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    • 9. 发明授权
    • Micro-scheduling method and operating system kernel
    • 微调度方法和操作系统内核
    • US06779181B1
    • 2004-08-17
    • US09536044
    • 2000-03-27
    • Hang-jae YuHyun-sik Kim
    • Hang-jae YuHyun-sik Kim
    • G06F900
    • G06F9/4881
    • A scheduling method implemented in an operating system kernel for supporting multimedia applications is provided. The micro-scheduling method includes the steps of determining a performance parameter by measuring I/O-bound job performance and CPU-bound job performance in a given application, and appropriately adjusting the performance parameter according to a policy set by a system administrator when carrying out job admission control. Determining an order of priority for processing application classes based on the performance measuring and job admission control by scheduling the periodical execution of I/O jobs of data which need not be moved to a user space due to the characteristics of multimedia applications, and executing a special I/O system call according to the order of priority for processing is also provided. The micro-scheduling method enables the support of accurate QoS for any operating system which supports multimedia applications.
    • 提供了一种在支持多媒体应用的操作系统内核中实现的调度方法。 微调度方法包括以下步骤:通过测量给定应用中的I / O绑定作业性能和CPU绑定作业性能来确定性能参数,并根据系统管理员在携带时设置的策略来适当地调整性能参数 出入职控制。 通过调度由于多媒体应用的特性而不需要移动到用户空间的数据的I / O作业的定期执行,确定基于性能测量和作业准入控制来处理应用类的优先级顺序,以及执行 还提供了按照优先级顺序进行特殊I / O系统调用的处理。 微调度方法支持对支持多媒体应用的任何操作系统的准确QoS。
    • 10. 发明授权
    • Methods of fabricating field effect transistors by first forming heavily doped source/drain regions and then forming lightly doped source/drain regions
    • 通过首先形成重掺杂的源极/漏极区域,然后形成轻掺杂的源极/漏极区域来制造场效应晶体管的方法
    • US06245624B1
    • 2001-06-12
    • US09304356
    • 1999-05-04
    • Hyun-sik KimHeon-jong Shin
    • Hyun-sik KimHeon-jong Shin
    • H01L21336
    • H01L29/6659
    • Heavily doped source/drain regions are formed in an integrated circuit substrate prior to forming lightly doped source/drain regions in the integrated circuit substrate. High temperature thermal processing preferably is carried out prior to forming the lightly doped source/drain regions in the integrated circuit substrate. Reduced short channel effects may thereby be obtained while still achieving shallow junctions. More specifically, an insulated gate electrode comprising polysilicon is formed on an integrated circuit substrate. The insulated gate electrode is oxidized. A gate spacer is formed on the oxidized sidewalls of the insulated gate electrode. Heavily doped source/drain regions are formed in the integrated circuit substrate by first implanting ions into the integrated circuit substrate using the insulated gate electrode and the gate spacer on the oxidized sidewalls of the insulated gate electrode as an implantation mask. The gate spacer is removed from the oxidized sidewalls of the insulated gate electrode after performing the step of forming heavily doped source/drain regions in the integrated circuit substrate. Finally, lightly doped source/drain regions, that are lightly doped relative to the heavily doped source/drain regions, are formed in the integrated circuit substrate. The lightly doped source/drain regions are formed by implanting ions into the integrated circuit substrate using the insulated gate electrode as an implantation mask, after performing the step of removing the gate spacers from the oxidized sidewalls of the insulated gate electrode.
    • 在集成电路基板中形成轻掺杂的源极/漏极区之前,在集成电路衬底中形成重掺杂的源/漏区。 优选在形成集成电路基板内的轻掺杂源/漏区之前进行高温热处理。 从而可以在仍然实现浅结的同时获得减少的短通道效应。 更具体地,在集成电路基板上形成包括多晶硅的绝缘栅电极。 绝缘栅电极被氧化。 在绝缘栅电极的氧化侧壁上形成栅极间隔物。 在集成电路衬底中形成重掺杂的源极/漏极区,首先使用绝缘栅电极和绝缘栅电极的氧化侧壁上的栅极间隔作为注入掩模将离子注入集成电路衬底。 在执行在集成电路基板中形成重掺杂源极/漏极区域的步骤之后,将栅极间隔物从绝缘栅电极的氧化侧壁上去除。 最后,在集成电路衬底中形成相对于重掺杂源/漏区轻稀释的轻掺杂源/漏区。 在执行从绝缘栅电极的氧化侧壁去除栅极间隔物的步骤之后,通过使用绝缘栅电极作为注入掩模将离子注入到集成电路衬底中来形成轻掺杂的源/漏区。