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1. 发明申请

US20100053960A1 MICROLENS ARRAY 有权
标题翻译：微阵列
公开(公告)号：US20100053960A1
公开(公告)日：2010-03-04
申请号：US12547136
申请日：2009-08-25
申请人： Ichiro SUEHIRO , Hiroyuki KATAYAMA , Kouji AKAZAWA , Hideyuki USUI
发明人： Ichiro SUEHIRO , Hiroyuki KATAYAMA , Kouji AKAZAWA , Hideyuki USUI
IPC分类号： G02B27/10 , F21V5/04
CPC分类号： B29D11/00365 , G02B1/041 , G02B3/0031 , Y10T428/31663 , C08L83/14
摘要： The present invention provides a microlens array produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by the following formula (I): in which R1 and R2 each independently represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group, in which a plurality of R1's are the same or different and a plurality of R2's are the same or different; X represents a hydroxy group, an alkoxy group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. This microlens array has excellent heat resistance and light resistance even when applied to LEDs having an increased power and to LEDs emitting blue light having a short wavelength.
摘要翻译：本发明提供一种微透镜阵列，其通过将硅化合物与硼化合物或铝化合物反应而获得的树脂模塑而成，其中硅化合物由下式（I）表示：其中R1和R2各自独立地表示烷基，环烷基，烯基，炔基或芳基，其中多个R 1相同或不同，并且多个R 2相同或不同; X表示羟基，烷氧基，烷基，环烷基，烯基，炔基或芳基; n为4〜250。这种微透镜阵列即使应用于具有增加的功率的LED以及发射具有短波长的蓝光的LED也具有优异的耐热性和耐光性。

2. 发明申请

US20090242928A1 RESIN SHEET FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE 有权
标题翻译：用于封装光学半导体元件和光学半导体器件的树脂片
公开(公告)号：US20090242928A1
公开(公告)日：2009-10-01
申请号：US12409782
申请日：2009-03-24
申请人： Ichiro SUEHIRO , Kouji AKAZAWA , Hideyuki USUI
发明人： Ichiro SUEHIRO , Kouji AKAZAWA , Hideyuki USUI
IPC分类号： H01L33/00 , B32B3/00
CPC分类号： H01L21/561 , H01L24/97 , H01L33/44 , H01L33/483 , H01L33/52 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/12041 , H01L2924/181 , Y10T428/24851 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a resin sheet for encapsulating an optical semiconductor element, the resin sheet containing an encapsulation resin layer, an adhesive resin layer, a metal layer and a protective resin layer, in which the encapsulation resin layer and the metal layer adhered onto the adhesive resin layer are disposed adjacently to each other, the protective resin layer is laminated on the encapsulation resin layer and the metal layer so as to cover both the encapsulation resin layer and the metal layer, and the encapsulation resin layer has a taper shape expanding toward the protective resin layer; and an optical semiconductor device containing an optical semiconductor element encapsulated by using the resin sheet. The optical semiconductor element encapsulation resin sheet of the invention can be suitably used for back lights of liquid crystal screens, traffic signals, large-sized outdoor displays, billboards and the like.
摘要翻译：本发明提供一种用于封装光学半导体元件的树脂片，含有密封树脂层的树脂片，粘合树脂层，金属层和保护树脂层，其中密封树脂层和金属层粘附到粘合树脂层彼此相邻地设置，保护树脂层层叠在密封树脂层和金属层上以覆盖密封树脂层和金属层两者，并且密封树脂层具有朝向保护树脂层; 以及包含通过使用树脂片封装的光半导体元件的光学半导体器件。本发明的光半导体元件封装树脂片可以适用于液晶屏，交通信号灯，大型室外显示器，广告牌等的背光。

3. 发明申请

US20100209670A1 SHEET FOR PHOTOSEMICONDUCTOR ENCAPSULATION 审中-公开
标题翻译：光敏剂包封片
公开(公告)号：US20100209670A1
公开(公告)日：2010-08-19
申请号：US12706123
申请日：2010-02-16
申请人： Ichiro SUEHIRO , Kazuya FUJIOKA , Hirokazu MATSUDA , Koji AKAZAWA , Ryuichi KIMURA , Hideyuki USUI
发明人： Ichiro SUEHIRO , Kazuya FUJIOKA , Hirokazu MATSUDA , Koji AKAZAWA , Ryuichi KIMURA , Hideyuki USUI
IPC分类号： B32B3/02 , B29C70/68
CPC分类号： H01L33/54 , B29C33/68 , H01L33/52 , Y10T428/24521
摘要： The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.
摘要翻译：本发明涉及一种用于光半导体封装的片材，其具有层压在其上的剥离片和封装树脂层，其中该剥离片包含在界面处具有凹形和/或凸形的凹凸形成层封装树脂层和封装树脂层具有与剥离片的凹形配合的凸形状和/或在与剥离片的界面配合到剥离片的凸形状的凹形。

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