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    • 6. 发明授权
    • Method of fabricating an LED array
    • 制造LED阵列的方法
    • US5869221A
    • 1999-02-09
    • US997735
    • 1997-12-24
    • Mitsuhiko OgiharaYukio NakamuraTakatoku ShimizuMasumi Taninaka
    • Mitsuhiko OgiharaYukio NakamuraTakatoku ShimizuMasumi Taninaka
    • H01L27/15G03F9/00
    • H01L27/153
    • A method of fabricating an LED array includes forming a first insulating film composed of aluminum oxide on a semiconductor substrate of a first conductive type; patterning the first insulating film by photolithography to form a plurality of first windows; diffusing an impurity of a second conductive type through the plurality of first windows into the first insulating film, thereby forming a plurality of diffusion regions of the second conductive type below the plurality of first windows; forming a second insulating film on the first insulating film and the plurality of first windows; patterning the second insulating film by photolithography to-remove the second insulating film from the plurality of first windows, using an etchant that does not etch the first insulating film; forming a metal film on the second insulating film and the plurality of first windows; and patterning the metal film by photolithography to form a plurality of electrodes which make electrical contact with respective diffusion regions.
    • 制造LED阵列的方法包括在第一导电类型的半导体衬底上形成由氧化铝构成的第一绝缘膜; 通过光刻图案化第一绝缘膜以形成多个第一窗口; 将通过所述多个第一窗口的第二导电类型的杂质扩散到所述第一绝缘膜中,从而在所述多个第一窗口的下方形成所述第二导电类型的多个扩散区域; 在所述第一绝缘膜和所述多个第一窗口上形成第二绝缘膜; 使用不蚀刻第一绝缘膜的蚀刻剂通过光刻图案化第二绝缘膜以从多个第一窗口去除第二绝缘膜; 在所述第二绝缘膜和所述多个第一窗口上形成金属膜; 并通过光刻法形成金属膜以形成与各个扩散区电接触的多个电极。
    • 8. 发明授权
    • Led array fabrication process with improved unformity
    • Led阵列制造工艺具有改进的不整合性
    • US5733689A
    • 1998-03-31
    • US611410
    • 1996-03-06
    • Mitsuhiko OgiharaYukio NakamuraTakatoku ShimizuMasumi Taninaka
    • Mitsuhiko OgiharaYukio NakamuraTakatoku ShimizuMasumi Taninaka
    • H01L27/15G03F9/00
    • H01L27/153
    • A method of fabricating an LED array includes (a) forming a first insulating film composed of aluminum oxide on a semiconductor substrate of a first conductive type; (b) patterning the first insulating film by photolithography to form a plurality of first windows; (c) diffusing an impurity of a second conductive type through the plurality of first windows into the first insulating film, thereby forming a plurality of diffusion regions of the second conductive type below the plurality of first windows; (d) forming a second insulating film on the first insulating film and the plurality of first windows; (e) patterning the second insulating film by photolithography to remove the second insulating film from the plurality of first windows, using an etchant that does not etch the first insulating film; (f) forming a metal film on the second insulating film and the plurality of first windows; and (g) patterning the metal film by photolithography to form a plurality of electrodes which make electrical contact with respective diffusion regions.
    • 制造LED阵列的方法包括:(a)在第一导电类型的半导体衬底上形成由氧化铝构成的第一绝缘膜; (b)通过光刻图案化所述第一绝缘膜以形成多个第一窗口; (c)将通过所述多个第一窗口的第二导电类型的杂质扩散到所述第一绝缘膜中,从而在所述多个第一窗口下方形成所述第二导电类型的多个扩散区域; (d)在所述第一绝缘膜和所述多个第一窗口上形成第二绝缘膜; (e)使用不蚀刻第一绝缘膜的蚀刻剂通过光刻对第二绝缘膜图案化以从多个第一窗口去除第二绝缘膜; (f)在所述第二绝缘膜和所述多个第一窗口上形成金属膜; 和(g)通过光刻法形成金属膜以形成与各个扩散区电接触的多个电极。
    • 10. 发明授权
    • Light emitting semiconductor device with stacked structure
    • 具有层叠结构的发光半导体器件
    • US06180961B2
    • 2001-01-30
    • US09093609
    • 1998-06-09
    • Mitsuhiko OgiharaYukio NakamuraMasumi TaninakaTakatoku Shimizu
    • Mitsuhiko OgiharaYukio NakamuraMasumi TaninakaTakatoku Shimizu
    • H01L3300
    • H01L33/025H01L27/153H01L33/24
    • A high-density semiconductor device and semiconductor device array exhibiting high light emission efficiency which can be mass-produced at low cost with high yield is provided. An LED array comprises a structure wherein an n-type GaAs buffer layer 102 is formed on an n-type GaAs substrate 101, on which are then stacked an n-type AlzGa1−zAs layer 103, an n-type AlyGa1−yAs layer 104, a semi-insulating AlxGa1−xAs layer 105, and a semi-insulating GaAs layer 106. The energy band gaps of the AlzGa1−zAs layer 103 and AlxGa1−xAs layer 105 are at least larger than the energy band gap of the AlyGa1−yAs layer 104. A pn junction is formed by selective diffusion, having a diffusion front in the semiconductor layer having the smaller energy band gap sandwiched between the semiconductor layers having the larger energy band gaps. The outermost layer forming ohmic contact is made a p-type GaAs region formed by zinc diffusion in a semi-insulating GaAs layer.
    • 提供了一种可以以低成本,高产率批量生产的高发光效率的高密度半导体器件和半导体器件阵列。 LED阵列包括其中n型GaAs缓冲层102形成在n型GaAs衬底101上的结构,然后将n型GaAs缓冲层102层叠在n型AlzGa1-zAs层103,n型AllyGa1-yAs层104 ,半绝缘Al x Ga 1-x As层105和半绝缘GaAs层106.AlzGa1-zAs层103和AlxGa1-xAs层105的能带隙至少大于Al y Ga 1-x As层105的能带隙。 通过选择性扩散形成pn结,在半导体层中具有在具有较大能带间隙的半导体层之间具有较小能带隙的扩散前沿。 形成欧姆接触的最外层是在半绝缘GaAs层中通过锌扩散形成的p型GaAs区。