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1. 发明授权

US09679188B2 Fingerprint sensor packaging module and manufacturing method thereof 有权
公开(公告)号：US09679188B2
公开(公告)日：2017-06-13
申请号：US14991550
申请日：2016-01-08
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Wei-Ting Lin
IPC分类号： G06K9/00 , H05K3/32 , H05K1/18
CPC分类号： G06K9/00053 , G06K9/0004 , H05K1/181 , H05K1/187 , H05K3/32 , H05K2201/10151 , H05K2203/1305
摘要： A fingerprint sensor packaging module includes a light-pervious cover layer, a conductive pattern layer on the light-pervious cover layer, a finger sensing chip on the conductive pattern layer, a circuit board on the light-pervious cover layer, and a package member. The conductive pattern layer includes a plurality of pads. The fingerprint sensing chip is electrically connected to the conductive pattern layer by contacting to the pads. The circuit board is electrically connected to the conductive pattern layer and has a hole and the hole exposes the fingerprint sensing chip. The fingerprint sensing chip is disposed in the hole. The package member disposed in the hole and at least cover the fingerprint sensing chip.

2. 发明授权

US09553062B1 Fingerprint identification device 有权
标题翻译：指纹识别装置
公开(公告)号：US09553062B1
公开(公告)日：2017-01-24
申请号：US15059920
申请日：2016-03-03
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Chen-Chih Fan , Wei-Ting Lin , Shih-Chun Kuo
IPC分类号： H01L27/14 , H01L29/82 , H01L29/84 , H01L23/00 , G06K9/00
CPC分类号： H01L24/08 , G06K9/0002 , H01L2224/02372
摘要： A fingerprint identification device includes a first dielectric layer, a fingerprint sensing chip, a packaging layer, a first redistribution layer, a second dielectric layer, a second redistribution layer, and a third dielectric layer. The fingerprint sensing chip is disposed on the first dielectric layer and has a sensing transmission pad. The packaging layer defines a first via hole and covers the first dielectric layer and fingerprint sensing chip. Disposed on the packaging layer, the first redistribution layer contacts a drive transmission pad via the first via hole. The second dielectric layer defines a second via hole and covers the packaging layer and the first redistribution layer. Disposed on the second dielectric layer, the second redistribution layer defines a looped pattern, in addition to connect electrically with the first redistribution layer via the second via hole. The third dielectric layer covers the second dielectric layer and second redistribution layer.
摘要翻译：指纹识别装置包括第一介电层，指纹感测芯片，封装层，第一再分布层，第二介电层，第二再分配层和第三介电层。指纹感测芯片设置在第一电介质层上并具有传感传输垫。包装层限定第一通孔并且覆盖第一介电层和指纹感测芯片。第一再分配布置在包装层上，经由第一通孔与驱动传递垫接触。第二电介质层限定第二通孔并且覆盖封装层和第一再分配层。除了通过第二通孔与第一再分布层电连接之外，第二再分配层设置在第二介电层上，限定环形图案。第三电介质层覆盖第二电介质层和第二再分配层。

3. 发明申请

US20160224775A1 ELECTRONIC APPARATUS HAVING FINGERPRINT SENSOR OPERATING IN VECTOR MODE 审中-公开
标题翻译：具有在矢量模式下操作的指纹传感器的电子设备
公开(公告)号：US20160224775A1
公开(公告)日：2016-08-04
申请号：US15003991
申请日：2016-01-22
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Wei-Ting Lin
IPC分类号： G06F21/32 , G06T7/60 , G06K9/52 , G06K9/00 , G06T7/20
CPC分类号： G06F21/32 , G06F3/03547 , G06F3/038 , G06F2203/0338 , G06K9/00355
摘要： An electronic apparatus includes a fingerprint sensor and an operation unit. The fingerprint sensor senses fingerprint images of a finger at different time instants. In a vector mode, the operation unit determines one or multiple moving directions of the finger according to the fingerprint images to generate a motion vector signal. The electronic apparatus executes a specific function according to the motion vector signal. The specific function is selected from a group consisting of a homepage key function, a function key function, and an unlocking function.
摘要翻译：电子设备包括指纹传感器和操作单元。指纹传感器在不同时刻感测手指的指纹图像。在向量模式中，操作单元根据指纹图像确定手指的一个或多个移动方向以产生运动矢量信号。电子装置根据运动矢量信号执行特定的功能。该特定功能从由主页键功能，功能键功能和解锁功能组成的组中选择。

4. 发明申请

US20180336393A1 FINGERPRINT SENSING UNIT 审中-公开
公开(公告)号：US20180336393A1
公开(公告)日：2018-11-22
申请号：US16050653
申请日：2018-07-31
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Wei-Ting Lin , Shih-Chun Kuo
IPC分类号： G06K9/00 , H01L23/60 , H01L23/00 , H01L25/065 , H01L23/31
CPC分类号： G06K9/00053 , G06K9/00013 , H01L23/3121 , H01L23/60 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/13082 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/29011 , H01L2224/32225 , H01L2224/48227 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/81191 , H01L2224/81193 , H01L2224/8185 , H01L2224/83192 , H01L2224/83851 , H01L2924/00014 , H01L2924/15158 , H01L2924/00012 , H01L2224/45099
摘要： A fingerprint sensing unit includes a carrier substrate, a fingerprint sensing chip on an upper surface of the carrier substrate, a molding layer, a light-pervious cover layer on the molding layer, and an adhesive layer between the light-pervious cover layer and the molding layer. The fingerprint sensing chip is electrically connected to the carrier substrate. The molding layer covers the fingerprint sensing chip.

5. 发明授权

US10061965B2 Fingerprint sensing unit and fingerprint sensing module 有权
公开(公告)号：US10061965B2
公开(公告)日：2018-08-28
申请号：US15156950
申请日：2016-05-17
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Wei-Ting Lin , Shih-Chun Kuo
IPC分类号： G06K9/00 , H01L23/60 , H01L23/31 , H01L23/00 , H01L25/065
CPC分类号： G06K9/00053 , G06K9/00013 , H01L23/3121 , H01L23/60 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/13082 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/29011 , H01L2224/32225 , H01L2224/48227 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/81191 , H01L2224/81193 , H01L2224/8185 , H01L2224/83192 , H01L2224/83851 , H01L2225/06513 , H01L2924/00014 , H01L2924/15158 , H01L2924/00012 , H01L2224/45099
摘要： A fingerprint sensing unit includes a carrier substrate, a fingerprint sensing chip on an upper surface of the carrier substrate, a molding layer, a light-pervious cover layer on the molding layer, and an adhesive layer between the light-pervious cover layer and the molding layer. The fingerprint sensing chip is electrically connected to the carrier substrate. The molding layer covers the fingerprint sensing chip.

6. 发明授权

US09684811B2 Suspended capacitive fingerprint sensor and method for manufacturing the same 有权
公开(公告)号：US09684811B2
公开(公告)日：2017-06-20
申请号：US15044666
申请日：2016-02-16
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Wei-Ting Lin
IPC分类号： H01L21/00 , G06K9/00
CPC分类号： G06K9/0002 , G06K9/00053
摘要： A suspended capacitive fingerprint sensor includes a substrate, capacitive sensing units disposed on the substrate and one or more insulation protection layer. Each of the capacitive sensing units includes a fixed electrode, a suspended electrode, and a chamber between the fixed electrode and the suspended electrode. The insulation protection layer covers the capacitive sensing units, so that the capacitive sensing units sense a fingerprint of a finger above the insulation protection layer. A method for manufacturing the suspended capacitive fingerprint sensor is also provided.

7. 发明申请

US20170091517A1 FINGERPRINT SENSOR PACKAGING MODULE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20170091517A1
公开(公告)日：2017-03-30
申请号：US14991550
申请日：2016-01-08
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Wei-Ting Lin
IPC分类号： G06K9/00 , H05K1/18 , H05K3/32
CPC分类号： G06K9/00053 , G06K9/0004 , H05K1/181 , H05K1/187 , H05K3/32 , H05K2201/10151 , H05K2203/1305
摘要： A fingerprint sensor packaging module includes a light-pervious cover layer, a conductive pattern layer on the light-pervious cover layer, a finger sensing chip on the conductive pattern layer, a circuit board on the light-pervious cover layer, and a package member. The conductive pattern layer includes a plurality of pads. The fingerprint sensing chip is electrically connected to the conductive pattern layer by contacting to the pads. The circuit board is electrically connected to the conductive pattern layer and has a hole and the hole exposes the fingerprint sensing chip. The fingerprint sensing chip is disposed in the hole. The package member disposed in the hole and at least cover the fingerprint sensing chip.

8. 发明申请

US20160275333A1 SUSPENDED CAPACITIVE FINGERPRINT SENSOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：悬挂电容指纹传感器及其制造方法
公开(公告)号：US20160275333A1
公开(公告)日：2016-09-22
申请号：US15044666
申请日：2016-02-16
申请人： J-METRICS TECHNOLOGY Co., Ltd.
发明人： Wei-Ting Lin
IPC分类号： G06K9/00 , G06F3/041 , G06F3/044
CPC分类号： G06K9/0002 , G06K9/00053
摘要： A suspended capacitive fingerprint sensor includes a substrate, capacitive sensing units disposed on the substrate and one or more insulation protection layer. Each of the capacitive sensing units includes a fixed electrode, a suspended electrode, and a chamber between the fixed electrode and the suspended electrode. The insulation protection layer covers the capacitive sensing units, so that the capacitive sensing units sense a fingerprint of a finger above the insulation protection layer. A method for manufacturing the suspended capacitive fingerprint sensor is also provided.
摘要翻译：悬挂的电容指纹传感器包括基板，设置在基板上的电容感测单元和一个或多个绝缘保护层。每个电容感测单元包括固定电极，悬置电极和固定电极与悬置电极之间的室。绝缘保护层覆盖电容感测单元，使得电容感测单元感测绝缘保护层上方的手指的指纹。还提供了一种用于制造悬挂的电容式指纹传感器的方法。

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