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1. 发明申请

US20100071847A1 Wafer bonding apparatus 审中-公开
标题翻译：晶圆接合装置
公开(公告)号：US20100071847A1
公开(公告)日：2010-03-25
申请号：US12461933
申请日：2009-08-28
申请人： Jae Bong Shin , Byung Joon Lee , Seung Dae Seok , Seung Woo Choi , Jung Hyeon Kim , Sang il Hong
发明人： Jae Bong Shin , Byung Joon Lee , Seung Dae Seok , Seung Woo Choi , Jung Hyeon Kim , Sang il Hong
IPC分类号： B29C65/00
CPC分类号： H01L21/67092 , H01L21/2007
摘要： It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.
摘要翻译：本发明的一个方面是提供一种具有按压装置的晶片接合装置，所述加压装置构造成将固定在定影装置中的晶片按压，其中所述定影装置构造成允许所述按压装置不干扰地挤压所述晶片。晶片接合装置可以包括上晶片和下晶片，构造成支撑上晶片和下晶片的支撑构件，在上晶片上的推动构件，以及定影装置，其构造成将推动构件固定到支撑构件，其中所述推动构件包括从所述上晶片的周边向外延伸的固定部，并且所述定影装置联接到所述固定部。本发明的另一方面是提供一种接合晶片的方法。

2. 发明申请

US20120118876A1 FLIP CHIP BONDING APPARATUS AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：卷芯片粘接设备及其制造方法
公开(公告)号：US20120118876A1
公开(公告)日：2012-05-17
申请号：US13289525
申请日：2011-11-04
申请人： Jung Hyun Cho , Yury Tolmachev , Sang Jean Jeon , Byung Joon Lee , Jae Bong Shin , Hyungjoon Kim , Moon Seok Kim
发明人： Jung Hyun Cho , Yury Tolmachev , Sang Jean Jeon , Byung Joon Lee , Jae Bong Shin , Hyungjoon Kim , Moon Seok Kim
IPC分类号： H05B6/10
CPC分类号： H05B6/10 , H01L24/75 , H01L24/81 , H05B6/14
摘要： According to example embodiments, a flip chip bonding apparatus includes a metal chamber, a stage in the metal chamber, and a planar antenna in the chamber. The stage may be configured to receive a circuit board having flip chips arranged thereon. The antenna may be configured to bond the flip chips to the circuit board by inductively heating the flip chips on the circuit board.
摘要翻译：根据示例性实施例，倒装芯片接合装置包括金属室，金属室中的台和室中的平面天线。该台可以被配置为接收其上布置有倒装芯片的电路板。天线可以被配置为通过感应加热电路板上的倒装芯片将倒装芯片连接到电路板。

3. 发明申请

US20120148994A1 HUMAN BODY PARTIAL MANIKIN 审中-公开
标题翻译：人体部分MANIKIN
公开(公告)号：US20120148994A1
公开(公告)日：2012-06-14
申请号：US13313248
申请日：2011-12-07
申请人： Takatsu Hori , Byung Joon Lee
发明人： Takatsu Hori , Byung Joon Lee
IPC分类号： G09B23/28
CPC分类号： G09B23/30
摘要： A human body partial manikin having the same flexibility, elasticity, and texture as the human body is provided. And a manikin which has a feeling when it is cut open by means of a scalpel or scissors, similar to a feeling when an actual operation is performed by using a human body and is optimum for the anatomical practice of an inguinal hernia is provided. Accordingly, the human body partial manikin includes a skin portion which represents a skin layer on the surface of a lower abdomen of a human body, an abdominal external oblique muscle portion, an abdominal internal oblique muscle portion, a transverse abdominal muscle portion, a fascia transversalis portion, a fascia extraperitoneal portion, a peritoneum portion, and an abdominal cavity portion toward the inside of the manikin, wherein these respective portions are formed of a silicone resin.
摘要翻译：提供具有与人体相同的柔韧性，弹性和质感的人体部分人体模型。并且提供了当通过手术刀或剪刀切开时具有感觉的人体模型，类似于当通过使用人体进行实际操作并且对于腹股沟疝的解剖实践是最佳的感觉时。因此，人体部分人体模型包括皮肤部分，其表示人体的下腹部的表面上的皮肤层，腹部外斜肌部分，腹内侧斜肌部分，横腹肌部分，筋膜横向部分，筋膜腹膜部分，腹膜部分和腹腔部分朝向人体模型内侧，其中这些部分由硅树脂形成。

4. 发明授权

US06769534B2 Apparatus for transferring printed circuit board 失效
标题翻译：印刷电路板转印装置
公开(公告)号：US06769534B2
公开(公告)日：2004-08-03
申请号：US10298561
申请日：2002-11-19
申请人： Byung Joon Lee
发明人： Byung Joon Lee
IPC分类号： B65G1510
CPC分类号： H05K13/0061
摘要： The present invention discloses an apparatus for transferring a printed circuit board in which printed circuit boards having various sizes can be transferred by using one transfer apparatus. The apparatus for transferring a printed circuit board includes: a base plate; a plurality of linear motion guides installed to both sides of the base plate with a constant distance; first and second linear motion blocks installed slidably to the linear motion guides; a conveyor means reached in good condition on frames of the first and second motion blocks and having first and second conveyors for moving/supporting the printed circuit board; driving means for driving the first and second conveyors, respectively; a width direction transfer means of the conveyor means comprising: servo motors; moving blocks connected to the servo motors and fixed to a lower portion of the conveyor frame; fixing blocks installed to both sides of the base plate and connected to the moving blocks; and ball screws for interconnecting the moving blocks and the fixing blocks.
摘要翻译：本发明公开了一种用于传送印刷电路板的装置，其中可以通过使用一个传送装置传送具有各种尺寸的印刷电路板。用于转印印刷电路板的设备包括：基板; 多个直线运动导向器，以一定的距离安装在基板的两侧; 第一和第二直线运动块可滑动地安装到线性运动引导件; 传送装置在第一和第二运动块的框架上达到良好状态，并且具有用于移动/支撑印刷电路板的第一和第二输送机; 用于分别驱动第一和第二输送机的驱动装置; 传送装置的宽度方向传送装置包括：伺服电动机; 移动块连接到伺服电机并固定到输送机框架的下部; 固定块安装在基板的两侧并连接到移动块; 以及用于互连移动块和固定块的滚珠丝杠。

5. 发明授权

US07549221B2 Mounting method of electronic components 失效
标题翻译：电子元器件的安装方法
公开(公告)号：US07549221B2
公开(公告)日：2009-06-23
申请号：US11452339
申请日：2006-06-14
申请人： Hyo Won Kim , Byung Joon Lee
发明人： Hyo Won Kim , Byung Joon Lee
IPC分类号： H05K3/30
CPC分类号： H05K3/0097 , H05K3/303 , H05K13/0061 , H05K13/085 , H05K2203/1476 , Y10T29/49117 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/5196 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187
摘要： Methods of mounting electronic components on a plurality of printed circuit boards simultaneously are provided. An exemplary method may include supplying a first printed circuit board to a first conveyor and then transferring the first printed circuit board to a second conveyor and simultaneously supplying a second printed circuit board to the first conveyor. The method may then include transferring the first printed circuit board to a third conveyor and the second printed circuit board to a third conveyor, and mounting electronic components on about half of the first printed circuit board by moving the first printed circuit board to one side and, simultaneously mounting electronic components on about half of the second printed circuit board. The method may then include sequentially transferring the first and second printed circuit boards to a fourth conveyor, and then sequentially discharging the first and second printed circuit boards.
摘要翻译：提供了将电子部件同时安装在多个印刷电路板上的方法。示例性方法可以包括将第一印刷电路板提供给第一传送器，然后将第一印刷电路板传送到第二传送器，并且同时将第二印刷电路板供应到第一传送器。该方法可以包括将第一印刷电路板转移到第三传送器，将第二印刷电路板转移到第三传送器，并且通过将第一印刷电路板移动到一侧将电子部件安装在第一印刷电路板的大约一半上，并且同时将电子部件安装在第二印刷电路板的大约一半上。该方法可以包括将第一和第二印刷电路板顺序地传送到第四输送机，然后顺序地排出第一和第二印刷电路板。

6. 发明授权

US07715317B2 Flow generation method for internet traffic measurement 有权
标题翻译：互联网流量测量流量生成方法
公开(公告)号：US07715317B2
公开(公告)日：2010-05-11
申请号：US10933930
申请日：2004-09-02
申请人： Jeong Sook Park , Seung Hyun Yoon , Hyung Hwan Kim , Chang Hoon Kim , Hyung Seok Chung , Byung Joon Lee , Taesang Choi , Tae Soo Chung
发明人： Jeong Sook Park , Seung Hyun Yoon , Hyung Hwan Kim , Chang Hoon Kim , Hyung Seok Chung , Byung Joon Lee , Taesang Choi , Tae Soo Chung
IPC分类号： H04L12/26
CPC分类号： H04L43/026
摘要： Provided is a flow generation method for Internet traffic measurement. In the flow generation method, dependency between packet collecting time and flow generating time is removed using a virtual timer and a flow generation completion processing interval is controlled to skip by a unit time in response to a user's request. Also, a fragmented packet processing method is selectively used at need and a FIN timeout is applied selectively to a timeout mechanism used in flow generation completion. Thereby, this invention can improve accuracy and efficiency of Internet traffic measurement.
摘要翻译：提供了一种用于互联网流量测量的流生成方法。在流生成方法中，使用虚拟定时器去除分组收集时间和流生成时间之间的依赖关系，并且响应于用户的请求，控制流生成完成处理间隔以单位时间跳过。此外，根据需要选择性地使用分段分组处理方法，并且选择性地对用于流生成完成的超时机制应用FIN超时。因此，本发明可以提高互联网流量测量的准确性和效率。

7. 发明申请

US20080112549A1 METHOD AND SYSTEM FOR PROCESSING BILLING OF INCLUDING QOS INFORMATION 审中-公开
标题翻译：包括QOS信息处理结算的方法和系统
公开(公告)号：US20080112549A1
公开(公告)日：2008-05-15
申请号：US11940776
申请日：2007-11-15
申请人： Seung Hyun Yoon , You Hyeon Jeong , Byung Joon Lee , Hyung Seok Chung
发明人： Seung Hyun Yoon , You Hyeon Jeong , Byung Joon Lee , Hyung Seok Chung
IPC分类号： H04M15/10
CPC分类号： H04M15/00 , H04L12/14 , H04L12/1485 , H04M15/10 , H04M15/80 , H04M15/8016 , H04M2215/74 , H04M2215/7414
摘要： A method and system for processing billing of including QoS information are provided. In the method, a call is initiated by transmitting/receiving packets directly to/from an opponent terminal after signaling with the opponent terminal using a session initiation protocol through the signaling server. Then, QoS of the call is measured while communicating with the opponent terminal. A billing process is performed of including the QoS measuring result by transmitting the QoS measuring result to the signaling server after the call established to the opponent terminal is terminated.
摘要翻译：提供了一种用于处理包括QoS信息的计费的方法和系统。在该方法中，通过使用通过信令服务器的会话发起协议与对手终端进行信令之后，直接向对手终端发送/接收分组，从而发起呼叫。然后，在与对方终端通信时测量呼叫的QoS。在终止对方终端的呼叫之后，通过将QoS测量结果发送给信令服务器来执行包括QoS测量结果的计费处理。

8. 发明授权

US07082680B2 Mounting method of electronic components 失效
标题翻译：电子元器件的安装方法
公开(公告)号：US07082680B2
公开(公告)日：2006-08-01
申请号：US10295834
申请日：2002-11-18
申请人： Hyo Won Kim , Byung Joon Lee
发明人： Hyo Won Kim , Byung Joon Lee
IPC分类号： H05K3/30
CPC分类号： H05K3/0097 , H05K3/303 , H05K13/0061 , H05K13/085 , H05K2203/1476 , Y10T29/49117 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/5196 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187
摘要： Mounting methods of electronic components in which the electronic components are mounted on plural printed circuit boards are disclosed. An exemplary method includes: supplying a printed circuit board on a first conveyor; transferring the printed circuit board to the third conveyor and simultaneously, transferring the printed circuit board transferred to the first conveyor to the second conveyor; mounting the electronic components to about half-portion of the printed circuit board by moving the printed circuit board to one side and simultaneously, mounting the electronic components to about half-portion from the original position of the printed circuit board; and transferring the printed circuit board to a fourth conveyor, simultaneously transferring the printed circuit board to the second conveyor to the third conveyor and then discharging the printed circuit boards sequentially.
摘要翻译：公开了将电子部件安装在多个印刷电路板上的电子部件的安装方法。一种示例性方法包括：在第一输送机上提供印刷电路板; 将印刷电路板转移到第三传送器并同时将传送到第一传送器的印刷电路板传送到第二传送器; 通过将印刷电路板移动到一侧并同时将电子部件安装到印刷电路板的大约半部分到电子印刷电路板的原始位置的大约一半的位置; 并将印刷电路板传送到第四传送器，同时将印刷电路板传送到第二传送器到第三传送器，然后顺序排出印刷电路板。

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