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1. 发明授权

US08695690B2 Methods for cooling electronic devices using flow sensors 有权
标题翻译：使用流量传感器冷却电子设备的方法
公开(公告)号：US08695690B2
公开(公告)日：2014-04-15
申请号：US12241010
申请日：2008-09-29
申请人： Ihab A. Ali , Frank Liang
发明人： Ihab A. Ali , Frank Liang
IPC分类号： H05K7/20 , G05D23/00
CPC分类号： G06F1/203 , G06F1/1613 , G06F1/206 , H01L23/34 , H01L23/467 , H01L2924/0002 , Y02D10/16 , H01L2924/00
摘要： An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.
摘要翻译：电子设备可以设置有具有限定空腔的至少一个壁和至少部分地包含在腔内的流量传感器的壳体。流量传感器可以被配置为检测与通过空腔的第一部分的流体的流动相关的流动特性。电子设备还可以包括被配置为基于检测到的流量特性来改变电子设备的性能特性的处理器。

2. 发明申请

US20100053885A1 METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES USING THERMALLY CONDUCTIVE HINGE ASSEMBLIES 有权
标题翻译：使用导热铰链组件冷却电子设备的方法和装置
公开(公告)号：US20100053885A1
公开(公告)日：2010-03-04
申请号：US12241012
申请日：2008-09-29
申请人： Ihab A. Ali
发明人： Ihab A. Ali
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F1/1616 , G06F1/1681
摘要： An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing.
摘要翻译：电子设备可以设置有至少部分地包含第一电子部件，第二壳体和联接到第一壳体和第二壳体的铰链组件的第一壳体。铰链组件可以被配置为将由第一电子部件产生的热量散发离开第一壳体。在一些实施例中，铰链组件可以被配置为将由第一电子部件产生的热量从第一壳体和第二壳体上散出。第二壳体可以包括用于在整个第二壳体中从铰链组件散热的散热器。

3. 发明申请

US20080298021A1 Notebook computer with hybrid diamond heat spreader 审中-公开
标题翻译：带混合金刚石散热器的笔记本电脑
公开(公告)号：US20080298021A1
公开(公告)日：2008-12-04
申请号：US11809460
申请日：2007-05-31
申请人： Ihab A. Ali , Frank F. Liang , Amaury Heresztyn
发明人： Ihab A. Ali , Frank F. Liang , Amaury Heresztyn
IPC分类号： H05K7/20
CPC分类号： H01L23/3732 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.
摘要翻译：描述设备的实施例。该装置包括集成电路和耦合到集成电路的散热器。该散热器包括碳的同素异形体的第一层。注意，碳的同素异形体具有大致的面心立方晶体结构。此外，碳的同素异形体具有大于第一预定值的热导率和大于第二预定值的比热。

4. 发明申请

US20080291629A1 Liquid-cooled portable computer 失效
标题翻译：液冷便携式电脑
公开(公告)号：US20080291629A1
公开(公告)日：2008-11-27
申请号：US11805501
申请日：2007-05-22
申请人： Ihab A. Ali
发明人： Ihab A. Ali
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , G06F2200/201
摘要： Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system.
摘要翻译：描述计算机系统的实施例。该计算机系统包括耦合到热管的电源，其中电源包括集成电路。该热管可以包含在室温下具有大于第一预定值的密度的液体冷却剂。耦合到热管的泵被配置为使液体冷却剂循环通过热管。此外，耦合到热管的热交换器被配置为将热量从热管传递到计算机系统外部的环境。

5. 发明授权

US07746631B2 Methods and apparatus for cooling electronic devices using thermally conductive hinge assemblies 有权
标题翻译：使用导热铰链组件冷却电子设备的方法和设备
公开(公告)号：US07746631B2
公开(公告)日：2010-06-29
申请号：US12241012
申请日：2008-09-29
申请人： Ihab A. Ali
发明人： Ihab A. Ali
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： G06F1/203 , G06F1/1616 , G06F1/1681
摘要： An electronic device can be provided with a first housing at least partially containing a first electronic component, a second housing, and a hinge assembly coupled to the first housing and the second housing. The hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing. In some embodiments, the hinge assembly may be configured to dissipate heat generated by the first electronic component away from the first housing and on to the second housing. The second housing may include a heat spreader for dissipating the heat from the hinge assembly throughout the second housing.
摘要翻译：电子设备可以设置有至少部分地包含第一电子部件，第二壳体和联接到第一壳体和第二壳体的铰链组件的第一壳体。铰链组件可以被配置为将由第一电子部件产生的热量散发离开第一壳体。在一些实施例中，铰链组件可以被配置为将由第一电子部件产生的热量从第一壳体和第二壳体上散出。第二壳体可以包括用于在整个第二壳体中从铰链组件散热的散热器。

6. 发明申请

US20100050658A1 METHODS AND APPARATUS FOR COOLING ELECTRONIC DEVICES USING THERMOELECTRIC COOLING COMPONENTS 审中-公开
标题翻译：使用热电冷却组件冷却电子设备的方法和装置
公开(公告)号：US20100050658A1
公开(公告)日：2010-03-04
申请号：US12241013
申请日：2008-09-29
申请人： Ihab A. Ali
发明人： Ihab A. Ali
IPC分类号： F25B21/02 , H05K7/20 , B23P17/00
CPC分类号： H01L23/38 , G06F1/20 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： An electronic device can be provided with a heat-generating component, a heat-dissipating component, and a thermoelectric cooling component. The thermoelectric cooling component may be configured to create a temperature difference between the heat-generating component and the heat-dissipating component. In some embodiments, the thermoelectric cooling component is configured to use the Peltier effect to create the temperature difference. In some embodiments, the thermoelectric cooling component may be positioned proximate to a hotspot of the heat-generating component.
摘要翻译：电子设备可以设置有发热部件，散热部件和热电冷却部件。热电冷却部件可以被配置为在发热部件和散热部件之间产生温度差。在一些实施例中，热电冷却部件被配置为使用珀耳帖效应来产生温度差。在一些实施例中，热电冷却部件可以靠近发热部件的热点定位。

7. 发明授权

US07092254B1 Cooling system for electronic devices utilizing fluid flow and agitation 有权
标题翻译：利用流体流动和搅拌的电子设备的冷却系统
公开(公告)号：US07092254B1
公开(公告)日：2006-08-15
申请号：US10913255
申请日：2004-08-06
申请人： Eric Monsef , Christiaan Ligtenberg , Zach Zeliff , Ihab A. Ali
发明人： Eric Monsef , Christiaan Ligtenberg , Zach Zeliff , Ihab A. Ali
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： A cooling system, the system comprises a housing having an inlet and an outlet, a liquid to be flown from the inlet into the housing and out of outlet to exit the housing. The housing further has an interior portion for an electronic device to reside therein and a vibration transducer coupling to the housing. The liquid is flown across the electronic device to dissipate heat from the electronic device. The vibration transducer causes turbulent or agitation in the liquid as the liquid is flown across the electronic device.
摘要翻译：一种冷却系统，该系统包括具有入口和出口的壳体，从入口流入壳体并离开出口以离开壳体的液体。壳体还具有用于电子设备驻留在其中的内部部分和耦合到壳体的振动换能器。液体流过电子设备以散发来自电子设备的热量。当液体流过电子设备时，振动传感器引起液体中的湍流或搅动。

8. 发明授权

US06362966B1 Protective cover and packaging for multi-chip memory modules 失效
标题翻译：多芯片内存模块的保护盖和封装
公开(公告)号：US06362966B1
公开(公告)日：2002-03-26
申请号：US09311655
申请日：1999-05-13
申请人： Ihab A. Ali , Shawn S. McEuen
发明人： Ihab A. Ali , Shawn S. McEuen
IPC分类号： H05K700
CPC分类号： G11C5/143 , G11C5/00 , H05K7/1431
摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, a top cover and bottom cover of the packaging cover are assembled with a separate frame to secure a coupling between the top and bottom covers of the packaging cover. In one embodiment, the frame includes grooves to receive notches of a module connector coupled to a motherboard. In one embodiment, the frame includes an aperture for receiving connections to thermal solutions external to the packaging cover.
摘要翻译：一种存储器模块，具有用于封装具有多个分离芯片的板的封装盖，其动态地产生变化量的热量。包装盖在多个分离的存储器芯片之间提供局部散热。单独的芯片通过一组焊球与板相互连接。包装盖还提供了板和芯片的刚性封装。在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。在一个实施例中，包装盖的顶盖和底盖组装有单独的框架，以固定包装盖的顶盖和底盖之间的联接。在一个实施例中，框架包括凹槽以接收耦合到母板的模块连接器的凹口。在一个实施例中，框架包括用于接收与包装盖外部的热解决方案的连接的孔。

9. 发明授权

US6157538A Heat dissipation apparatus and method 有权
标题翻译：散热装置及方法
公开(公告)号：US6157538A
公开(公告)日：2000-12-05
申请号：US206823
申请日：1998-12-07
申请人： Ihab A. Ali , James Hermerding , Rakesh Bhatia
发明人： Ihab A. Ali , James Hermerding , Rakesh Bhatia
IPC分类号： H05K7/20
CPC分类号： H05K7/20445 , G06F1/20
摘要： A system includes a housing, a support structure (e.g., a circuit board), and an electronic device mounted on the support structure. A heat dissipation apparatus is thermally coupled to the electronic device and the housing to direct heat from the electronic device into the housing. The heat dissipation apparatus may include layers of thermally conductive members coupled between the electronic device and the housing. In addition, the heat dissipation apparatus may be thermally coupled to the support structure to direct heat from the electronic device to the support structure.
摘要翻译：系统包括壳体，支撑结构（例如电路板）和安装在支撑结构上的电子装置。散热装置热耦合到电子装置和壳体以将热量从电子装置引导到壳体中。散热装置可以包括耦合在电子装置和壳体之间的导热构件层。此外，散热装置可以热耦合到支撑结构以将热量从电子装置引导到支撑结构。

10. 发明授权

US08347952B2 Enhanced vent for outlet for a cooling system 有权
标题翻译：增强冷却系统出口通风口
公开(公告)号：US08347952B2
公开(公告)日：2013-01-08
申请号：US11607571
申请日：2006-11-30
申请人： Ihab A. Ali , Jay S. Nigen
发明人： Ihab A. Ali , Jay S. Nigen
IPC分类号： H05K7/20 , F28F13/12
CPC分类号： G06F1/203
摘要： A cooling mechanism includes a first heat exchanger, a first fluid-flow port, and a second fluid-flow port. The first heat exchanger includes a forced-fluid driver and is configured to pump heat from inside an enclosed area to outside of the enclosed area. Furthermore, the first fluid-flow port is configured to accommodate a first fluid flow into the enclosed area and the second fluid-flow port is configured to accommodate a second fluid flow from the enclosed area. Note that the first fluid-flow port and the second fluid-flow port are approximately coplanar. In addition, a given fluid-flow port, which may be either or both of the fluid-flow ports, is tapered to have an associated cross-sectional area which is smaller at an edge of the given fluid-flow port that is proximate to the outside of the enclosed area than at an edge of the given fluid-flow port that is proximate to the inside of the enclosed area.
摘要翻译：冷却机构包括第一热交换器，第一流体流通口和第二流体流动端口。第一热交换器包括强制流体驱动器，并且构造成将热量从封闭区域内部泵送到封闭区域的外部。此外，第一流体流动端口构造成容纳第一流体流入封闭区域，并且第二流体流动端口构造成容纳来自封闭区域的第二流体流。注意，第一流体流动端口和第二流体流动端口近似共面。此外，可以是流体流动端口中的一个或两个的给定流体流动端口是锥形的，以具有在给定的流体流动端口的边缘处更接近的相关联的横截面面积封闭区域的外侧比在靠近封闭区域内部的给定流体流动端口的边缘处。

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