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    • 8. 发明授权
    • Flip chip type nitride semiconductor light emitting device and manufacturing method thereof
    • 倒装芯片型氮化物半导体发光器件及其制造方法
    • US07235818B2
    • 2007-06-26
    • US10861511
    • 2004-06-07
    • Hyun Kyung KimYong Chun KimHyoun Soo Shin
    • Hyun Kyung KimYong Chun KimHyoun Soo Shin
    • H01L33/00
    • H01L33/405H01L33/32
    • Disclosed herein are a flip chip type nitride semiconductor light emitting device, which comprises a substrate for growing a nitride semiconductor material, an n-type nitride semiconductor layer formed on the substrate, an active layer formed on at least a part of the n-type nitride semiconductor layer, a p-type nitride semiconductor layer formed on the active layer, a bonding force providing layer formed on the p-type nitride semiconductor layer and adapted to provide a bonding force relative to the p-type nitride semiconductor layer, a reflective electrode layer formed on the bonding force providing layer, and adapted to reflect light produced in the active layer toward the substrate and to diffuse electric current, and a cap layer formed on the reflective electrode layer, and adapted to provide a bonding force between the reflective electrode layer and a bonding metal and to reduce contact resistance.
    • 本文公开了一种倒装芯片型氮化物半导体发光器件,其包括用于生长氮化物半导体材料的衬底,形成在衬底上的n型氮化物半导体层,形成在n型氮化物半导体的至少一部分上的有源层 氮化物半导体层,形成在有源层上的p型氮化物半导体层,形成在p型氮化物半导体层上并适于提供相对于p型氮化物半导体层的结合力的接合力提供层,反射 电极层,形成在所述接合力提供层上,并且适于将在所述有源层中产生的光朝向所述衬底反射并扩散电流;以及覆盖层,形成在所述反射电极层上,并且适于在所述反射层之间提供接合力 电极层和接合金属,并降低接触电阻。
    • 9. 发明授权
    • Flip chip type nitride semiconductor light-emitting diode
    • 倒装芯片型氮化物半导体发光二极管
    • US07294864B2
    • 2007-11-13
    • US10925934
    • 2004-08-26
    • Dong Joon KimHyun Kyung Kim
    • Dong Joon KimHyun Kyung Kim
    • H01L33/00
    • H01L33/405H01L33/32H01L33/387H01L33/44
    • A flip chip type nitride semiconductor light-emitting diode includes a light-transmissive substrate for growing nitride single crystals; an n-type nitride semiconductor layer formed on the light-transmissive substrate; an active layer formed on the n-type nitride semiconductor layer; a p-type nitride semiconductor layer formed on the active layer; a mesh-type dielectric layer formed on the p-type nitride semiconductor layer and having a mesh structure with a plurality of open regions in which the p-type nitride semiconductor layer is exposed; a highly reflective ohmic contact layer formed on the mesh-type dielectric layer and the open regions in which the p-type nitride semiconductor layer is exposed; and a p-bonding electrode and an n-electrode formed on the highly reflective ohmic contact layer and the n-type nitride semiconductor layer, respectively.
    • 倒装芯片型氮化物半导体发光二极管包括用于生长氮化物单晶的透光基板; 形成在所述透光性基板上的n型氮化物半导体层; 形成在所述n型氮化物半导体层上的有源层; 形成在有源层上的p型氮化物半导体层; 形成在所述p型氮化物半导体层上并且具有其中露出所述p型氮化物半导体层的多个开放区域的网状结构的网状电介质层; 形成在网状介电层上的高反射欧姆接触层和露出p型氮化物半导体层的开放区域; 以及分别形成在高反射欧姆接触层和n型氮化物半导体层上的p型接合电极和n电极。