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    • 3. 发明授权
    • Method of manufacturing interconnection structural body
    • 互连结构体的制造方法
    • US06479374B1
    • 2002-11-12
    • US09647310
    • 2000-09-27
    • Takaaki IokaTsuneaki TanabeIchiro Doi
    • Takaaki IokaTsuneaki TanabeIchiro Doi
    • H01L2144
    • H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/02345H01L21/31695
    • Disclosed is a method for producing a circuit structure having an insulator layer comprising a porous silicon oxide thin film, which comprises (1) forming a preliminary insulator layer comprising a silicon oxide-organic polymer composite thin film formed on a substrate, which silicon oxide-organic polymer composite thin film comprises a silicon oxide having an organic polymer dispersed therein, (2) forming, in the preliminary insulator layer, a groove which defines a pattern for a circuit, (3) forming, in the groove, a metal layer which functions as a circuit, and (4) removing the organic polymer from the preliminary insulator layer to render the preliminary insulator layer porous, thereby converting the preliminary insulator layer to an insulator layer comprising a porous silicon oxide thin film. By the method of the present invention, the capacitance between mutually adjacent circuit lines (line-to-line capacitance) in the circuit structure can be lowered.
    • 公开了一种具有包括多孔氧化硅薄膜的绝缘体层的电路结构的方法,该方法包括:(1)形成包含在基板上形成的氧化硅 - 有机聚合物复合薄膜的预备绝缘体层, 有机聚合物复合薄膜包括其中分散有有机聚合物的氧化硅,(2)在预备绝缘体层中形成限定电路图案的凹槽,(3)在凹槽中形成金属层, 作为电路起作用,(4)从预备绝缘体层除去有机聚合物,使预备绝缘体层多孔化,由此将预备绝缘体层转化为包含多孔氧化硅薄膜的绝缘体层。 通过本发明的方法,可以降低电路结构中相互相邻的电路线之间的电容(线对线电容)。
    • 4. 发明授权
    • Method and apparatus for total reflection X-ray fluorescence spectroscopy
    • 全反射X射线荧光光谱法的方法和装置
    • US6041096A
    • 2000-03-21
    • US11046
    • 1998-02-06
    • Ichiro DoiShoichiro Tonomura
    • Ichiro DoiShoichiro Tonomura
    • G01N23/223
    • G01N23/223G01N2223/076
    • A method and an apparatus for total reflection X-ray fluorescence spectroscopy which facilitates total reflection X-ray fluorescent spectroscopy of a sample having irregularities. Primary X-rays are emitted to a standard sample having a smooth surface at a plurality of irradiation angles, a characteristic X-ray spectrum is measured at each of irradiation angles, a characteristic X-ray intensity and a scattered X-ray intensity are determined therefrom, a calibration coefficient is determined in the form of a function of the scattered X-ray intensity by dividing a know quantity of an analyzed element of the standard sample by the determined characteristic X-ray intensity, a characteristic X-ray spectrum when a measured sample having irregularities on the surface is irradiated with primary X-rays at a reference irradiation angle smaller than a critical total reflection angle is measured a characteristic X-ray intensity and a scattered X-ray intensity for the analyzed element are determined therefrom, a calibration coefficient to be applied to the measured sample is determined on the basis of the determined scattered X-ray intensity, and the quantity of the analyzed element is calculated by multiplying the calibration coefficient with the characteristic X-ray intensity for the analyzed element.
    • PCT No.PCT / JP96 / 02185 Sec。 371日期1998年2月6日 102(e)日期1998年2月6日PCT提交1996年8月2日PCT公布。 公开号WO97 / 06430 日期1997年2月20日一种全反射X射线荧光光谱法的方法和装置,其促进具有不规则性的样品的全反射X射线荧光光谱。 将主X射线发射到具有多个照射角度的光滑表面的标准样品,在每个照射角度测量特征X射线光谱,确定特征X射线强度和散射X射线强度 由此,通过将标准样品的分析元素的知识量除以所确定的特征X射线强度,特征X射线光谱,将其分解为散射X射线强度的函数的形式,确定校准系数 测量表面上具有不规则性的测量样品,以小于临界全反射角的参考照射角度照射初级X射线,测定分析元件的特征X射线强度和散射X射线强度, 基于确定的散射X射线强度和所分析的量来确定应用于测量样品的校准系数 通过将校准系数与分析元件的特征X射线强度相乘来计算元素。