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1. 发明授权

US07499278B2 Method and apparatus for dissipating heat from an electronic device 有权
标题翻译：从电子设备散热的方法和装置
公开(公告)号：US07499278B2
公开(公告)日：2009-03-03
申请号：US11229227
申请日：2005-09-16
申请人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
发明人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/427 , F28D15/0241 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator. The evaporator is then able to evaporate the liquid coolant and remove thermal energy from the processor.
摘要翻译：本发明的方法和装置从电子装置散发热量，为高发热电子器件提供有效且普遍应用的热解决方案。该装置包括蒸发器，冷凝器，加热器和导管。蒸发器，冷凝器和管道限定了具有部分填充有液体冷却剂的内部容积的封闭系统。蒸发器热连接到诸如处理器的电子设备，并且通过蒸发液体冷却剂来从处理器去除热能。当设备被定向成使得没有液体冷却剂与蒸发器接触时，加热器向冷却剂施加热能直到冷却剂开始沸腾。沸腾液体冷却剂会在液体冷却剂内形成气泡。通过沸腾产生的气泡的体积提高了封闭系统内的液体冷却剂的水平，直到液体冷却剂与蒸发器接触。蒸发器然后能够蒸发液体冷却剂并从处理器去除热能。

2. 发明授权

US06971442B2 Method and apparatus for dissipating heat from an electronic device 失效
标题翻译：从电子设备散热的方法和装置
公开(公告)号：US06971442B2
公开(公告)日：2005-12-06
申请号：US09897793
申请日：2001-06-29
申请人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
发明人： Ioan Sauciuc , Ward Scott , Gregory M. Chrysler
IPC分类号： F28D15/02 , F28D15/06 , H01L23/427 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0241 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： The method and apparatus of the present invention dissipate heat from an electronic device to provide an efficient and universally applied thermal solution for high heat generating electronic devices. The apparatus comprises an evaporator, a condenser, a heater and conduits. The evaporator, condenser, and conduits define a closed system that has an interior volume which is partially filled with a liquid coolant. The evaporator is thermally connected to an electronic device, such as a processor, and removes thermal energy from the processor by evaporating the liquid coolant. When the apparatus is oriented such that no liquid coolant is in contact with the evaporator, the heater applies thermal energy to the coolant until the coolant begins to boil. Boiling the liquid coolant causes bubbles to form within the liquid coolant. The volume of the bubbles generated by boiling raises the level of the liquid coolant within the closed system until the liquid coolant comes into contact with the evaporator. The evaporator is then able to evaporate the liquid coolant and remove thermal energy from the processor.
摘要翻译：本发明的方法和装置从电子装置散发热量，为高发热电子器件提供有效且普遍应用的热解决方案。该装置包括蒸发器，冷凝器，加热器和导管。蒸发器，冷凝器和管道限定了具有部分填充有液体冷却剂的内部容积的封闭系统。蒸发器热连接到诸如处理器的电子设备，并且通过蒸发液体冷却剂来从处理器去除热能。当设备被定向成使得没有液体冷却剂与蒸发器接触时，加热器向冷却剂施加热能直到冷却剂开始沸腾。沸腾液体冷却剂会在液体冷却剂内形成气泡。通过沸腾产生的气泡的体积提高了封闭系统内的液体冷却剂的水平，直到液体冷却剂与蒸发器接触。蒸发器然后能够蒸发液体冷却剂并从处理器去除热能。

3. 发明授权

US07779638B2 Localized microelectronic cooling apparatuses and associated methods and systems 有权
标题翻译：本地化微电子冷却装置及相关方法和系统
公开(公告)号：US07779638B2
公开(公告)日：2010-08-24
申请号：US11319297
申请日：2005-12-27
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： F25B21/02
CPC分类号： F25B21/02 , F25D19/006 , H01L23/3677 , H01L23/38 , H01L2224/16 , H01L2924/12044
摘要： Apparatuses and associated methods and systems to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a microelectronic cooling apparatus comprising a microelectronic device thermally coupled to one or more thermally conductive pin(s) provides cooling to one or more hot spot(s) of the microelectronic device.
摘要翻译：通常描述用于向微电子器件提供局部冷却的装置和相关方法和系统。在这方面，根据一个示例性实施例，包括热耦合到一个或多个导热引脚的微电子器件的微电子冷却装置向微电子器件的一个或多个热点提供冷却。

4. 发明申请

US20080006389A1 Preventing burst-related hazards in microelectronic cooling systems 审中-公开
标题翻译：防止微电子冷却系统中爆炸相关危害
公开(公告)号：US20080006389A1
公开(公告)日：2008-01-10
申请号：US11477095
申请日：2006-06-27
申请人： Ioan Sauciuc , Gregory M. Chrysler , Je-Young Chang , Ravi Prasher
发明人： Ioan Sauciuc , Gregory M. Chrysler , Je-Young Chang , Ravi Prasher
IPC分类号： A23C3/02 , H01L23/34
CPC分类号： F28D15/00 , F28F2250/06 , F28F2265/12 , H05K7/20272
摘要： Devices and associated methods to prevent burst-related hazards by providing pressure relief in a microelectronic cooling system are generally described. In this regard, according to one example embodiment, a pump outlet line includes at least one pressure relief indentation to rupture along the indentation at a selected pressure to prevent burst-related hazards in a microelectronic cooling system.
摘要翻译：通常描述了通过在微电子冷却系统中提供压力释放来防止爆发相关危害的装置和相关方法。在这方面，根据一个示例性实施例，泵出口管线包括至少一个压力释放压痕，以在选定的压力下沿着压痕破裂，以防止微电子冷却系统中的突发相关危险。

5. 发明授权

US06967840B2 Clearing of vapor lock in a microchannel cooling subsystem 失效
标题翻译：清除微通道冷却子系统中的气密锁
公开(公告)号：US06967840B2
公开(公告)日：2005-11-22
申请号：US10814051
申请日：2004-03-31
申请人： Gregory M. Chrysler , Ioan Sauciuc
发明人： Gregory M. Chrysler , Ioan Sauciuc
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods in accordance with the present invention provide a system to create turbulence inside microchannels of a microchannel cooling subsystem to disrupt vapor locks therein.
摘要翻译：根据本发明的装置和方法提供了一种在微通道冷却子系统的微通道内部产生紊流以破坏其中的蒸气锁的系统。

6. 发明授权

US07550901B2 Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using same 有权
标题翻译：压电式风扇，包含该压电风扇的冷却装置以及使用该微型电子装置的冷却方法
公开(公告)号：US07550901B2
公开(公告)日：2009-06-23
申请号：US11862194
申请日：2007-09-27
申请人： Gregory M. Chrysler , Ioan Sauciuc
发明人： Gregory M. Chrysler , Ioan Sauciuc
IPC分类号： H01L41/08 , F04D33/00
CPC分类号： F04D33/00
摘要： A piezoelectric fan includes a piezoelectric actuator patch (110, 210, 310) and a blade (120, 220, 320) attached to the piezoelectric actuator patch. The blade has a hole (121, 127, 221) in it, and a door (122, 128, 222) is adjacent to the hole and attached to the blade (as with a hinge (123, 129, 223)) such that the door is capable of opening and closing.
摘要翻译：压电风扇包括压电致动器贴片（110,210,310）和附接到压电致动器贴片的刀片（120,220,320）。叶片在其中具有孔（121,127,221），并且门（122,128,222）邻近孔并附接到叶片（如同铰链（123,129,223）），使得门能打开和关闭。

7. 发明授权

US07348665B2 Liquid metal thermal interface for an integrated circuit device 有权
标题翻译：用于集成电路器件的液态金属热接口
公开(公告)号：US07348665B2
公开(公告)日：2008-03-25
申请号：US10917702
申请日：2004-08-13
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： H01L23/46 , H01L23/473
CPC分类号： H01L23/42 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01068 , H01L2924/15311 , H01L2224/0401
摘要： A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.
摘要翻译：用于集成电路管芯的液态金属热接口。液态金属热界面可以设置在模具和另一传热元件之间，例如散热器或散热器。液体金属热界面包括与模具表面流体连通的液态金属，并且在模具表面上移动的液态金属将热量从模具传递到传热元件。传热元件的表面也可以与液态金属流体连通。描述和要求保护其他实施例。

8. 发明授权

US07259965B2 Integrated circuit coolant microchannel assembly with targeted channel configuration 有权
标题翻译：具有目标通道配置的集成电路冷却液微通道组件
公开(公告)号：US07259965B2
公开(公告)日：2007-08-21
申请号：US11101061
申请日：2005-04-07
申请人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory M. Chrysler , Ravi S. Prasher , Rajiv K. Mongia , Himanshu Pokharna , Eric DiStefano
发明人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory M. Chrysler , Ravi S. Prasher , Rajiv K. Mongia , Himanshu Pokharna , Eric DiStefano
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
摘要翻译：微通道结构中形成有微通道。微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。每个子通道具有大于第一宽高比的相应的第二宽高比。

9. 发明授权

US07243705B2 Integrated circuit coolant microchannel with compliant cover 有权
标题翻译：集成电路冷却剂微通道，带有合适的盖
公开(公告)号：US07243705B2
公开(公告)日：2007-07-17
申请号：US11069540
申请日：2005-03-01
申请人： Alan M. Myers , Je-Young Chang , Ravi Prasher , Ioan Sauciuc , Gregory M. Chrysler , Patrick D. Boyd , Chia-pin Chiu
发明人： Alan M. Myers , Je-Young Chang , Ravi Prasher , Ioan Sauciuc , Gregory M. Chrysler , Patrick D. Boyd , Chia-pin Chiu
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , H01L2924/0002 , H01L2924/00
摘要： An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
摘要翻译：一种装置包括其中形成有微通道的微通道结构。微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。该装置还包括位于微通道结构上的盖，以限定每个微通道的相应的上壁。盖子提供微通道的柔顺表面。

10. 发明授权

US06845622B2 Phase-change refrigeration apparatus with thermoelectric cooling element and methods 失效
标题翻译：具有热电冷却元件的相变制冷装置及方法
公开(公告)号：US06845622B2
公开(公告)日：2005-01-25
申请号：US10401376
申请日：2003-03-27
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： F25B21/02 , F28D15/02 , H01L35/00 , H01L35/30
CPC分类号： F25B21/02 , F25B2321/0212 , F28D15/0266 , F28D15/0275 , H01L35/00 , H01L35/30
摘要： A heat-transfer device has a sealed vapor chamber with a phase-change fluid therein, and a thermoelectric cooling (TEC) element with a cooled side in thermal contact with the vapor chamber and a heated side in contact with heat-dissipation fins. The TEC element decreases the temperature of the vapor chamber and increases the temperature of the fins for improved efficiency. The vapor chamber is defined between concentrically positioned tubes, and a tunnel region is located within the inner tube. Additional TEC elements within the tunnel region further dissipate heat. In two-phase natural convection embodiments, TEC elements may further cool liquid returning to the heat source. Parallel heat dissipation paths may also be provided. In a two-phase forced convection embodiment, a TEC element may further cool liquid returning to the heat source, and additional TEC elements may be provided on the condenser. In some embodiments, active feedback controls the amount of energy transferred by a TEC element.
摘要翻译：传热装置具有其中具有相变流体的密封蒸气室，以及具有与蒸气室热接触的冷却侧的热电冷却（TEC）元件和与散热翅片接触的加热侧。 TEC元件降低蒸气室的温度，并提高翅片的温度以提高效率。蒸汽室被定义在同心定位的管之间，隧道区位于内管内。隧道区域内的额外TEC元件进一步散热。在两相自然对流实施例中，TEC元件可以进一步冷却返回到热源的液体。还可以提供平行散热路径。在两相强制对流实施例中，TEC元件可以进一步冷却返回到热源的液体，并且可以在冷凝器上提供额外的TEC元件。在一些实施例中，主动反馈控制由TEC元件传送的能量的量。

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