专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09510457B2 Methods of manufacturing metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same 有权
标题翻译：通过使用由其制造的等离子体和柔性基板来制造金属布线埋入柔性基板的方法
公开(公告)号：US09510457B2
公开(公告)日：2016-11-29
申请号：US14004560
申请日：2012-07-30
申请人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Seunghun Lee
发明人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Seunghun Lee
IPC分类号： H05K3/00 , H05K1/03 , H05K3/20 , H05K1/02 , H05K3/10
CPC分类号： H05K3/0041 , H05K1/0283 , H05K1/03 , H05K1/0393 , H05K3/101 , H05K3/20 , H05K3/207 , H05K2201/0326 , H05K2201/0376 , H05K2201/10037 , H05K2201/10098 , H05K2201/10128 , H05K2203/0139 , H05K2203/016 , H05K2203/0264 , H05K2203/095
摘要： Disclosed are methods of manufacturing a metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same. The method includes pre-treating a substrate by irradiating the plasma on the surface of the substrate (Step 1), forming a metal wiring on the pre-treated substrate in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the substrate including the metal wiring formed thereon in Step 2 and curing (Step 3), and separating the polymer layer formed in Step 3 from the substrate in Step 1 (Step 4). The metal wiring may be inserted into the flexible substrate, and the resistance of the wiring may be decreased. The metal wiring may be clearly separated from the substrate, and impurities on the substrate surface may be clearly removed. The flexible substrate may be easily separated by applying only physical force.
摘要翻译：公开了通过使用由其制造的等离子体和柔性基板来制造金属布线掩埋的柔性基板的方法。该方法包括通过在基板表面照射等离子体来预处理基板（步骤1），在步骤1（步骤2）中在预处理基板上形成金属布线，通过涂布形成金属布线掩埋的聚合物层在步骤2中，将包含形成在其上的金属布线的固化性聚合物固化（步骤3），并且在步骤1（步骤4）中将步骤3中形成的聚合物层与基板分离。可以将金属布线插入到柔性基板中，并且可以减小布线的电阻。金属布线可以从衬底清楚地分离，并且可以清楚地去除衬底表面上的杂质。柔性基板可以通过仅施加物理力而容易地分离。

2. 发明申请

US20140034364A1 METHODS OF MANUFACTURING METAL WIRING BURIED FLEXIBLE SUBSTRATE BY USING PLASMA AND FLEXIBLE SUBSTRATES MANUFACTURED BY THE SAME 有权
标题翻译：通过使用等离子体和由其制造的柔性基板制造金属接线的柔性基板的方法
公开(公告)号：US20140034364A1
公开(公告)日：2014-02-06
申请号：US14004560
申请日：2012-07-30
申请人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Seunghun Lee
发明人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Seunghun Lee
IPC分类号： H05K3/10 , H05K1/02
CPC分类号： H05K3/0041 , H05K1/0283 , H05K1/03 , H05K1/0393 , H05K3/101 , H05K3/20 , H05K3/207 , H05K2201/0326 , H05K2201/0376 , H05K2201/10037 , H05K2201/10098 , H05K2201/10128 , H05K2203/0139 , H05K2203/016 , H05K2203/0264 , H05K2203/095
摘要： Disclosed are methods or manufacturing a metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same. The method includes pre-treating a substrate by irradiating the plasma on the surface of the substrate (Step 1), forming a metal wiring on the pre-treated substrate in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the substrate including the metal wiring formed thereon in Step 2 and curing (Step 3), and separating the polymer layer formed in Step 3 from the substrate in Step 1 (Step 4), The metal wiring may be inserted into the flexible substrate, and the resistance of the wiring may be decreased. The metal wiring may be clearly separated from the substrate, and impurities on the substrate surface may be clearly removed. The flexible substrate may be easily separated by applying only physical force.
摘要翻译：公开了通过使用由其制造的等离子体和柔性基板来制造金属布线埋入的柔性基板的方法或制造方法。该方法包括通过在基板的表面上照射等离子体来预处理基板（步骤1），在步骤1（步骤2）中在预处理基板上形成金属布线，通过涂布形成金属布线掩埋的聚合物层在步骤2中，将包含形成在其上的金属布线的固化性聚合物固化（步骤3），并在步骤1（步骤4）中将步骤3中形成的聚合物层与基板分离。金属布线可插入柔性基板，并且布线的电阻可能降低。金属布线可以从衬底清楚地分离，并且可以清楚地去除衬底表面上的杂质。柔性基板可以通过仅施加物理力而容易地分离。

3. 发明申请

US20140000943A1 METHOD OF MANUFACTURING A FLEXIBLE SUBSTRATE HAVING METAL WIRING EMBEDDED THEREIN,AND FLEXIBLE SUBSTRATE MANUFACTURED BY THE METHOD 有权
标题翻译：制造具有嵌入金属线的柔性基板的方法和由该方法制造的柔性基板
公开(公告)号：US20140000943A1
公开(公告)日：2014-01-02
申请号：US14004557
申请日：2012-04-19
申请人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Myungkwan Song , Dae Sung You , Chang Soo Kim , Kee Seok Nam
发明人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Myungkwan Song , Dae Sung You , Chang Soo Kim , Kee Seok Nam
IPC分类号： H05K3/10 , H05K1/02
CPC分类号： H05K3/0017 , H05K1/02 , H05K1/0393 , H05K3/10 , H05K3/207 , H05K3/246 , H05K2201/0376 , Y10T29/49156
摘要： Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).
摘要翻译：公开了一种制造金属布线埋地柔性基板和由其制造的柔性基板的方法。该方法包括将包含可溶于水或有机溶剂的聚合物或光可降解聚合物的牺牲层涂覆在基材上（步骤1），在步骤1（步骤2）中在牺牲层上形成金属布线，形成金属布线通过在步骤2中包括在其上形成的金属布线的牺牲层上涂覆可固化聚合物并固化（步骤3），并且在步骤1中通过溶解在水中除去步骤3中的聚合物层和步骤1中的基底，有机溶剂或光降解步骤1中的基板与步骤3中的聚合物层之间存在的牺牲层（步骤4）。

4. 发明授权

US09445504B2 Methods of manufacturing metal wiring buried flexible substrate and flexible substrates manufactured by the same 有权
标题翻译：制造金属布线埋地柔性基板和由其制造的柔性基板的方法
公开(公告)号：US09445504B2
公开(公告)日：2016-09-13
申请号：US14004557
申请日：2012-04-19
申请人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Myungkwan Song , Dae Sung You , Chang Soo Kim , Kee Seok Nam
发明人： Jae Wook Kang , Do Geun Kim , Jong Kuk Kim , Sung Hun Jung , Myungkwan Song , Dae Sung You , Chang Soo Kim , Kee Seok Nam
IPC分类号： H05K3/00 , H05K3/10 , H05K1/02 , H05K3/20 , H05K1/03 , H05K3/24
CPC分类号： H05K3/0017 , H05K1/02 , H05K1/0393 , H05K3/10 , H05K3/207 , H05K3/246 , H05K2201/0376 , Y10T29/49156
摘要： Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating a sacrificial layer including a polymer soluble in water or an organic solvent, or a photodegradable polymer on a substrate (Step 1), forming a metal wiring on the sacrificial layer in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the sacrificial layer including the metal wiring formed thereon in Step 2 and curing (Step 3) and separating the polymer layer in Step 3 from the substrate in Step 1 by removing through dissolving in the water or the organic solvent or photodegrading only the sacrificial layer present between the substrate in Step 1 and the polymer layer in Step 3 (Step 4).
摘要翻译：公开了一种制造金属布线埋地柔性基板和由其制造的柔性基板的方法。该方法包括将包含可溶于水或有机溶剂的聚合物或光可降解聚合物的牺牲层涂覆在基材上（步骤1），在步骤1（步骤2）中在牺牲层上形成金属布线，形成金属布线通过在步骤2中包括在其上形成的金属布线的牺牲层上涂覆可固化聚合物并固化（步骤3），并且在步骤1中通过溶解在水中除去步骤3中的聚合物层和步骤1中的基底，有机溶剂或光降解步骤1中的基板与步骤3中的聚合物层之间存在的牺牲层（步骤4）。

5. 发明申请

US20110151106A1 Source for Inorganic Layer and Method for Controlling Heating Source Thereof 审中-公开
标题翻译：无机层来源及其加热源控制方法
公开(公告)号：US20110151106A1
公开(公告)日：2011-06-23
申请号：US13037150
申请日：2011-02-28
申请人： Min Jae Jeong , Do Geun Kim , Young Mook Choi
发明人： Min Jae Jeong , Do Geun Kim , Young Mook Choi
IPC分类号： C23C16/52
CPC分类号： C23C14/243 , C23C14/545
摘要： A deposition source for an inorganic layer and a method for controlling a heating source thereof capable of improving a deposition efficiency, preventing condensation of a nozzle, and/or precisely controlling the temperature by minimizing the time that is needed to reach a stabilization of a deposition rate. The deposition source includes: a heating unit including a heating source for applying heat to a crucible; a housing for isolating the heat emitted from the heating unit; an outer wall for anchoring the crucible; and a nozzle unit for spraying the deposition materials evaporated from the crucible. The heating unit includes a first unit and a second unit. The crucible is positioned between the first unit and the second unit, and the heating unit includes a first power source for supplying electric power to the first unit and a second power source for supplying electric power to the second unit.
摘要翻译：一种用于无机层的沉积源及其控制加热源的方法，其能够通过最小化达到沉积稳定所需的时间来提高沉积效率，防止喷嘴冷凝和/或精确地控制温度率。沉积源包括：加热单元，其包括用于向坩埚施加热量的加热源; 用于隔离从加热单元发出的热量的壳体; 用于锚定坩埚的外壁; 以及用于喷射从坩埚蒸发的沉积材料的喷嘴单元。加热单元包括第一单元和第二单元。坩埚位于第一单元和第二单元之间，并且加热单元包括用于向第一单元供电的第一电源和用于向第二单元供电的第二电源。

6. 发明授权

US07905961B2 Linear type deposition source 有权
标题翻译：线型沉积源
公开(公告)号：US07905961B2
公开(公告)日：2011-03-15
申请号：US11515388
申请日：2006-08-31
申请人： Min Jae Jeong , Do Geun Kim , Hee Cheol Kang
发明人： Min Jae Jeong , Do Geun Kim , Hee Cheol Kang
IPC分类号： C23C16/00
CPC分类号： C23C14/243
摘要： A linear type deposition source capable of improving a heating efficiency and reducing a heating temperature by using a plate-type heating source and/or improving a cooling efficiency by including a cooling jacket having a cooling water line in a housing. The linear type deposition source includes: a crucible arranged in a deposition chamber, the crucible being for evaporating materials included in the crucible; a heating source for applying heat to the crucible; a housing for isolating the heat emitted from the heating source; an outer wall for anchoring the crucible; and a nozzle unit for spraying the materials evaporated from the crucible. In this deposition source, the heating source is a plate-type heating source, and the housing has a cooling water line so cooling water can flow through the cooling water line.
摘要翻译：一种能够通过使用板式加热源来提高加热效率和降低加热温度的线性型沉积源和/或通过在壳体中具有冷却水管线的冷却套来提高冷却效率。线性型沉积源包括：坩埚，布置在沉积室中，该坩埚用于蒸发包含在坩埚中的材料; 用于向坩埚施加热量的加热源; 用于隔离从所述加热源发出的热量的壳体; 用于锚定坩埚的外壁; 以及用于喷射从坩埚蒸发的材料的喷嘴单元。在该沉积源中，加热源是板式加热源，壳体具有冷却水管线，因此冷却水可以流过冷却水管线。

7. 发明授权

US08048229B2 Apparatus for depositing an organic layer and method for controlling a heating unit thereof 有权
标题翻译：用于沉积有机层的设备和用于控制其加热单元的方法
公开(公告)号：US08048229B2
公开(公告)日：2011-11-01
申请号：US11515364
申请日：2006-08-31
申请人： Min Jae Jeong , Do Geun Kim , Seok Heon Jeong
发明人： Min Jae Jeong , Do Geun Kim , Seok Heon Jeong
IPC分类号： C23C16/00 , G05F1/00
CPC分类号： C23C14/243
摘要： An apparatus for depositing an organic layer and a method for controlling the heating unit thereof are provided. The apparatus includes a crucible positioned in a deposition chamber and containing materials for evaporation. The apparatus also includes a heating unit having first and second heat sources for heating the crucible. A housing isolates the heat emitted from the heating unit and an outer wall anchors the crucible. A nozzle sprays the materials evaporated from the crucible. The first and second heat sources are positioned on first and second sides of the crucible, respectively, and are independently controlled to minimize the time required to stabilize the deposition rate.
摘要翻译：提供了一种用于沉积有机层的设备及其加热单元的控制方法。该装置包括位于沉积室中并包含用于蒸发的材料的坩埚。该装置还包括具有用于加热坩埚的第一和第二热源的加热单元。外壳隔离加热单元发出的热量，外壁将坩埚固定。喷嘴喷洒从坩埚蒸发的材料。第一和第二热源分别位于坩埚的第一和第二侧上，并且被独立地控制以最小化稳定沉积速率所需的时间。

8. 发明申请

US20070077357A1 Source for inorganic layer and method for controlling heating source thereof 审中-公开
标题翻译：无机层来源及其加热源的控制方法
公开(公告)号：US20070077357A1
公开(公告)日：2007-04-05
申请号：US11514318
申请日：2006-08-30
申请人： Min Jae Jeong , Do Geun Kim , Young Mook Choi
发明人： Min Jae Jeong , Do Geun Kim , Young Mook Choi
IPC分类号： C23C16/00
CPC分类号： C23C14/243 , C23C14/545
摘要： A deposition source for an inorganic layer and a method for controlling a heating source thereof capable of improving a deposition efficiency, preventing condensation of a nozzle, and/or precisely controlling the temperature by minimizing the time that is needed to reach a stabilization of a deposition rate. The deposition source includes: a heating unit including a heating source for applying heat to a crucible; a housing for isolating the heat emitted from the heating unit; an outer wall for anchoring the crucible; and a nozzle unit for spraying the deposition materials evaporated from the crucible. The heating unit includes a first unit and a second unit. The crucible is positioned between the first unit and the second unit, and the heating unit includes a first power source for supplying electric power to the first unit and a second power source for supplying electric power to the second unit.
摘要翻译：一种用于无机层的沉积源及其控制加热源的方法，其能够通过最小化达到沉积稳定所需的时间来提高沉积效率，防止喷嘴冷凝和/或精确地控制温度率。沉积源包括：加热单元，其包括用于向坩埚施加热量的加热源; 用于隔离从加热单元发出的热量的壳体; 用于锚定坩埚的外壁; 以及用于喷射从坩埚蒸发的沉积材料的喷嘴单元。加热单元包括第一单元和第二单元。坩埚位于第一单元和第二单元之间，并且加热单元包括用于向第一单元供电的第一电源和用于向第二单元供电的第二电源。

9. 发明授权

US07914621B2 Vapor deposition source and vapor deposition apparatus having the same 有权
标题翻译：蒸气沉积源及其蒸镀装置
公开(公告)号：US07914621B2
公开(公告)日：2011-03-29
申请号：US11342681
申请日：2006-01-31
申请人： Do Geun Kim , Myung Soo Huh , Seok Heon Jeong , Hee Cheol Kang , Kazuo Furuno
发明人： Do Geun Kim , Myung Soo Huh , Seok Heon Jeong , Hee Cheol Kang , Kazuo Furuno
IPC分类号： C23C16/00
CPC分类号： C23C14/243 , C23C14/24
摘要： A vapor deposition source has a reduced size by disposing a crucible, a heating portion, and a nozzle portion in one defined space. A vapor deposition apparatus deposits deposition materials on a substrate using the vapor deposition source. The vapor deposition source includes a housing, and the crucible is mounted in the housing for vaporizing the deposition materials. The heating portion is installed adjacent to the crucible in the housing for heating the crucible. The nozzle portion injects the vaporized deposition materials into a substrate disposed at an exterior of the housing through an injection nozzle. The vapor deposition source is manufactured in a smaller and lightweight form in comparison with conventional vapor deposition sources in which a crucible and a nozzle portion are arranged in different spaces. The diameter and number of injection nozzles of the invention are restricted to block radiant heat discharged from the vapor deposition source, so that deposition materials are uniformly deposited. Furthermore, the output power of a conveyer for conveying the vapor deposition source is reduced. In addition, a plurality of vapor deposition sources is arranged in a line to perform concentrated deposition of deposition materials so that quality of the resultant product is improved.
摘要翻译：气相沉积源通过在一个限定的空间内设置坩埚，加热部分和喷嘴部分而具有减小的尺寸。气相沉积设备使用蒸镀源将沉积材料沉积在基板上。气相沉积源包括壳体，并且坩埚安装在壳体中以使沉积材料蒸发。加热部分安装在坩埚附近，用于加热坩埚。喷嘴部分通过注射喷嘴将蒸发的沉积材料注入设置在外壳外部的基板中。与其中坩埚和喷嘴部分布置在不同空间中的常规气相沉积源相比，气相沉积源以更小和轻质的形式制造。本发明的注射喷嘴的直径和数量被限制为阻挡从蒸镀源排出的辐射热，从而均匀地沉积沉积材料。此外，用于输送气相沉积源的输送机的输出功率降低。此外，多个气相沉积源被排列成一行，以进行沉积材料的浓缩沉积，从而提高所得产品的质量。

10. 发明授权

US07834451B2 Film tray for fabricating flexible display 有权
标题翻译：用于制造柔性显示器的胶片托盘
公开(公告)号：US07834451B2
公开(公告)日：2010-11-16
申请号：US11512649
申请日：2006-08-29
申请人： Kyu Sung Lee , Do Geun Kim , Kwan Seop Song , Hee Cheol Kang
发明人： Kyu Sung Lee , Do Geun Kim , Kwan Seop Song , Hee Cheol Kang
IPC分类号： H01L23/34
CPC分类号： C23C14/50 , C23C14/042 , H01L51/0008 , H01L51/0097 , H01L51/56 , H01L2251/5338
摘要： A film tray for fabricating a flexible display, the film tray preventing a flexible substrate or film from sagging. The film tray includes a support plate and at least one pair of clamps, each clamp of the at least one pair of clamps located along an opposite edge of the support plate to fix a flexible film. A first clamp of the at least one pair clamps is aligned with a second clamp of the least one pair of clamps. Each clamp includes an open-shut part adapted to be opened to receive the flexible substrate or film and adapted to be shut to fix the flexible substrate or film and a support part separated from the open-shut part by a predetermined space to support the flexible substrate or film at a predetermined level when the open-shut part is closed.
摘要翻译：一种用于制造柔性显示器的胶片托盘，该胶片托盘防止柔性基底或胶片下垂。薄膜托盘包括支撑板和至少一对夹具，所述至少一对夹具的每个夹具沿着支撑板的相对边缘设置以固定柔性膜。至少一对夹具的第一夹具与至少一对夹具的第二夹具对齐。每个夹具包括适于打开以接收柔性基底或膜并且适于关闭以将柔性基底或膜固定的开闭部分和与开闭部分隔开预定空间的支撑部分，以支撑柔性基底基板或薄膜在开闭部分闭合时处于预定水平。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式