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    • 5. 发明授权
    • Cross-hierarchy interconnect adjustment for power recovery
    • 电源恢复的跨层级互连调整
    • US09552451B1
    • 2017-01-24
    • US15055031
    • 2016-02-26
    • International Business Machines Corporation
    • Christopher J. BerryRicardo H. NigaglioniHaifeng QianSourav Saha
    • G06F17/00G06F17/50
    • G06F17/5072G06F17/5077G06F2217/06G06F2217/84
    • Embodiments relate to cross-hierarchy interconnect adjustment. An aspect includes receiving chip layout data corresponding to a chip design, wherein a first portion of a metal stack of the chip design is assigned to a first hierarchy and a second portion of the metal stack is assigned to a second hierarchy based on a contract between the first and second hierarchy. Another aspect includes determining an unused portion of the first portion of the metal stack. Another aspect includes moving an interconnect of the second hierarchy from the second portion of the metal stack that is assigned to the second hierarchy to the unused portion of the first portion of the metal stack in the chip layout data. Another aspect includes performing power recovery on the chip layout data after moving the interconnect based on an amount of slack margin generated in the chip design by the moving of the interconnect.
    • 实施例涉及跨层次互连调整。 一个方面包括接收对应于芯片设计的芯片布局数据,其中将芯片设计的金属堆叠的第一部分分配给第一层次,并且金属堆叠的第二部分基于第 第一和第二层次。 另一方面包括确定金属堆叠的第一部分的未使用部分。 另一方面包括将第二层次的互连从分配给第二层的金属堆叠的第二部分移动到芯片布局数据中的金属堆叠的第一部分的未使用部分。 另一方面包括基于通过互连的移动在芯片设计中产生的松弛余量的量来移动互连之后在芯片布局数据上执行功率恢复。