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    • 9. 发明授权
    • Mold apparatus for resin encapsulation and resin encapsulation method
    • 树脂封装模塑装置和树脂封装方法
    • US07887313B2
    • 2011-02-15
    • US12094010
    • 2006-11-24
    • Kenji OgataMasashi NishiguchiKenichiro Imamura
    • Kenji OgataMasashi NishiguchiKenichiro Imamura
    • B29C45/14
    • H01L21/565B29C45/02B29C45/021B29C45/14655H01L24/97H01L2924/181H01L2924/00
    • To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.
    • 为了提供组件数量少的树脂封装用模具装置,具有简单的驱动机构,易于组装或拆卸工作,不需要维护劳动并具有良好的可加工性; 和树脂封装方法。 因此,在下腔体棒51和上腔棒26中,在设置衬底板的区域中以预定间距平行设置多个槽形罐52,并且每个槽形罐52分别 设置有通过跑道平行的多个空腔54。 然后,通过柱塞76驱动以能够上下移动的方式插入槽状罐52中的柱塞板60,由此插入到罐52中的用于封装的用于封装的树脂用柱塞板 60,并且熔融的树脂通过流道填充在空腔54中。
    • 10. 发明申请
    • Mold Apparatus for Resin Encapsulation and Resin Encapsulation Method
    • 树脂封装模塑装置和树脂封装方法
    • US20080308969A1
    • 2008-12-18
    • US12094010
    • 2006-11-24
    • Kenji OgataMasashi NishiguchiKenichiro Imamura
    • Kenji OgataMasashi NishiguchiKenichiro Imamura
    • B29C45/14
    • H01L21/565B29C45/02B29C45/021B29C45/14655H01L24/97H01L2924/181H01L2924/00
    • To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.
    • 为了提供组件数量少的树脂封装用模具装置,具有简单的驱动机构,易于组装或拆卸工作,不需要维护劳动并具有良好的可加工性; 和树脂封装方法。 因此,在下腔体棒51和上腔棒26中,在设置衬底板的区域中以预定间距平行设置多个槽形罐52,并且每个槽形罐52分别 设置有通过跑道平行的多个空腔54。 然后,通过柱塞76驱动以能够上下移动的方式插入槽状罐52中的柱塞板60,由此插入到罐52中的用于封装的用于封装的树脂用柱塞板 60,并且熔融的树脂通过流道填充在空腔54中。