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1. 发明申请

US20220012917A1 PRINTED CIRCUIT BOARD ASSEMBLY DEFECT DETECTION 有权
公开(公告)号：US20220012917A1
公开(公告)日：2022-01-13
申请号：US16923120
申请日：2020-07-08
申请人： International Business Machines Corporation
发明人： Matthew S. Kelly , Sebastien Gilbert , Oswaldo Chacon
IPC分类号： G06T7/90 , G06T7/11 , G06T7/00 , G01N21/956 , H05K13/08
摘要： A method comprises obtaining a plurality of 2-dimensional gray scale images of a portion of a printed circuit board assembly. Each 2-dimensional gray scale image corresponds to one of a plurality of parallel planes intersecting the portion of the printed circuit board assembly at respective different locations. The method further comprises converting the plurality of 2-dimensional gray scale images into a color image. Each of the plurality of 2-dimensional gray scale images corresponds to and is used as input for a respective color channel of the color image. The method further comprises analyzing the color image to detect variation in color that indicates a defect; and outputting an alert indicating the defect in response to detecting the variation in color.

2. 发明授权

US10932363B2 Glass fiber coatings for improved resistance to conductive anodic filament formation 有权
公开(公告)号：US10932363B2
公开(公告)日：2021-02-23
申请号：US16536539
申请日：2019-08-09
申请人： International Business Machines Corporation
发明人： Bruce J. Chamberlin , Matthew S. Kelly , Scott B. King , Joseph Kuczynski
IPC分类号： H05K1/03 , C08J5/24 , C03C25/34 , C08J5/08 , C09D171/12
摘要： A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

3. 发明授权

US10768245B2 Compliant pin with self sensing deformation 有权
公开(公告)号：US10768245B2
公开(公告)日：2020-09-08
申请号：US16144585
申请日：2018-09-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Matthew S. Kelly , Joseph Kuczynski , Scott B. King , Bruce Chamberlin
IPC分类号： G01R31/04 , H01R12/58 , H01R13/74 , H01R43/20 , H05K3/30 , G01R31/70
摘要： A compliant pin system includes a pin having a compliant section including a first leg and an opposing second leg. A first plurality of contact members extend along the first leg. A second plurality of contact members extend along the second leg. A pin validation system is operatively connected to the first plurality of contact members and the second plurality of contact members. The pin validation system detects a presence of an electrical signal passing between corresponding pairs of the first plurality of contact members and the second plurality of contact members to determine an integrity of the compliant pin.

4. 发明申请

US20200012987A1 ADVISING AUDIT RATINGS IN A MULTIPLE-AUDITOR ENVIRONMENT 审中-公开
公开(公告)号：US20200012987A1
公开(公告)日：2020-01-09
申请号：US16030049
申请日：2018-07-09
申请人： International Business Machines Corporation
发明人： Paul A. Zulpa , Zhipeng Wang , Matthew S. Kelly , Feng Xue , Lin Zhao , WeiFeng Zhang , Jeffrey G. Komatsu
IPC分类号： G06Q10/06
摘要： A computer-implemented method includes assigning an auditor weight to each user of a plurality of users. A plurality of audit data is received from the plurality of users, where each audit data is associated with a respective user and includes a set of user ratings for an audit. Final ratings are generated for the audit, with a respective final rating for each item in the audit. Generating the final rating of a first item in the audit includes identifying, in the audit data, user ratings for the first item. The user ratings for the first item include a respective user rating of the first item from each user. Generating the final rating of a first item further includes calculating the final rating of the first item based on a weighted combination of the plurality of user ratings for the first item, according to the respective auditor weight of each user.

5. 发明授权

US09427828B2 Increasing solder hole-fill in a printed circuit board assembly 有权
标题翻译：增加印刷电路板组件中的焊锡填充
公开(公告)号：US09427828B2
公开(公告)日：2016-08-30
申请号：US14454839
申请日：2014-08-08
申请人： International Business Machines Corporation
发明人： Stephen M. Hugo , Matthew S. Kelly
IPC分类号： B23K1/00 , B23K1/20 , H05K7/20 , B23K31/02 , B23K31/12 , H05K3/34
CPC分类号： B23K3/08 , B23K1/0016 , B23K1/085 , B23K3/0653 , B23K31/02 , B23K31/12 , B23K2101/42 , H05K3/3447 , H05K3/3468 , H05K2203/044 , H05K2203/1509 , H05K2203/306
摘要： A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.
摘要翻译：在说明性实施例中提供了用于在印刷电路板组件（PCBA）中增加焊料填充的方法，装置和计算机程序产品。在包括印刷电路板（PCB）和该装置的PCBA中，使器件的引脚沿第一方向移动，该引脚占据PCB中的孔，该孔通过焊料材料填充到第一距离。通过使销移动，焊料材料被拉入孔中直到第二距离大于第一距离。允许销沿第二方向移动，以将销返回到孔中的初始位置。允许销沿第二方向移动将焊料材料保持在第三距离，其中第三距离大于孔中的第一距离。

6. 发明申请

US20160188786A1 TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING 有权
标题翻译：温度敏感元件在热处理中的应用
公开(公告)号：US20160188786A1
公开(公告)日：2016-06-30
申请号：US15062196
申请日：2016-03-07
申请人： International Business Machines Corporation
发明人： Mitchell G. Ferrill , Curtis Grosskopf , Matthew S. Kelly , Thomas H. Lewis , Wen Wei Low
IPC分类号： G06F17/50
CPC分类号： G06F17/5081 , G06F17/5068 , G06F2217/80
摘要： For a printed circuit board assembly (“PCBA”) selected electronic components are highlighted on a graphic representation of the PCBA on a display of a computer system. The components are selected responsive to temperature and time limits of the selected components. Ones of the highlighted components are associated to respective temperature sensors on the PCBA. Responsive to where the one or more additional ones of the highlighted components are located on the PCBA relative to the at least one of the respective temperature sensors, one or more additional ones of the highlighted components are associated with at least one of the respective temperature sensors. The computer system receives data for respective signals indicating temperatures encountered by the respective temperature sensors when the PCBA is heated in a manufacturing process. The computer system shows whether any of the time and temperature limits were exceeded during the manufacturing process.
摘要翻译：对于印刷电路板组件（“PCBA”），所选择的电子部件在计算机系统的显示器上以PCBA的图形突出显示。响应于所选部件的温度和时间限制来选择部件。突出显示的组件的一部分与PCBA上相应的温度传感器相关联。响应于所突出显示的组件中的一个或多个附加的部件相对于相应的温度传感器中的至少一个位于PCBA上，突出显示的部件中的一个或多个附加的部件与相应的温度传感器中的至少一个相关联。计算机系统接收相应信号的数据，指示当在制造过程中加热PCBA时各温度传感器遇到的温度。计算机系统显示在制造过程中是否超过了任何时间和温度限制。

7. 发明授权

US11178757B2 Selective dielectric resin application on circuitized core layers 有权
公开(公告)号：US11178757B2
公开(公告)日：2021-11-16
申请号：US16029114
申请日：2018-07-06
申请人： International Business Machines Corporation
发明人： Bruce J. Chamberlin , Matthew S. Kelly , Scott B. King , Joseph Kuczynski
IPC分类号： H05K1/03 , H05K1/09 , H05K1/11 , H05K3/42 , H05K3/46 , H05K3/00 , H05K1/02 , H05K1/14
摘要： A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

8. 发明授权

US11059120B2 Non-destructive identifying of plating dissolution in soldered, plated through-hole 有权
公开(公告)号：US11059120B2
公开(公告)日：2021-07-13
申请号：US16177565
申请日：2018-11-01
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Matthew S. Kelly , Joseph Kuczynski , Scott B. King , Bruce J. Chamberlin , Matthew Doyle
IPC分类号： B23K3/08 , H05K3/34 , B23K1/00 , B23K101/42
摘要： Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.

9. 发明授权

US09662732B2 Increasing solder hole-fill in a printed circuit board assembly 有权
公开(公告)号：US09662732B2
公开(公告)日：2017-05-30
申请号：US15188299
申请日：2016-06-21
申请人： International Business Machines Corporation
发明人： Stephen M. Hugo , Matthew S. Kelly
IPC分类号： B23K1/00 , B23K1/20 , H05K7/20 , B23K3/08 , B23K31/12 , B23K31/02 , H05K3/34 , B23K1/08 , B23K3/06
CPC分类号： B23K3/08 , B23K1/0016 , B23K1/085 , B23K3/0653 , B23K31/02 , B23K31/12 , B23K2101/42 , H05K3/3447 , H05K3/3468 , H05K2203/044 , H05K2203/1509 , H05K2203/306
摘要： A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

10. 发明申请

US20160044791A1 INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY 有权
公开(公告)号：US20160044791A1
公开(公告)日：2016-02-11
申请号：US14454839
申请日：2014-08-08
申请人： International Business Machines Corporation
发明人： Stephen M. Hugo , Matthew S. Kelly
IPC分类号： H05K3/00 , B23K31/02 , B23K31/12 , H05K13/00 , B23K1/00
CPC分类号： B23K3/08 , B23K1/0016 , B23K1/085 , B23K3/0653 , B23K31/02 , B23K31/12 , B23K2101/42 , H05K3/3447 , H05K3/3468 , H05K2203/044 , H05K2203/1509 , H05K2203/306
摘要： A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

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