoonDong-gun ParkKang-yoon LeeChoong-ho LeeBong-soo KimSeong-goo KimHyeoung-won SeoSeung-bae Park
    • H01L21/8238
    • H01L29/66666H01L21/823885H01L27/10876H01L27/10885H01L27/10894H01L29/7827H01L2924/0002H01L2924/00
    • In a circuit device including vertical transistors connected to buried bitlines and a method of manufacturing the circuit device, the circuit device includes a semiconductor substrate including a peripheral circuit region and left and right cell regions at both sides of the peripheral circuit region; bottom active regions arranged on the semiconductor substrate to be spaced apart from one another in a column direction and to extend from the peripheral circuit region alternately to the left cell region and the right cell region in a row direction; channel pillars protruding from the bottom active regions in a vertical direction and arranged to be aligned in the row direction and spaced apart from one another; gate electrodes provided with a gate dielectric layer and attached to surround side surfaces of the channel pillars; buried bitlines extending along the bottom active regions, the bottom active regions including a bottom source/drain region; local interconnection lines contacting side surfaces of the gate electrodes in the peripheral circuit region and extending between the gate electrodes to commonly interconnect the gate electrodes in the peripheral circuit region, thereby configuring a peripheral circuit; signal lines electrically connected to upper surfaces of the channel pillars or to at least one of the local interconnection lines; and interconnection contacts electrically connecting the local interconnection line to the buried bitline of a different row from that of the commonly-connected gate electrodes or electrically connecting the local interconnection lines to the signal lines, thereby configuring the peripheral circuit.
    • 在包括连接到掩埋位线的垂直晶体管的电路器件和制造电路器件的方法中,电路器件包括半导体衬底,该半导体衬底包括外围电路区域和外围电路区域两侧的左右单元区域; 布置在半导体衬底上的底部有源区域在列方向上彼此间隔开并且从外围电路区域交替地延伸到左小区区域和右小区区域在行方向上延伸; 通道柱从垂直方向从底部有源区域突出并且布置成在行方向上对齐并且彼此间隔开; 栅极电极设置有栅极电介质层并附接到环绕通道柱的侧表面; 掩埋位线沿着底部有源区延伸,底部有源区域包括底部源极/漏极区域; 局部互连线与外围电路区域中的栅电极的侧表面接触并在栅电极之间延伸,以在外围电路区域中共同连接栅电极,从而构成外围电路; 信号线电连接到通道柱的上表面或至少一个局部互连线; 以及互连触点将本地互连线电连接到与共用栅极电极的不同行的掩埋位线或将本地互连线电连接到信号线,从而配置外围电路。
    • 9. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE WITH VERTICAL CHANNEL TRANSISTOR AND METHOD OF FABRICATING THE SAME
    • 具有垂直通道晶体管的半导体存储器件及其制造方法
    • US20080211013A1
    • 2008-09-04
    • US12118268
    • 2008-05-09
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • H01L29/78
    • H01L29/66666H01L27/0207H01L27/10814H01L27/10823H01L27/10876H01L27/10885H01L27/10891H01L29/7827
    • In a semiconductor memory device having a vertical channel transistor a body of which is connected to a substrate and a method of fabricating the same, the semiconductor memory device includes a semiconductor substrate including a plurality of pillars arranged spaced apart from one another, and each of the pillars includes a body portion and a pair of pillar portions extending from the body portion and spaced apart from each other. A gate electrode is formed to surround each of the pillar portions. A bitline is disposed on the body portion to penetrate a region between a pair of the pillar portions of each of the first pillars arranged to extend in a first direction. A wordline is disposed over the bitline, arranged to extend in a second direction intersecting the first direction, and configured to contact the side surface of the gate electrode. A first doped region is formed in the upper surface of each of the pillar portions of the pillar. A second doped region is formed on the body portion of the pillar and connected electrically to the bitline. Storage node electrodes are connected electrically to the first doped region and disposed on each of the pillar portions.
    • 在具有其主体连接到基板的垂直沟道晶体管的半导体存储器件及其制造方法中,半导体存储器件包括:半导体衬底,其包括彼此间隔布置的多个柱,并且每个 支柱包括主体部分和从主体部分延伸并彼此间隔开的一对柱部分。 形成围绕每个支柱部分的栅电极。 位于所述主体部分上的位线穿过所述第一支柱中的所述第一支柱的一对支柱之间的区域,所述第一支柱布置成沿第一方向延伸。 字线布置在位线之外,布置成沿与第一方向相交的第二方向延伸,并且被配置为接触栅电极的侧表面。 第一掺杂区域形成在柱的每个柱部分的上表面中。 第二掺杂区形成在柱的主体部分上并与电位线连接。 存储节点电极与第一掺杂区域电连接并设置在每个柱部分上。
    • 10. 发明授权
    • Semiconductor memory device with vertical channel transistor and method of fabricating the same
    • 具有垂直沟道晶体管的半导体存储器件及其制造方法
    • US07387931B2
    • 2008-06-17
    • US11546581
    • 2006-10-11
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • Hyeoung-won SeoJae-man YoonKang-yoon LeeDong-gun ParkBong-soo KimSeong-goo Kim
    • H01L21/8242H01L21/336
    • H01L29/66666H01L27/0207H01L27/10814H01L27/10823H01L27/10876H01L27/10885H01L27/10891H01L29/7827
    • In a semiconductor memory device having a vertical channel transistor a body of which is connected to a substrate and a method of fabricating the same, the semiconductor memory device includes a semiconductor substrate including a plurality of pillars arranged spaced apart from one another, and each of the pillars includes a body portion and a pair of pillar portions extending from the body portion and spaced apart from each other. A gate electrode is formed to surround each of the pillar portions. A bitline is disposed on the body portion to penetrate a region between a pair of the pillar portions of each of the first pillars arranged to extend in a first direction. A wordline is disposed over the bitline, arranged to extend in a second direction intersecting the first direction, and configured to contact the side surface of the gate electrode. A first doped region is formed in the upper surface of each of the pillar portions of the pillar. A second doped region is formed on the body portion of the pillar and connected electrically to the bitline. Storage node electrodes are connected electrically to the first doped region and disposed on each of the pillar portions.
    • 在具有其主体连接到基板的垂直沟道晶体管的半导体存储器件及其制造方法中,半导体存储器件包括:半导体衬底,其包括彼此间隔布置的多个柱,并且每个 支柱包括主体部分和从主体部分延伸并彼此间隔开的一对柱部分。 形成围绕每个支柱部分的栅电极。 位于所述主体部分上的位线穿过所述第一支柱中的所述第一支柱的一对支柱之间的区域,所述第一支柱布置成沿第一方向延伸。 字线布置在位线之外,布置成沿与第一方向相交的第二方向延伸,并且被配置为接触栅电极的侧表面。 第一掺杂区域形成在柱的每个柱部分的上表面中。 第二掺杂区形成在柱的主体部分上并与电位线连接。 存储节点电极与第一掺杂区域电连接并设置在每个柱部分上。