专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07120030B2 Housing structure of vehicle-mounted electronic equipment 有权
标题翻译：车载电子设备的住房结构
公开(公告)号：US07120030B2
公开(公告)日：2006-10-10
申请号：US10665489
申请日：2003-09-22
申请人： Isao Azumi , Tetsushi Watanabe
发明人： Isao Azumi , Tetsushi Watanabe
IPC分类号： H05K5/00
CPC分类号： B60R16/0239 , H05K5/061 , H05K5/062 , H05K7/20436 , H05K7/20854
摘要： A housing structure for vehicle-mounted electronic equipment according to the present invention is superior in heat dissipation, water resistance, heat resistance and vibration resistance. An electronic substrate is temporarily fixed onto an annular circumferential wall part of a cover made of fire retardant resin, and connector contact pins are soldered to the electronic substrate. The electronic substrate is fixed and held between a heat-transfer base and the annular circumferential wall part with screws, and heat generated by a heating part on the electronic substrate is transferred to the base and dissipated. The annular circumferential wall part has an annular groove in which a sealant is inserted, and the base has an annular protrusion snapped into the annular groove.
摘要翻译：根据本发明的用于车载电子设备的壳体结构在散热性，耐水性，耐热性和抗振性方面优异。电子基板临时固定在由阻燃树脂制成的盖的环形周壁部分上，并且连接器接触销焊接到电子基板。电子基板通过螺钉固定并保持在传热基座和环形周壁部分之间，并且由电子基板上的加热部分产生的热量传递到基座并消散。环形周壁部分具有环形槽，密封剂插入其中，并且基部具有环形突起，该环形突起卡入环形槽中。

2. 发明授权

US08670240B2 Board housing case for vehicle-mounted electronic device 有权
标题翻译：车载电子设备板壳
公开(公告)号：US08670240B2
公开(公告)日：2014-03-11
申请号：US13253435
申请日：2011-10-05
申请人： Koji Hashimoto , Isao Azumi , Yusuke Matsuda , Yoshitake Nishiuma
发明人： Koji Hashimoto , Isao Azumi , Yusuke Matsuda , Yoshitake Nishiuma
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K7/20854 , H05K7/20481
摘要： A circuit board is hermetically-sealed and housed in a steel case that is composed of a metal base and a metal cover, the cover disposed opposite to a first board surface has a tall flat portion disposed opposite to a connector housing and a short flat portion disposed opposite to a heating component, and the heat generated from the heating component is directly transferred to a heat transfer base portion of the base via a heat transfer mechanism and a heat transfer filling material. Surface finishing in which the coefficients of heat radiation are mutually 0.7 to 1.0 is applied to the surface of the heating component and the opposite inner surface of the cover, and radiation and heat transfer are efficiently performed to the short flat portion of the cover.
摘要翻译：电路板被密封并容纳在由金属基座和金属盖构成的钢壳中，与第一板表面相对设置的盖具有与连接器壳体相对设置的高平坦部分和短平坦部分与加热部件相对设置，并且从加热部件产生的热量经由传热机构和传热填充材料直接传递到基部的传热基部。散热系数相互为0.7〜1.0的表面处理被施加到加热部件的表面和盖的相反的内表面，并且有效地对盖的短平坦部进行辐射和热传递。

3. 发明授权

US08520397B2 Waterproof electronic equipment and assembly method thereof 有权
标题翻译：防水电子设备及其组装方法
公开(公告)号：US08520397B2
公开(公告)日：2013-08-27
申请号：US13022984
申请日：2011-02-08
申请人： Isao Azumi , Koji Hashimoto
发明人： Isao Azumi , Koji Hashimoto
IPC分类号： H05K5/00
CPC分类号： H05K7/20854 , H05K5/0052 , H05K5/0069
摘要： Seal surfaces in three directions of a base and a cover are mutually fitted as a first seal part in combination of concave threads and convex threads, and sandwich three sides of a circuit board between an innermost peripheral part convex thread at the base side and an innermost peripheral part concave thread at the cover side. A connector member having a second seal part is fixed to one side of the circuit board, a concavo-convex seal surface between the base and the connector member is located on a low step surface, and the concave and convex threads on the seal surface of the connector member provided on the base pass the concave and convex threads of the seal surface in the three directions each other to be continuous.
摘要翻译：将底座和盖子的三个方向的密封面相互配合为作为第一密封部分的凹入螺纹和凸形螺纹的组合，并将电路板的三侧夹在底侧的最内侧周边部分凸起线和最内侧外围部分凹线在封面。具有第二密封部的连接器部件固定在电路板的一侧，底座与连接器部件之间的凹凸密封面位于低台阶面上，密封面的凹凸线设置在基座上的连接器部件将密封表面的凹凸线沿三个方向相互连通。

4. 发明授权

US09101066B2 Casing and assembling method of casing 有权
标题翻译：套管套管组装方法
公开(公告)号：US09101066B2
公开(公告)日：2015-08-04
申请号：US13788855
申请日：2013-03-07
申请人： Isao Azumi , Koji Hashimoto
发明人： Isao Azumi , Koji Hashimoto
IPC分类号： H05K7/00 , H05K5/06 , H05K5/00
CPC分类号： H05K5/069 , H05K5/0052 , H05K5/062 , Y10T29/49213
摘要： An outer circumferential groove filled with a seal material and an opposing surface portion are provided to a fit portion of a case. A tray portion opposing the opposing surface portion and an outer circumferential protruding portion entering the outer circumferential groove are provided to the fit portion of a cover. Master dimensions are set so that an outer clearance A0 between the outer circumferential groove and the outer circumferential protruding portion is always larger than an inner clearance C0 between the former and the latter when center positions of the cover and the case coincide with each other.
摘要翻译：填充有密封材料的外周槽和相对的表面部分设置在壳体的配合部分。在盖的配合部分设置有与相对表面部分相对的托盘部分和进入外周槽的外周突出部分。设定主尺寸，使得当外壳和外周突出部之间的外部间隙A0总是大于前者与后者之间的内部间隙C0时，盖和壳体的中心位置彼此重合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式