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1. 发明申请

US20210111289A1 WAVEGUIDE PHOTOELECTRIC DETECTOR 有权
公开(公告)号：US20210111289A1
公开(公告)日：2021-04-15
申请号：US17038147
申请日：2020-09-30
申请人： InnoLight Technology (Suzhou) LTD.
发明人： Chih-Kuo TSENG , Xianyao LI , Yuzhou SUN
IPC分类号： H01L31/0232 , H01L31/105
摘要： A waveguide photoelectric detector, comprising: a substrate comprising a silicon layer, the silicon layer having a silicon waveguide formed thereon; an active layer dispose on the silicon waveguide, the active layer having a first doped region formed thereon; a horizontal PIN junction formed at an area of the silicon layer below the active layer, the horizontal PIN junction comprising a second doped region, an intrinsic region, and a third doped region. A doping type of the second doped region is the same as that of the first doped region. One end of the second doped region near the intrinsic region is connected to the first doped region. The third doped region and the first doped region form a vertical PIN junction.

2. 发明申请

US20190025528A1 OPTICAL MODULE 审中-公开
公开(公告)号：US20190025528A1
公开(公告)日：2019-01-24
申请号：US16024963
申请日：2018-07-02
申请人： InnoLight Technology (Suzhou) LTD.
发明人： Yuzhou SUN , Long CHEN , Dengqun YU , Weilong LEE
IPC分类号： G02B6/42
摘要： An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

3. 发明申请

US20170227762A1 OPTICAL ASSEMBLY AND OPTICAL MODULE 审中-公开
公开(公告)号：US20170227762A1
公开(公告)日：2017-08-10
申请号：US15414884
申请日：2017-01-25
申请人： InnoLight Technology (Suzhou) LTD.
发明人： Long CHEN , Yuzhou SUN , Donghan WANG , Weilong LI , Dengqun YU
IPC分类号： G02B27/00 , H04B10/40 , G02B6/42
CPC分类号： G02B27/0025 , G02B6/4206 , G02B6/4212 , G02B7/04 , G02B27/30 , H04B10/2504 , H04B10/40 , H04J14/02
摘要： An optical assembly is provided. The optical assembly includes a light transmitting terminal, a light receiving terminal, an optical component located between the light transmitting terminal and the light receiving terminal, a collimating unit located between the optical component and the light transmitting terminal, and a focusing unit located between the optical component and the light receiving terminal. The collimating unit includes a first lens located between the optical component and the light transmitting terminal, and a field lens located between the first lens and the optical component and configured to absorb an alignment error between the light transmitting terminal and the first lens. The focusing unit includes a second lens located between the optical component and the light receiving terminal.

4. 发明公开

US20230268718A1 SILICON-BASED TUNABLE FILTER, TUNABLE LASER AND OPTICAL MODULE 审中-公开
公开(公告)号：US20230268718A1
公开(公告)日：2023-08-24
申请号：US17921357
申请日：2021-06-02
申请人： INNOLIGHT TECHNOLOGY (SUZHOU) LTD.
发明人： Defen GUO , Xianyao LI , Wenkai TU , Yuzhou SUN , Tianhua LIN
IPC分类号： H01S5/14 , H01S5/026 , H01S5/50 , H01S5/10
CPC分类号： H01S5/142 , H01S5/0265 , H01S5/50 , H01S5/1007 , H01S5/1071
摘要： Provided are a silicon-based tunable filter, laser and an optical module. The tunable laser comprises a semiconductor optical amplifier and a silicon photonic integrated chip, wherein a first coupler, a phase regulator and a tunable filter are provided on the silicon photonic integrated chip; the tunable filter comprises a flat-top band-pass filter structure, a Mach-Zehnder interferometry (MZI) structure and a micro ring resonation (MRR) structure, which are cascaded; gain light emitted by the semiconductor optical amplifier is coupled to the silicon photonic integrated chip by means of the first coupler, and a narrowband filtered optical signal is output by means of the tunable filter; and the phase of the gain light is regulated by means of the phase regulator so as to output single-peak narrowband laser light with a tunable target wavelength.

5. 发明申请

US20200081205A1 OPTICAL MODULE 审中-公开
公开(公告)号：US20200081205A1
公开(公告)日：2020-03-12
申请号：US16685119
申请日：2019-11-15
申请人： InnoLight Technology (Suzhou) LTD.
发明人： Yuzhou SUN , Long CHEN , Dengqun YU , Weilong LEE
IPC分类号： G02B6/42
摘要： An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

6. 发明公开

US20240219663A1 OPTICAL MODULE 审中-公开
公开(公告)号：US20240219663A1
公开(公告)日：2024-07-04
申请号：US18558529
申请日：2021-12-06
申请人： INNOLIGHT TECHNOLOGY (SUZHOU) LTD. , INNOLIGHT TECHNOLOGY (TONGLING) LTD.
发明人： Liang LUO , Fanghong LIU , Yuzhou SUN
IPC分类号： G02B6/42
CPC分类号： G02B6/428 , G02B6/4206 , G02B6/4269 , G02B6/4284
摘要： An optical module comprises a housing, and an optical assembly and a circuit board which are arranged inside the housing. The optical module further comprises an optical device box arranged inside the housing. The optical assembly is packaged in the optical device box; the circuit board is provided with an extension portion extending to overlap the optical device box; the optical device box is fixed on one surface of the extension portion; the optical device box is provided with an optical interface and an electrical interface; the optical assembly comprises a photoelectric chip and an optical processing unit, the photoelectric chip being electrically connected to the circuit board outside the optical device box by means of the electrical interface.

7. 发明申请

US20190204517A1 OPTICAL MODULE 审中-公开
公开(公告)号：US20190204517A1
公开(公告)日：2019-07-04
申请号：US16227508
申请日：2018-12-20
申请人： InnoLight Technology (Suzhou) LTD.
发明人： Long CHEN , Yuzhou SUN , Xiongfei ZHAI , Donghan WANG , Zhenzhong WANG , Meng FANG , Chao ZHANG , Xigui FANG , Xiangzhong WANG
IPC分类号： G02B6/42
摘要： An optical module includes a housing, and a main circuit board, an optical transmitting assembly, an optical receiving assembly, and an electrical connector that are disposed inside the housing. Each one of the optical transmitting assembly and optical receiving assembly includes at least two sets of optoelectronic chips, an optical assembly, and an optical fiber receptacle. The electrical connector electrically connects the optical transmitting assembly and/or optical receiving assembly to the main circuit board.

8. 发明申请

US20170227721A1 OPTICAL PATH CONTROL SYSTEM AND OPTICAL MODULE 审中-公开
公开(公告)号：US20170227721A1
公开(公告)日：2017-08-10
申请号：US15413761
申请日：2017-01-24
申请人： InnoLight Technology (Suzhou) LTD.
发明人： Dengqun YU , Yuzhou SUN , Long CHEN , Donghan WANG , Weilong LI
IPC分类号： G02B6/42 , G02B27/10 , G02B6/293
CPC分类号： G02B6/4206 , G02B6/2938 , G02B6/4214 , G02B6/4246 , G02B19/0014 , G02B27/1006 , H04B10/11 , H04B10/2504 , H04B10/40
摘要： An optical path control system is provided. The optical path control system includes a converging lens used to converge a plurality of light beams passing through the converging lens, and an optical path assembly used to control propagation directions of the plurality of light beams passing through the optical path assembly. When the plurality of light beams pass through the optical path assembly and the converging lens sequentially, the optical path assembly converges the plurality of light beams, and the converging lens converges each of the plurality of light beam into a point of light.

9. 发明申请

US20130330080A1 Wavelength Division Multiplexing/De-Multiplexing Optical Assembly for High Speed Parallel Long Distance Transmission 审中-公开
标题翻译：用于高速并行长距离传输的波分复用/去复用光学组件
公开(公告)号：US20130330080A1
公开(公告)日：2013-12-12
申请号：US13836413
申请日：2013-03-15
申请人： InnoLight Technology (Suzhou) Ltd.
发明人： Weilong LI , Yuzhou SUN , Pan WANG , Peng HUANG , Gaohong SHI , Sheng LIU
IPC分类号： H04J14/02
CPC分类号： H04J14/02 , G02B6/29367
摘要： A wavelength division multiplexing/de-multiplexing optical assembly for high speed parallel long distance transmission, wherein, the output terminal of the laser group is provided with the silicon lens group, the optical adjusting plate group, the lower layer silicon lens array, the lower layer filter group, and the lower layer free space wavelength division multiplexer, the optical isolator, and the focusing lens arranged in turn; the output terminal of the focusing lens is coupled with an input optical fiber; an output optical fiber is coupled with the collimating lens; the output terminal of the collimating lens is coupled with a prism; the output terminal of the prism is provided with the upper layer free space wavelength division multiplexer, the upper layer filter group, the upper layer silicon lens array and the detector group arranged in turn. Thereby, multiplexing/de-multiplexing of optical signals is realized by use of filter groups.
摘要翻译：一种用于高速并行长距离传输的波分复用/解复用光学组件，其中，激光组的输出端设置有硅透镜组，光调节板组，下层硅透镜阵列，下层滤波器组和下层自由空间波分复用器，光隔离器和聚焦透镜依次布置; 聚焦透镜的输出端与输入光纤耦合; 输出光纤与准直透镜耦合; 准直透镜的输出端与棱镜耦合; 棱镜的输出端子设置有上层自由空间波分复用器，上层滤波器组，上层硅透镜阵列和检测器组依次布置。由此，通过使用滤波器组来实现光信号的复用/解复用。

10. 发明公开

US20230333335A1 OPTICAL MODULE PACKAGE STRUCTURE 审中-公开
公开(公告)号：US20230333335A1
公开(公告)日：2023-10-19
申请号：US18032571
申请日：2021-08-03
申请人： INNOLIGHT TECHNOLOGY (SUZHOU) LTD.
发明人： Yuzhou SUN , Zhenzhong WANG , Dengqun YU
IPC分类号： G02B6/42
CPC分类号： G02B6/4269 , G02B6/428
摘要： An optical module package structure, comprising a housing, and a circuit board, a first device, and a sub-board that are packaged in the housing. The housing comprises a first housing and a second housing. An outer surface of the first housing is a main heat-dissipation surface. The first device is electrically connected to the circuit board by means of the sub-board. A first signal line is provided the circuit board. An extension section is provided on the sub-board. The sub-board partially overlaps the circuit board, and is connected to same. The first signal line extends to the extension section. The surfaces of the sub-board and the circuit board which partially overlap each other face opposite directions. The first device is electrically connected to the extension section. The first device is provided with a heat-dissipation surface. The heat-dissipation surface faces the first housing, and is thermally connected to same.

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