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    • 7. 发明授权
    • Fuel cartridge coupler for fuel cell
    • 用于燃料电池的燃油箱联接器
    • US07836912B2
    • 2010-11-23
    • US11797625
    • 2007-05-04
    • Won-Hyouk JangWoong-Ho ChoSang-Hyeon ChoiJong-Ki LeeHyung-Keun Lee
    • Won-Hyouk JangWoong-Ho ChoSang-Hyeon ChoiJong-Ki LeeHyung-Keun Lee
    • H01M2/02
    • H01M8/04201Y10T137/87949Y10T137/87957
    • A fuel cartridge coupler to couple a cartridge body storing fuel to a fuel cell system, the fuel cartridge coupler including: a first coupling member arranged in the cartridge body; a second coupling member assembled with the first coupling member in the fuel cell system; a first nozzle assembly including a first fluid path to discharge fuel stored in the cartridge body, the fuel cartridge being elastically supported by the first coupling member and biased by the second coupling member to open and close the first fluid path; and a second nozzle assembly including a second fluid path to inject the fuel passing through the first fluid path into the fuel cell system, the second nozzle assembly being elastically supported by the second coupling member and biased by the first nozzle assembly to open and close the second fluid path.
    • 一种燃料盒联接器,用于将存储燃料的盒体联接到燃料电池系统,所述燃料盒联接器包括:布置在所述盒体中的第一联接构件; 与燃料电池系统中的第一联接构件组装的第二联接构件; 第一喷嘴组件,包括用于排放存储在所述盒体中的燃料的第一流体路径,所述燃料盒由所述第一联接构件弹性支撑并由所述第二联接构件偏压以打开和关闭所述第一流体路径; 以及第二喷嘴组件,其包括第二流体路径,以将通过所述第一流体路径的燃料喷射到所述燃料电池系统中,所述第二喷嘴组件由所述第二联接构件弹性支撑并且被所述第一喷嘴组件偏压以打开和关闭 第二流体路径。
    • 8. 发明授权
    • System for sputtering and method thereof
    • 溅射系统及其方法
    • US08658002B2
    • 2014-02-25
    • US12911569
    • 2010-10-25
    • Eu-Gene KangWon-Hyouk Jang
    • Eu-Gene KangWon-Hyouk Jang
    • C23C14/34
    • C23C14/34C23C14/545H01J37/32963H01J37/3299H01J37/34
    • A sputtering method includes receiving etch time information for a first substrate detected in a dry etching process, calculating a deposition time for a second substrate from the etch time information for the first substrate, and executing sputtering for the second substrate based the calculated deposition time. The thickness of the thin film deposited on the substrate in the sputter device may be uniformly maintained by using etch end point information detected in an end point detection (EPD) device. A sputtering system comprises a sputter device for executing a sputtering process for depositing a thin film on a substrate by a sputtering method, an EPD device for generating EPD information including etch time information for the substrate for a calculation of a deposition time during which the thin film is deposited, and a controller for calculating a deposition time by using the EPD information, and for controlling the sputter device based on the calculated deposition time.
    • 溅射方法包括接收在干蚀刻工艺中检测到的第一衬底的蚀刻时间信息,根据第一衬底的蚀刻时间信息计算第二衬底的沉积时间,以及基于计算的沉积时间执行第二衬底的溅射。 可以通过使用在端点检测(EPD)装置中检测到的蚀刻终点信息,均匀地保持沉积在溅射装置中的基板上的薄膜的厚度。 溅射系统包括用于执行用于通过溅射法在衬底上沉积薄膜的溅射工艺的溅射装置,用于产生EPD信息的EPD装置,包括用于计算沉积时间的衬底的蚀刻时间信息, 以及用于通过使用EPD信息计算沉积时间的控制器,以及基于计算出的沉积时间来控制溅射装置。
    • 9. 发明申请
    • System for Sputtering and Method Thereof
    • 溅射系统及其方法
    • US20110272275A1
    • 2011-11-10
    • US12911569
    • 2010-10-25
    • Eu-Gene KangWon-Hyouk Jang
    • Eu-Gene KangWon-Hyouk Jang
    • C23C14/34
    • C23C14/34C23C14/545H01J37/32963H01J37/3299H01J37/34
    • A sputtering method includes receiving etch time information for a first substrate detected in a dry etching process, calculating a deposition time for a second substrate from the etch time information for the first substrate, and executing sputtering for the second substrate based the calculated deposition time. The thickness of the thin film deposited on the substrate in the sputter device may be uniformly maintained by using etch end point information detected in an end point detection (EPD) device. A sputtering system comprises a sputter device for executing a sputtering process for depositing a thin film on a substrate by a sputtering method, an EPD device for generating EPD information including etch time information for the substrate for a calculation of a deposition time during which the thin film is deposited, and a controller for calculating a deposition time by using the EPD information, and for controlling the sputter device based on the calculated deposition time.
    • 溅射方法包括接收在干蚀刻工艺中检测到的第一衬底的蚀刻时间信息,根据第一衬底的蚀刻时间信息计算第二衬底的沉积时间,以及基于计算的沉积时间执行第二衬底的溅射。 可以通过使用在端点检测(EPD)装置中检测到的蚀刻终点信息,均匀地保持沉积在溅射装置中的基板上的薄膜的厚度。 溅射系统包括用于执行用于通过溅射法在衬底上沉积薄膜的溅射工艺的溅射装置,用于产生EPD信息的EPD装置,包括用于计算沉积时间的衬底的蚀刻时间信息, 以及用于通过使用EPD信息计算沉积时间的控制器,以及基于计算出的沉积时间来控制溅射装置。