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    • 5. 发明授权
    • Power device and a reverse conducting power IGBT
    • 功率器件和反向导通功率IGBT
    • US09082813B2
    • 2015-07-14
    • US13748172
    • 2013-01-23
    • Infineon Technologies Austria AG
    • Frank Pfirsch
    • H01L29/78H01L29/06H01L29/10H01L29/739H01L29/08
    • H01L29/7395H01L29/0696H01L29/0834H01L29/1095H01L29/7397H01L29/7802H01L29/7813
    • A semiconductor device is provided which includes a semiconductor body having a base region and a main horizontal surface, and a first electrode arranged on the main horizontal surface. The semiconductor body further includes a plurality of vertical trenches having gate electrodes in a vertical cross-section. A body region forms a first pn-junction with the base region and extends between two of the vertical trenches. A source region is in ohmic contact with the first electrode and arranged between the two vertical trenches. An anti-latch-up region is arranged between the two vertical trenches and in ohmic contact with the first electrode. The anti-latch-up region has a maximum doping concentration which is higher than a maximum doping concentration of the body region. An anode region forms a rectifying pn-junction with the base region only and adjoins a third one of the vertical trenches, and has ohmic contact with the first electrode.
    • 提供一种半导体器件,其包括具有基极区域和主水平表面的半导体本体,以及布置在主水平表面上的第一电极。 半导体主体还包括具有垂直横截面的栅电极的多个垂直沟槽。 体区域与基极区域形成第一pn结,并在两个垂直沟槽之间延伸。 源极区域与第一电极欧姆接触并且布置在两个垂直沟槽之间。 在两个垂直沟槽之间布置防闩锁区域并与第一电极欧姆接触。 防闩锁区域具有高于身体区域的最大掺杂浓度的最大掺杂浓度。 阳极区域仅与基极区域形成整流pn结,并与第三垂直沟槽相邻,并与第一电极欧姆接触。