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    • 1. 发明授权
    • Method of producing large-area membrane masks
    • 生产大面积膜面膜的方法
    • US06455429B1
    • 2002-09-24
    • US09669469
    • 2000-09-25
    • Jörg ButschkeFlorian LetzkusElisabeth PentekerReinhard SpringerBernd HöfflingerHans Löschner
    • Jörg ButschkeFlorian LetzkusElisabeth PentekerReinhard SpringerBernd HöfflingerHans Löschner
    • H01L21302
    • G03F1/20G03F1/22
    • Inventive methods are provided for the production of large-area membrane masks, wherein an inexpedient mechanical excessive strain on the membrane or of the membrane layer/etching stop layer/supporting wafer system or the resulting breaking of the components is avoided, which excessive strain occurs particularly due to the employment of an etching cell or generally due to the thin semiconductor layers. The stripping of the semiconductor support layer is preferably performed in two partial steps that are carried out in a mechanically sealed etching cell or with a protective coating, or that one partial step is performed with an etching cell and one with a protective coating, or that the stripping of the semiconductor support layer is performed in a mechanically sealed etching cell initially with a supporting grid and that the supporting grid is removed only after withdrawal from the etching cell.
    • 提供了用于生产大面积膜掩模的本发明的方法,其中避免了膜或膜层/蚀刻停止层/支撑晶片系统上的不适当的机械过度应变或所得到的部件断裂,这种过度的应变发生 特别是由于使用蚀刻单元或通常由于薄的半导体层而导致。 半导体支撑层的剥离优选以机械密封的蚀刻池或保护涂层中进行的两个部分步骤进行,或者用蚀刻池和一个保护涂层进行一个部分步骤,或 半导体支撑层的剥离在最初具有支撑栅格的机械密封蚀刻池中执行,并且仅在从蚀刻单元退出之后才移除支撑栅。