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1. 发明申请

US20130113119A1 SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM 有权
标题翻译：用于各向异性导电胶膜或单向导电胶粘剂的组合物的半导体器件
公开(公告)号：US20130113119A1
公开(公告)日：2013-05-09
申请号：US13667146
申请日：2012-11-02
申请人： Hyun Hee NAMKUNG , Jae Sun HAN , Hyun Wook KIM , Jin Young SEO , Kwang Jin JUNG , Dong Seon UH
发明人： Hyun Hee NAMKUNG , Jae Sun HAN , Hyun Wook KIM , Jin Young SEO , Kwang Jin JUNG , Dong Seon UH
IPC分类号： H01B1/12 , H01L23/482
CPC分类号： H01B1/124 , C08F230/02 , C08F2222/102 , C08L25/12 , C08L55/02 , C09J9/02 , C09J133/068 , H01B1/22 , H01L23/4828 , H01L24/29 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2924/07811 , H01L2924/15788 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.
摘要翻译：通过各向异性导电粘合剂组合物粘合的半导体器件，各向异性导电粘合剂组合物在聚合物粘合剂体系和固化体系之间的固体含量比为约40:60至约60:40，热膨胀系数为约150 ppm /℃以下，约100℃以下。

2. 发明申请

US20130161838A1 ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE 有权
标题翻译：各向异性导电膜和半导体器件
公开(公告)号：US20130161838A1
公开(公告)日：2013-06-27
申请号：US13721407
申请日：2012-12-20
申请人： Jae Sun HAN , Hyun Wook KIM , Hyun Hee NAMKUNG , Jin Young SEO , Kwang Jin JUNG , Dong Seon UH
发明人： Jae Sun HAN , Hyun Wook KIM , Hyun Hee NAMKUNG , Jin Young SEO , Kwang Jin JUNG , Dong Seon UH
IPC分类号： H01L23/482
CPC分类号： H01L23/4828 , C09J7/00 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2201/61 , C09J2433/00 , C09J2463/00 , H01L24/29 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/32225 , H01L2924/07811 , H01L2924/15788 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.
摘要翻译：通过各向异性导电膜结合的半导体器件，各向异性导电膜包括含有芴取代的苯氧基树脂的苯氧基树脂; 和包含芴取代的丙烯酸酯的自由基聚合性树脂。

3. 发明申请

US20130161566A1 SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM 有权
标题翻译：用于各向异性导电胶膜或单向导电胶粘剂的组合物的半导体器件
公开(公告)号：US20130161566A1
公开(公告)日：2013-06-27
申请号：US13724219
申请日：2012-12-21
申请人： Jin Young SEO , Hyun Wook KIM , Hyun Hee NAMKUNG , Kyung Il SUL , Dong Seon UH , Kwang Jin JUNG , Jae Sun HAN
发明人： Jin Young SEO , Hyun Wook KIM , Hyun Hee NAMKUNG , Kyung Il SUL , Dong Seon UH , Kwang Jin JUNG , Jae Sun HAN
IPC分类号： C09J9/02
CPC分类号： C09J9/02 , C08L33/14 , C08L75/04 , C09J123/0853 , H01B1/20
摘要： An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: Connection resistance increment (%)=(A−B)/A×100 (Expression 1) where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.
摘要翻译：电子装置包括作为连接材料的各向异性导电粘合膜，其中各向异性导电粘合膜在80℃和1MPa预压1秒后的流动性为50％以上，最后在180℃下压制。和3MPa 5秒，连接电阻增量大于0％但不大于25％，如式1所示：连接电阻增量（％）=（AB）/ A×100（表达式1）其中A为在80℃，1MPa，1秒预压，180℃，3MPa，5秒的最后压制后测定的连接电阻，B为在85℃的温度下进行可靠性评价后测定的连接电阻在预压和最终压制后250小时的湿度为85％。

4. 发明申请

US20140365903A1 METHOD AND APPARATUS FOR UNLOCKING TERMINAL 审中-公开
标题翻译：用于解锁终端的方法和装置
公开(公告)号：US20140365903A1
公开(公告)日：2014-12-11
申请号：US14290716
申请日：2014-05-29
申请人： Jin Young SEO
发明人： Jin Young SEO
IPC分类号： G06F3/0488 , G06F3/0481
CPC分类号： G06F3/04883
摘要： Provided are a method and a terminal for unlocking a locked mode of the terminal. The terminal may include a display to display a home screen in an unlocked mode and a lock screen in a locked mode, an appearance of the lock screen being the same as a home screen, a user interface to receive inputs to unlock the lock screen, and a controller configured to unlock the lock screen based on the received inputs. The input may be received when the lock screen is displayed on the display in the lock mode, the input having a prescribed pattern. When the prescribed pattern of the input corresponds to a previously stored unlocking pattern, the lock screen may be unlocked to display the home screen.
摘要翻译：提供一种用于解锁终端的锁定模式的方法和终端。终端可以包括用于以未锁定模式显示主屏幕的显示器和处于锁定模式的锁定屏幕，锁定屏幕的外观与主屏幕相同，用于接收用于解锁锁定屏幕的输入的用户界面，以及控制器，其被配置为基于所接收的输入来解锁所述锁定屏幕。当在锁定模式下在显示器上显示锁定屏幕时，可以接收输入，输入具有规定的图案。当输入的规定图案对应于先前存储的解锁图案时，锁定屏幕可以被解锁以显示主屏幕。

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