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    • 1. 发明申请
    • Indium Zinc Oxide for Transparent Conductive Oxide Layer and Methods of Forming Thereof
    • 用于透明导电氧化物层的氧化铟锌及其形成方法
    • US20160111603A1
    • 2016-04-21
    • US14519274
    • 2014-10-21
    • Intermolecular, Inc.Epistar Corporation
    • Jianhua HuBen CardozoMinh Huu LeSandeep NijhawanJ.H. Yeh
    • H01L33/42H01L33/32H01L33/00
    • H01L33/42H01L31/1884H01L33/0095H01L33/32H01L2933/0016Y02E10/50
    • Provided are light emitting diodes (LEDs) and methods of fabricating such LEDs. Specifically, an LED has an epitaxial stack and current distribution layer disposed on and interfacing the epitaxial stack. The current distribution layer includes indium oxide and zinc oxide such that the concentration of indium oxide is between about 5% and 15% by weight. During fabrication, the current distribution layer is annealed at a temperature of less than about 500° C. or even at less than about 400° C. These low anneal temperature helps preserving the overall thermal budget of the LED while still yielding a current distribution layer having a low resistivity and low adsorption. A particular composition and method of forming the current distribution layer allows using lower annealing temperatures. In some embodiments, the current distribution layer is sputtered using indium oxide and zinc oxide targets at a pressure of less than 5 mTorr.
    • 提供了发光二极管(LED)和制造这种LED的方法。 具体地说,LED具有外延层和电流分布层,其布置在外延层上并与外延层叠接合。 电流分布层包括氧化铟和氧化锌,使得氧化铟的浓度在约5重量%至15重量%之间。 在制造期间,电流分布层在小于约500℃或甚至低于约400℃的温度下退火。这些低退火温度有助于保持LED的总体热预算,同时仍然产生电流分布层 具有低电阻率和低吸附性。 形成电流分布层的特定组成和方法允许使用较低的退火温度。 在一些实施例中,使用氧化铟和氧化锌靶在小于5mTorr的压力下溅射电流分布层。