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1. 发明申请

US20140216800A1 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT 有权
标题翻译：配有电子元器件的接线板
公开(公告)号：US20140216800A1
公开(公告)日：2014-08-07
申请号：US14168414
申请日：2014-01-30
申请人： Ibiden Co., Ltd.
发明人： Masahiro ZANMA , Masafumi Niwa , Toshiki Furutani
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H05K3/007 , H05K3/4602 , H05K3/4644
摘要： A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.
摘要翻译：具有内置电子部件的布线基板包括厚度不超过300μm的芯基板，在芯基板的表面具有开口的空腔，厚度不超过300μm的电子部件，芯基板的空腔，以及形成在芯基板的表面上并且包括绝缘树脂层和布线层的层叠结构，使得层叠结构覆盖芯基板的空腔的开口和容纳在芯基板中的电子部件核心衬底的腔体。电子部件具有绝缘材料体和形成在绝缘材料体的表面上的电极，并且层叠结构的布线层形成为使得布线层的厚度设定为小于电极的厚度。

2. 发明授权

US09220168B2 Wiring board with built-in electronic component 有权
标题翻译：配有内置电子元件的接线板
公开(公告)号：US09220168B2
公开(公告)日：2015-12-22
申请号：US14168414
申请日：2014-01-30
申请人： IBIDEN CO., LTD.
发明人： Masahiro Zanma , Masafumi Niwa , Toshiki Furutani
IPC分类号： H05K1/11 , H05K1/18 , H05K3/00 , H05K3/46
CPC分类号： H05K1/185 , H05K3/007 , H05K3/4602 , H05K3/4644
摘要： A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.
摘要翻译：具有内置电子部件的布线基板包括厚度不超过300μm的芯基板，在芯基板的表面具有开口的空腔，厚度不超过300μm的电子部件，芯基板的空腔，以及形成在芯基板的表面上并且包括绝缘树脂层和布线层的层叠结构，使得层叠结构覆盖芯基板的空腔的开口和容纳在芯基板中的电子部件核心衬底的腔体。电子部件具有绝缘材料体和形成在绝缘材料体的表面上的电极，并且层叠结构的布线层形成为使得布线层的厚度设定为小于电极的厚度。

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