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    • 1. 发明授权
    • Polishing of sapphire with composite slurries
    • 用复合浆料抛光蓝宝石
    • US08721917B2
    • 2014-05-13
    • US12286960
    • 2008-10-03
    • Isaac K. CherianAbhaya K. Bakshi
    • Isaac K. CherianAbhaya K. Bakshi
    • C09K13/00
    • C09K3/1463C09G1/02
    • Improved slurry compositions comprising a mixture of a first type of particles and a second type of abrasive particles dispersed within an aqueous medium, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire. These abrasive slurry compositions comprise a mixture of a first type of abrasive particles having a hardness that is harder than the surface being polished and a second type of abrasive particles have a hardness that is softer than the surface being polished, particularly mixtures of silicon carbide abrasive particles and silica abrasive particles, dispersed within an aqueous medium.
    • 改进的浆料组合物,其包含第一类型的颗粒和分散在水性介质中的第二类型磨料颗粒的混合物,以及用于使用化学机械平面化(CMP)工艺的磨料浆料组合物,特别是用于抛光蓝宝石的磨料浆料组合物。 这些磨料浆料组合物包含第一类磨料颗粒的混合物,该磨料颗粒的硬度比待抛光的表面硬,并且第二类磨料颗粒具有比被抛光表面更硬的硬度,特别是碳化硅磨料的混合物 颗粒和二氧化硅磨料颗粒分散在水性介质中。
    • 3. 发明申请
    • Polishing of sapphire with composite slurries
    • 用复合浆料抛光蓝宝石
    • US20090104851A1
    • 2009-04-23
    • US12286960
    • 2008-10-03
    • Isaac K. CherianAbhaya K. Bakshi
    • Isaac K. CherianAbhaya K. Bakshi
    • B24B7/20C09K3/14B24B1/00
    • C09K3/1463C09G1/02
    • Improved slurry compositions comprising a mixture of a first type of particles and a second type of abrasive particles dispersed within an aqueous medium, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire. These abrasive slurry compositions comprise a mixture of a first type of abrasive particles having a hardness that is harder than the surface being polished and a second type of abrasive particles have a hardness that is softer than the surface being polished, particularly mixtures of silicon carbide abrasive particles and silica abrasive particles, dispersed within an aqueous medium.
    • 改进的浆料组合物,其包含第一类型的颗粒和分散在水性介质中的第二类型磨料颗粒的混合物,以及用于使用化学机械平面化(CMP)工艺的磨料浆料组合物,特别是用于抛光蓝宝石的磨料浆料组合物。 这些磨料浆料组合物包含第一类磨料颗粒的混合物,该磨料颗粒的硬度比待抛光的表面硬,并且第二类磨料颗粒具有比被抛光表面更硬的硬度,特别是碳化硅磨料的混合物 颗粒和二氧化硅磨料颗粒分散在水性介质中。