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1. 发明授权

US07026635B2 Particle beam processing apparatus and materials treatable using the apparatus 有权
标题翻译：使用该设备可处理的粒子束处理设备和材料
公开(公告)号：US07026635B2
公开(公告)日：2006-04-11
申请号：US10631678
申请日：2003-07-31
申请人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
发明人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
IPC分类号： A61N5/00 , G21G5/00 , H05H7/00
CPC分类号： B05D3/068 , B41M7/0045 , B41M7/0081 , G21K5/10 , H01J33/00 , H01J33/04
摘要： Methods, and materials made by the methods, are provided herein for treating materials with a particle beam processing device. According to one illustrative embodiment, a method for treating a material with a particle beam processing device is provided that includes: providing a particle beam generating assembly including at least one filament for creating a plurality of particles; applying an operating voltage greater than about 110 kV to the filament to create the plurality of particles; causing the plurality of particles to pass through a thin foil having a thickness of about 10 microns or less; and treating a material with the plurality of particles.
摘要翻译：本文提供了通过方法制备的方法和材料，用于使用粒子束处理装置处理材料。根据一个示例性实施例，提供了一种用粒子束处理装置处理材料的方法，其包括：提供粒子束产生组件，其包括用于产生多个颗粒的至少一个细丝; 向灯丝施加大于约110kV的工作电压以产生多个颗粒; 使多个颗粒通过厚度为约10微米或更小的薄箔; 以及用多个颗粒处理材料。

2. 发明授权

US07348580B2 Particle beam processing apparatus and materials treatable using the apparatus 有权
标题翻译：使用该设备可处理的粒子束处理设备和材料
公开(公告)号：US07348580B2
公开(公告)日：2008-03-25
申请号：US11553898
申请日：2006-10-27
申请人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
发明人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
IPC分类号： A61N5/00
CPC分类号： B05D3/068 , B41M7/0045 , B41M7/0081 , G21K5/10 , H01J33/00 , H01J33/04
摘要： The present invention is directed to a particle beam processing apparatus that is smaller in size and operates at a higher efficiency, and also directed to an application of such apparatus to treat a coating on a substrate of a treatable material, such as for flexible packaging. The processing apparatus includes a particle beam generating assembly, a foil support assembly, and a processing assembly. In the particle beam generating assembly, electrons are generated and accelerated to pass through the foil support assembly. In the flexible packaging application, the substrate is fed to the processing apparatus operating at a low voltage, such as 110 kVolts or below, and is exposed to the accelerated electrons to treat the coating on the substrate.
摘要翻译：本发明涉及一种尺寸较小并以更高效率操作的粒子束加工装置，并且还针对这种装置的应用来处理可处理材料的基底上的涂层，例如用于柔性包装。处理装置包括粒子束产生组件，箔支撑组件和处理组件。在粒子束产生组件中，产生并加速电子以通过箔支撑组件。在柔性封装应用中，将衬底馈送到在低电压（例如110kV或更低）下工作的处理设备，并暴露于加速电子以处理衬底上的涂层。

3. 发明申请

US20070045567A1 Particle Beam Processing Apparatus and Materials Treatable Using the Apparatus 有权
标题翻译：粒子束加工设备和使用该设备可处理的材料
公开(公告)号：US20070045567A1
公开(公告)日：2007-03-01
申请号：US11553898
申请日：2006-10-27
申请人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
发明人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
IPC分类号： G21G5/00
CPC分类号： B05D3/068 , B41M7/0045 , B41M7/0081 , G21K5/10 , H01J33/00 , H01J33/04
摘要： The present invention is directed to a particle beam processing apparatus that is smaller in size and operates at a higher efficiency, and also directed to an application of such apparatus to treat a coating on a substrate of a treatable material, such as for flexible packaging. The processing apparatus includes a particle beam generating assembly, a foil support assembly, and a processing assembly. In the particle beam generating assembly, electrons are generated and accelerated to pass through the foil support assembly. In the flexible packaging application, the substrate is fed to the processing apparatus operating at a low voltage, such as 110 kVolts or below, and is exposed to the accelerated electrons to treat the coating on the substrate.
摘要翻译：本发明涉及一种尺寸较小并以更高效率操作的粒子束加工装置，并且还针对这种装置的应用来处理可处理材料的基底上的涂层，例如用于柔性包装。处理装置包括粒子束产生组件，箔支撑组件和处理组件。在粒子束产生组件中，产生并加速电子以通过箔支撑组件。在柔性封装应用中，将衬底馈送到在低电压（例如110kV或更低）下工作的处理设备，并暴露于加速电子以处理衬底上的涂层。

4. 发明授权

US06610376B1 Particle beam processing apparatus 有权
公开(公告)号：US06610376B1
公开(公告)日：2003-08-26
申请号：US09725471
申请日：2000-11-30
申请人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
发明人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
IPC分类号： C08F252
CPC分类号： H01J33/00 , B05D3/068
摘要： The present invention is directed to a particle beam processing apparatus that is smaller in size and operates at a higher efficiency. The processing apparatus includes a particle beam generating assembly, a foil support assembly, and a processing assembly. In the particle beam generating assembly, a cloud of particles, for example, electrons, are generated by heating at least one tungsten filament. The electrons are then extracted to travel at a high speed to the foil support assembly which is set at a much lower voltage than the particle beam generating assembly. A substrate is fed to the processing apparatus through the processing zone and is exposed to the electrons exiting the particle beam generating assembly and entering the processing zone. The electrons penetrate and cure the substrate causing a chemical reaction, such as polymerization, cross-linking, or sterilization.

5. 发明授权

US06426507B1 Particle beam processing apparatus 有权
标题翻译：粒子束处理装置
公开(公告)号：US06426507B1
公开(公告)日：2002-07-30
申请号：US09434380
申请日：1999-11-05
申请人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
发明人： Imtiaz Rangwalla , Harvey Clough , George Hannafin
IPC分类号： A61N500
CPC分类号： H01J33/00 , B05D3/068
摘要： The present invention is directed to a particle beam processing apparatus that is smaller in size and operates at a higher efficiency. The processing apparatus includes a particle beam generating assembly, a foil support assembly, and a processing assembly. In the particle beam generating assembly, a cloud of particles, for example, electrons, are generated by heating at least one tungsten filament. The electrons are then extracted to travel at a high speed to the foil support assembly which is set at a much lower voltage than the particle beam generating assembly. A substrate is fed to the processing apparatus through the processing zone and is exposed to the electrons exiting the particle beam generating assembly and entering the processing zone. The electrons penetrate and cure the substrate causing a chemical reaction, such as polymerization, cross-linking, or sterilization.
摘要翻译：本发明涉及一种尺寸更小并以更高效率工作的粒子束处理装置。处理装置包括粒子束产生组件，箔支撑组件和处理组件。在粒子束产生组件中，通过加热至少一根钨丝来产生颗粒云，例如电子。然后提取电子以高速行进到箔片支撑组件，箔片支撑组件设置在比颗粒束产生组件低得多的电压下。衬底通过处理区被馈送到处理装置，并暴露于离开粒子束产生组件并进入处理区的电子。电子穿透和固化基板，导致化学反应，如聚合，交联或灭菌。

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