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1. 发明授权

US11940197B2 Cooling systems and methods using two circuits with water flow in a counter flow and in a series or parallel arrangement 有权
公开(公告)号：US11940197B2
公开(公告)日：2024-03-26
申请号：US17720730
申请日：2022-04-14
申请人： INERTECH IP LLC
发明人： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
IPC分类号： F25D17/02 , F25B1/00 , F25B25/00
CPC分类号： F25D17/02 , F25B25/005 , F25B1/00 , F25B1/005 , F25B2339/047
摘要： The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

2. 发明申请

US20210076538A1 AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS 有权
公开(公告)号：US20210076538A1
公开(公告)日：2021-03-11
申请号：US16928633
申请日：2020-07-14
申请人： Inertech IP LLC
发明人： Earl Keisling , John Costakis , Gerald McDonnell
IPC分类号： H05K7/20 , F21V33/00
摘要： An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

3. 发明授权

US09648784B2 Systems and assemblies for cooling server racks 有权
公开(公告)号：US09648784B2
公开(公告)日：2017-05-09
申请号：US14216005
申请日：2014-03-17
申请人： Inertech IP LLC
发明人： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20609 , H05K5/02 , H05K7/20745 , H05K7/2079
摘要： A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

4. 发明申请

US20150181770A1 AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS 审中-公开
标题翻译：数据中心服务器机架的空气流量分配系统
公开(公告)号：US20150181770A1
公开(公告)日：2015-06-25
申请号：US14473395
申请日：2014-08-29
申请人： INERTECH IP LLC
发明人： Earl Keisling , John Costakis , Gerald McDonnell
IPC分类号： H05K7/20 , F21V33/00
CPC分类号： H05K7/20745 , F21V33/0092 , F21W2131/40
摘要： An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.
摘要翻译：用于冷却服务器机架的气流分配系统包括至少一个部分地限定热通道和冷通道的服务器机架，设置在服务器机架上方的第一气垫和设置在第一气翼上方的第二气箔。第一气翼和第二气翼被构造成从热通道接收空气，并在冷通道中形成湍流尾迹图案，其部分地由服务器机架限定。气流分配系统可以包括在第二气翼上方的凸顶件。相应的方法包括使空气被引导到设置在服务器机架上方的第一空气箔和设置在第一空气箔之上的第二空气箔，以在冷通道中形成湍流尾流图案。电气外壳组件包括插座和构造为空气箔的盖构件。

5. 发明申请

US20230031815A1 COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID 有权
公开(公告)号：US20230031815A1
公开(公告)日：2023-02-02
申请号：US17856654
申请日：2022-07-01
申请人： INERTECH IP LLC
发明人： Ming Zhang , Ken Nguyen , Doron Shapiro , John Costakis
IPC分类号： F28D7/00 , H05K7/20 , F28D1/047 , F28F1/02 , G06F1/20 , F28F9/013 , F28F1/12 , F28D1/053 , F28F21/08 , B23K1/00 , B23P15/26 , F28F9/02
摘要： A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

6. 发明授权

US11384989B2 Cooling systems and methods using single-phase fluid 有权
公开(公告)号：US11384989B2
公开(公告)日：2022-07-12
申请号：US15697445
申请日：2017-09-06
申请人： Inertech IP LLC
发明人： Ming Zhang , Ken Nguyen , Doron Shapiro , John Costakis
IPC分类号： F28D7/00 , H05K7/20 , F28D1/047 , F28F1/02 , G06F1/20 , F28F9/013 , F28F1/12 , F28D1/053 , F28F21/08 , B23K1/00 , B23P15/26 , F28F9/02
摘要： A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

7. 发明授权

US10448539B2 Systems and assemblies for cooling server racks 有权
公开(公告)号：US10448539B2
公开(公告)日：2019-10-15
申请号：US15590596
申请日：2017-05-09
申请人： INERTECH IP LLC
发明人： Earl Keisling , John Costakis , Gerald McDonnell , Michael Welch
IPC分类号： H05K7/20 , H05K5/02
摘要： A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

8. 发明申请

US20180087841A1 COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID 审中-公开
公开(公告)号：US20180087841A1
公开(公告)日：2018-03-29
申请号：US15697445
申请日：2017-09-06
申请人： Inertech IP LLC
发明人： Ming Zhang , Ken Nguyen , Doron Shapiro , John Costakis
IPC分类号： F28D7/00 , F28F9/02 , F28F1/12 , B23P15/26 , B23K1/00
CPC分类号： F28D7/0066 , B23K1/0012 , B23P15/26 , F28D1/0478 , F28D1/05391 , F28F1/022 , F28F1/12 , F28F1/128 , F28F9/013 , F28F9/02 , F28F21/084 , F28F2225/08 , F28F2275/04 , G06F1/20 , G06F2200/201 , H05K7/20654 , H05K7/2079
摘要： A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

9. 外观设计

USD709465S1 Panel assembly for electronic equipment 有权
标题翻译：电子设备面板组件
公开(公告)号：USD709465S1
公开(公告)日：2014-07-22
申请号：US29455941
申请日：2013-05-28
申请人： Inertech IP LLC
设计人： Earl Keisling , John Costakis , Gerald McDonnell

10. 发明公开

US20240384916A1 COOLING SYSTEMS AND METHODS USING TWO CIRCUITS WITH WATER FLOW IN A COUNTER FLOW AND IN A SERIES OR PARALLEL ARRANGEMENT 审中-公开
公开(公告)号：US20240384916A1
公开(公告)日：2024-11-21
申请号：US18616139
申请日：2024-03-25
申请人： INERTECH IP LLC
发明人： Gerald McDonnell , Ming Zhang , John Costakis , Earl Keisling
IPC分类号： F25D17/02 , F25B1/00 , F25B25/00
CPC分类号： F25D17/02 , F25B25/005 , F25B1/00 , F25B1/005 , F25B2339/047
摘要： The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

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