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1. 发明申请

US20120088077A1 INJECTION PREFORM HAVING PATTERN ON SURFACE THEREOF AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有其表面的图案的注射预制件及其制造方法
公开(公告)号：US20120088077A1
公开(公告)日：2012-04-12
申请号：US13239928
申请日：2011-09-22
申请人： Hyun-Jung JUNG , Chang-Youn HWANG , Hoon-Soo PARK , Jung-Hyeon KIM
发明人： Hyun-Jung JUNG , Chang-Youn HWANG , Hoon-Soo PARK , Jung-Hyeon KIM
IPC分类号： B32B3/10 , B05D5/02 , B32B27/00
CPC分类号： B05D7/04 , B05D5/06 , B05D7/56 , Y10T428/24851 , Y10T428/24868
摘要： An injection preform having a pattern on a surface thereof and realizing a transparent pattern paint layer for forming a crack pattern in a transparent or semi-transparent substrate, and a method of manufacturing the same. The injection preform preferably includes: a substrate injection molded so as to be transparent or semi-transparent; a primer layer painted on a rear surface of the substrate; a transparent pattern paint layer painted on a rear surface of the primer layer, a surface of the transparent pattern paint layer being dried with hot air in an oven such that a pattern is formed; a deposition layer deposited on a rear surface of the transparent pattern paint layer; a finishing layer painted on a rear surface of the deposition layer; and a clear coating layer painted on a front surface of the substrate.
摘要翻译：一种在其表面上具有图案并且实现在透明或半透明基板中形成裂纹图案的透明图案涂料层的注射成型体及其制造方法。注射成型体优选包括：注射成型为透明或半透明的基底; 涂布在基板的后表面上的底漆层; 涂布在底漆层的背面上的透明图案涂料层，透明图案涂料层的表面在烘箱中用热风干燥，形成图案; 沉积在所述透明图案涂料层的后表面上的沉积层; 涂覆在沉积层的后表面上的整理层; 以及涂布在基板的前表面上的透明涂层。

2. 发明申请

US20080113524A1 SOCKET FOR TESTING SEMICONDUCTOR PACKAGE 失效
标题翻译：用于测试半导体封装的插座
公开(公告)号：US20080113524A1
公开(公告)日：2008-05-15
申请号：US11940044
申请日：2007-11-14
申请人： Seoung-Su HA , Jin-Won KANG , Jung-Hyeon KIM , Se-Jun YU
发明人： Seoung-Su HA , Jin-Won KANG , Jung-Hyeon KIM , Se-Jun YU
IPC分类号： H01R13/20
CPC分类号： G01R1/0466 , G01R1/0483 , H01R11/30 , H01R12/7076 , H01R13/2407
摘要： Example embodiments of the present invention include a socket for testing a semiconductor package. The socket comprises a body having a through hole. A lower magnet is disposed in a lower region of the through hole, and a first type magnetic pole of the lower magnet is directed upward. An upper magnet is disposed in an upper region of the through hole, wherein the first type magnetic pole of the upper magnet is directed toward the lower magnet. The upper and lower magnets are structured to absorb a shock wave which is generated when the semiconductor package is arranged for testing. A conductive medium is disposed between the lower magnet and the upper magnet to electrically couple contactors of the semiconductor package to a base substrate of the socket.
摘要翻译：本发明的示例性实施例包括用于测试半导体封装的插座。插座包括具有通孔的主体。下磁铁配置在通孔的下部区域，下磁铁的第一型磁极向上方。上磁体设置在通孔的上部区域中，其中上磁体的第一型磁极指向下磁体。上磁铁和下磁体被构造成吸收当半导体封装被布置用于测试时产生的冲击波。导电介质设置在下磁体和上磁体之间，以将半导体封装的接触器电耦合到插座的基底。

3. 发明申请

US20090065175A1 FIN-TYPE HEAT SINK FOR ELECTRONIC COMPONENT 有权
标题翻译：用于电子元件的FIN型散热器
公开(公告)号：US20090065175A1
公开(公告)日：2009-03-12
申请号：US12205773
申请日：2008-09-05
申请人： Hyo-Jae BANG , Jung-Hyeon KIM
发明人： Hyo-Jae BANG , Jung-Hyeon KIM
IPC分类号： F28F7/00
CPC分类号： H01L23/367 , H01L23/3672 , H01L2924/0002 , H05K7/20436 , H01L2924/00
摘要： One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.
摘要翻译：本文示例性描述的一个实施例通常可以表征为电子部件的散热器。散热器可以包括可与电子部件热接触的主体; 至少一个翅片与主体热接触; 和一个限制成员。所述至少一个翅片和所述限制构件可以协同地接合，使得所述至少一个翅片可在相对于所述主体的纵向轴线的第一位置和相对于所述主体的纵向轴线的第二位置之间移动身体。

4. 发明申请

US20140160660A1 SUPER CAPACITOR CASING AND SUPERCAPACITOR EMBEDDED DEVICE 审中-公开
标题翻译：超级电容器和超级电容器嵌入式器件
公开(公告)号：US20140160660A1
公开(公告)日：2014-06-12
申请号：US13709635
申请日：2012-12-10
申请人： Hyo-Jae BANG , Jung-Hyeon KIM
发明人： Hyo-Jae BANG , Jung-Hyeon KIM
IPC分类号： G06F1/18
CPC分类号： G06F1/183 , G06F1/181 , H01G11/78 , H01G17/00 , H05K7/1432 , Y02E60/13
摘要： A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.
摘要翻译：用于支撑其中的固态器件SSD的壳体和其中的超级电容器以电子方式连接在一起。

5. 发明申请

US20090140972A1 LIGHT SOURCE ASSEMBLY, LIQUID CRYSTAL DISPLAY, AND METHOD OF DRIVING LIGHT SOURCE ASSEMBLY 有权
标题翻译：光源组件，液晶显示器和驱动光源组件的方法
公开(公告)号：US20090140972A1
公开(公告)日：2009-06-04
申请号：US12274738
申请日：2008-11-20
申请人： Se-Ki PARK , Gi-Cherl KIM , Sang-Il PARK , Jung-Hyeon KIM
发明人： Se-Ki PARK , Gi-Cherl KIM , Sang-Il PARK , Jung-Hyeon KIM
IPC分类号： G09G3/36 , H05B37/02 , G02F1/13357
CPC分类号： G09G3/3607 , G02F1/133609 , G09G3/3413 , G09G2320/064 , G09G2320/0666 , G09G2360/145
摘要： A light source assembly includes a light source which emits light; a detector which detects the light and generates a light signal based on a property of the light; an operator operably connected to the detector and which receives the light signal and calculates a color coordinate of the light source based on the light signal; a comparator operably connected to the operator and which compares the color coordinate of the light source to a predetermined reference color coordinate; and a control unit operably connected to the comparator and which controls a pulse width modulation signal transmitted to the light source based on a result of the comparison of the comparator.
摘要翻译：光源组件包括发光的光源; 检测器，其基于所述光的特性来检测所述光并产生光信号; 可操作地连接到检测器的操作器，其接收光信号并且基于光信号计算光源的颜色坐标; 比较器，可操作地连接到操作者，并将光源的颜色坐标与预定的参考颜色坐标进行比较; 以及控制单元，其可操作地连接到所述比较器，并且其基于所述比较器的比较结果来控制传输到所述光源的脉宽调制信号。

6. 发明申请

US20080042279A1 MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：具有通孔和填充树脂层的半导体器件的安装结构以及安装半导体器件的方法
公开(公告)号：US20080042279A1
公开(公告)日：2008-02-21
申请号：US11842858
申请日：2007-08-21
申请人： Hyo-Jae BANG , Wha-Su SIN , Sung-Yeol LEE , Yung-Hyun KIM , Seong-Chan HAN , Jung-Hyeon KIM
发明人： Hyo-Jae BANG , Wha-Su SIN , Sung-Yeol LEE , Yung-Hyun KIM , Seong-Chan HAN , Jung-Hyeon KIM
IPC分类号： H01L23/488 , H01L21/60 , H01L21/66
CPC分类号： H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/03828 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05669 , H01L2224/111 , H01L2224/11334 , H01L2224/13099 , H01L2224/131 , H01L2224/1369 , H01L2224/16 , H01L2224/81011 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/0001 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/351 , H05K3/4015 , H01L2924/0665 , H01L2924/00 , H01L2924/013 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux. Using the epoxy-based resin, the first soldering flux can substantially prevent crack from being generated in a solder joint between the conductive ball and the ball pad even when the device substrate is thermally deformed due to temperature variations.
摘要翻译：提供半导体器件的安装结构和安装半导体器件的方法。安装结构包括具有终端焊盘的电路基板。器件衬底位于电路衬底上方，该衬底具有面向电路衬底的端子焊盘的球垫。在电路基板和器件基板之间形成导电球，以将电路基板的端子焊盘连接到器件基板的球垫。包括环氧基树脂的第一助焊剂将导电球连接到器件基板的球垫。在电路基板和器件基板之间形成底部填充层，以便埋入导电球和第一焊剂。使用环氧树脂，即使当器件基板由于温度变化而发生热变形时，第一焊剂可以基本上防止在导电球和球垫之间的焊接接头中产生裂纹。

7. 发明申请

US20100232124A1 SUPER CAPACITOR CASING AND SUPERCAPACITOR EMBEDDED DEVICE 有权
标题翻译：超级电容器和超级电容器嵌入式器件
公开(公告)号：US20100232124A1
公开(公告)日：2010-09-16
申请号：US12713282
申请日：2010-02-26
申请人： Hyo-Jae BANG , Jung-Hyeon KIM
发明人： Hyo-Jae BANG , Jung-Hyeon KIM
IPC分类号： H05K5/02
CPC分类号： H05K1/18 , H01G9/08 , H01G9/155 , H01L2224/16227 , H01L2924/00011 , H01L2924/00014 , H01L2924/19106 , H05K3/325 , H05K3/403 , H05K5/0091 , H05K2201/09181 , H05K2201/10015 , H05K2201/10515 , H01L2224/0401
摘要： A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.
摘要翻译：用于支撑其中的固态器件SSD的壳体和其中的超级电容器以电子方式连接在一起。

8. 发明申请

US20100134707A1 LIQUID CRYSTAL DISPLAY 有权
标题翻译：液晶显示器
公开(公告)号：US20100134707A1
公开(公告)日：2010-06-03
申请号：US12508031
申请日：2009-07-23
申请人： Sung-Woon KIM , Hwa-Sung WOO , Joo-Nyung JANG , Mi-Jeong SONG , Hyang-Yul KIM , Cheol SHIN , Dong-Chul SHIN , Hee-Seop KIM , Jung-Hyeon KIM
发明人： Sung-Woon KIM , Hwa-Sung WOO , Joo-Nyung JANG , Mi-Jeong SONG , Hyang-Yul KIM , Cheol SHIN , Dong-Chul SHIN , Hee-Seop KIM , Jung-Hyeon KIM
IPC分类号： G02F1/1343 , G09G3/36
CPC分类号： G02F1/133707 , G02F2001/133397 , G02F2001/134345 , G02F2001/13706 , G09G3/3614 , G09G3/3659 , G09G2300/0434 , G09G2300/0823 , G09G2320/0247 , G09G2320/0252 , G09G2320/028
摘要： A liquid crystal display includes; first and second substrates facing each other, a liquid crystal layer interposed between the first and second substrates and including liquid crystal molecules, a first subpixel electrode disposed on the first substrate, the first subpixel electrode receiving a first data voltage, a second subpixel electrode disposed on the first substrate, the second subpixel electrode receiving a second data voltage; and a short protrusion disposed on the second substrate and simultaneously facing the first and second subpixel electrodes, wherein the liquid crystal layer is vertically aligned and has positive dielectric anisotropy.
摘要翻译：液晶显示器包括：第一和第二基板彼此面对，夹在第一和第二基板之间并包括液晶分子的液晶层，设置在第一基板上的第一子像素电极，第一子像素电极接收第一数据电压，第二子像素电极设置在所述第一基板上，所述第二子像素电极接收第二数据电压; 以及设置在所述第二基板上并同时面对所述第一和第二子像素电极的短突起，其中所述液晶层垂直取向并具有正的介电各向异性。

9. 发明申请

US20080139024A1 BURN-IN BOARD CONNECTION DEVICE AND METHOD 有权
标题翻译：燃烧板连接装置和方法
公开(公告)号：US20080139024A1
公开(公告)日：2008-06-12
申请号：US11937342
申请日：2007-11-08
申请人： Jae-Nam LEE , Jung-Hyeon KIM , Ju-Il KANG , Jin-Woo YANG
发明人： Jae-Nam LEE , Jung-Hyeon KIM , Ju-Il KANG , Jin-Woo YANG
IPC分类号： H01R13/62 , G01R31/26
CPC分类号： G01R31/2817 , G01R31/2863
摘要： A burn-in board connection device includes a first connection unit to hold a burn-in board and move in a first direction perpendicular to the burn-in board that is inserted in a chamber of a burn-in test device, a second connection unit to move in a second direction parallel to the burn-in board to attach/detach the burn-in board that is held by the first connection unit to/from a connector disposed in the chamber. A burn-in board connection method includes coupling a finger to the burn-in board by moving the finger in a first direction, attaching the burn-in board to a connector by moving the finger in a second direction, and driving the finger by converting a rotation of a servo motor into a linear movement of the finger.
摘要翻译：老化板连接装置包括：第一连接单元，用于保持老化板并且沿垂直于插入老化测试装置的室中的老化板的第一方向移动;第二连接单元沿平行于老化板的第二方向移动以将由第一连接单元保持的老化板与设置在腔室中的连接器相连接/分离。老化板连接方法包括通过沿第一方向移动手指将手指连接到老化板，通过沿第二方向移动手指将老化板附接到连接器，并且通过转换来驱动手指伺服电动机旋转到手指的线性运动。

10. 发明申请

US20080136580A1 CHIP NETWORK RESISTOR CONTACTING PCB THROUGH SOLDER BALLS AND SEMICONDUCTOR MODULE HAVING THE SAME 审中-公开
标题翻译：芯片网络电阻通过焊枪与半导体模块接触PCB
公开(公告)号：US20080136580A1
公开(公告)日：2008-06-12
申请号：US11947422
申请日：2007-11-29
申请人： Hyo-Jae BANG , Dong-Chun LEE , Seong-Chan HAN , Jung-Hyeon KIM , Hyun-Seok CHOI
发明人： Hyo-Jae BANG , Dong-Chun LEE , Seong-Chan HAN , Jung-Hyeon KIM , Hyun-Seok CHOI
IPC分类号： H01C1/01
CPC分类号： H01C1/144 , H01C1/01 , H01C7/18 , H05K3/3436 , H05K3/3442 , H05K2201/09172 , H05K2201/10045 , Y02P70/613
摘要： Provided are a chip network resistor contacting a printed circuit board (PCB) through solder balls and a semiconductor module having the chip network resistor. The chip network resistor includes: a body formed of an insulating material; a resistor formed on the body; external electrodes connected to the resistor and disposed on a lower surface of the body so as to have solder ball pad shapes; and conductive balls adhered on the external electrodes.
摘要翻译：提供了通过焊球与印刷电路板（PCB）接触的芯片网络电阻器和具有芯片网络电阻器的半导体模块。芯片网络电阻器包括：由绝缘材料形成的主体; 形成在体上的电阻; 外部电极连接到电阻器并且设置在主体的下表面上以具有焊球形状; 并且导电球附着在外部电极上。

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