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    • 4. 发明申请
    • Thin wear resistent coating
    • 薄耐磨涂层
    • US20070178330A1
    • 2007-08-02
    • US11429450
    • 2006-05-08
    • Jacob SjolenTommy LarssonLennart Karlsson
    • Jacob SjolenTommy LarssonLennart Karlsson
    • B32B19/00B32B15/04
    • C23C30/00C23C14/0641C23C28/042C23C28/044C23C28/048
    • The present invention relates to a cutting tool insert, solid end mill, or drill, comprising a substrate and a coating. The coating is composed of one or more layers of refractory compounds of which at least one layer comprises a h-Me1Me2X phase, where Me1 is one or several of the elements V, Cr, Nb, and Ta and Me2 is one or several of the elements Ti, Zr, Hf, Al, and Si and X is one or several of the elements N, C, O or B. The ratio R=(at-% X)/(at-% Me1+at-% Me2) of the h-MelMe2X phase is between 0.5 and 1.0, preferably between 0.8 and 1.0 and X contains less than 30 at-% of O+B. This invention is particularly useful in metal cutting applications where the chip thickness is small and the work material is hard e.g. copy milling using solid end mills, insert milling cutters or drilling of hardened steels.
    • 本发明涉及一种包括基底和涂层的切削工具刀片,立式立铣刀或钻头。 涂层由一层或多层难熔化合物组成,其中至少一层包含h-Me1Me2X相,其中Me1是元素V,Cr,Nb和Ta中的一种或几种,Me2是一种或几种 元素Ti,Zr,Hf,Al和Si,X是元素N,C,O或B中的一种或几种。比率R =(at-%X)/(at%%Me1 + at-%Me2) 的H-MeMeMe 2 X相为0.5〜1.0,优选为0.8〜1.0,X为低于30原子%的O + B。 本发明在金属切割应用中特别有用,其中芯片厚度小并且工件材料是硬的。 使用固体立铣刀复制铣削,插入铣刀或硬化钢的钻孔。
    • 5. 发明授权
    • Thin wear resistant coating
    • 薄耐磨涂层
    • US08507108B2
    • 2013-08-13
    • US11429450
    • 2006-05-08
    • Tommy LarssonLennart Karlsson
    • Tommy LarssonLennart Karlsson
    • B32B9/00
    • C23C30/00C23C14/0641C23C28/042C23C28/044C23C28/048
    • The present invention relates to a cutting tool insert, solid end mill, or drill, comprising a substrate and a coating. The coating is composed of one or more layers of refractory compounds of which at least one layer comprises a h-Me1Me2X phase, where Me1 is one or several of the elements V, Cr, Nb, and Ta and Me2 is one or several of the elements Ti, Zr, Hf, Al, and Si and X is one or several of the elements N, C, O or B. The ratio R=(at-% X)/(at-% Me1+at-% Me2) of the h-MelMe2X phase is between 0.5 and 1.0, preferably between 0.8 and 1.0 and X contains less than 30 at-% of O+B. This invention is particularly useful in metal cutting applications where the chip thickness is small and the work material is hard e.g. copy milling using solid end mills, insert milling cutters or drilling of hardened steels.
    • 本发明涉及一种包括基底和涂层的切削工具刀片,立式立铣刀或钻头。 涂层由一层或多层难熔化合物组成,其中至少一层包含h-Me1Me2X相,其中Me1是元素V,Cr,Nb和Ta中的一种或几种,Me2是一种或几种 元素Ti,Zr,Hf,Al和Si,X是元素N,C,O或B中的一种或几种。比率R =(at-%X)/(at%%Me1 + at-%Me2) 的H-MeMeMe 2 X相为0.5〜1.0,优选为0.8〜1.0,X为低于30原子%的O + B。 本发明在金属切割应用中特别有用,其中芯片厚度小并且工件材料是硬的。 使用固体立铣刀复制铣削,插入铣刀或硬化钢的钻孔。