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1. 发明授权

US07629207B2 Bottom gate thin film transistor and method of manufacturing the same 失效
标题翻译：底栅薄膜晶体管及其制造方法
公开(公告)号：US07629207B2
公开(公告)日：2009-12-08
申请号：US11692716
申请日：2007-03-28
申请人： Hyuck Lim , Young-soo Park , Wenxu Xianyu , Young-kwan Cha
发明人： Hyuck Lim , Young-soo Park , Wenxu Xianyu , Young-kwan Cha
IPC分类号： H01L21/00 , H01L21/84
CPC分类号： H01L29/78678 , H01L21/268 , H01L27/1285 , H01L29/66765 , H01L29/78609 , H01L29/78684 , H01L29/78696
摘要： A method of manufacturing a bottom gate thin film transistor (“TFT”) in which a polycrystalline channel region having a large grain size is formed relatively simply and easily. The method of manufacturing a bottom gate thin film transistor includes forming a bottom gate electrode on a substrate, forming a gate insulating layer on the substrate to cover the bottom gate electrode, forming an amorphous semiconductor layer, an N-type semiconductor layer and an electrode layer on the gate insulating layer sequentially, etching an electrode region and an N-type semiconductor layer region formed on the bottom gate electrode sequentially to expose an amorphous semiconductor layer region, melting the amorphous semiconductor layer region using a laser annealing method, and crystallizing the melted amorphous semiconductor layer region to form a laterally grown polycrystalline channel region.
摘要翻译：相对简单且容易地形成具有大晶粒尺寸的多晶沟道区的底栅薄膜晶体管（“TFT”）的制造方法。制造底栅极薄膜晶体管的方法包括在衬底上形成底栅电极，在衬底上形成栅极绝缘层以覆盖底栅电极，形成非晶半导体层，N型半导体层和电极依次在栅极绝缘层上蚀刻形成在底栅电极上的电极区域和N型半导体层区域，以暴露非晶半导体层区域，使用激光退火法熔化非晶半导体层区域，并使熔融的非晶半导体层区域以形成横向生长的多晶沟道区域。

2. 发明申请

US20070284580A1 BOTTOM GATE THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：底部薄膜薄膜晶体管及其制造方法
公开(公告)号：US20070284580A1
公开(公告)日：2007-12-13
申请号：US11692716
申请日：2007-03-28
申请人： Hyuck Lim , Young-soo Park , Wenxu Xianyu , Young-kwan Cha
发明人： Hyuck Lim , Young-soo Park , Wenxu Xianyu , Young-kwan Cha
IPC分类号： H01L29/76 , H01L29/10
CPC分类号： H01L29/78678 , H01L21/268 , H01L27/1285 , H01L29/66765 , H01L29/78609 , H01L29/78684 , H01L29/78696
摘要： A method of manufacturing a bottom gate thin film transistor (“TFT”) in which a polycrystalline channel region having a large grain size is formed relatively simply and easily. The method of manufacturing a bottom gate thin film transistor includes forming a bottom gate electrode on a substrate, forming a gate insulating layer on the substrate to cover the bottom gate electrode, forming an amorphous semiconductor layer, an N-type semiconductor layer and an electrode layer on the gate insulating layer sequentially, etching an electrode region and an N-type semiconductor layer region formed on the bottom gate electrode sequentially to expose an amorphous semiconductor layer region, melting the amorphous semiconductor layer region using a laser annealing method, and crystallizing the melted amorphous semiconductor layer region to form a laterally grown polycrystalline channel region.
摘要翻译：相对简单且容易地形成具有大晶粒尺寸的多晶沟道区的底栅薄膜晶体管（“TFT”）的制造方法。制造底栅极薄膜晶体管的方法包括在衬底上形成底栅电极，在衬底上形成栅极绝缘层以覆盖底栅电极，形成非晶半导体层，N型半导体层和电极依次在栅极绝缘层上蚀刻形成在底栅电极上的电极区域和N型半导体层区域，以暴露非晶半导体层区域，使用激光退火法熔化非晶半导体层区域，并使熔融的非晶半导体层区域以形成横向生长的多晶沟道区域。

3. 发明授权

US07919777B2 Bottom gate thin film transistor and method of manufacturing the same 失效
标题翻译：底栅薄膜晶体管及其制造方法
公开(公告)号：US07919777B2
公开(公告)日：2011-04-05
申请号：US12566106
申请日：2009-09-24
申请人： Hyuck Lim , Young-soo Park , Wenxu Xianyu , Young-kwan Cha
发明人： Hyuck Lim , Young-soo Park , Wenxu Xianyu , Young-kwan Cha
IPC分类号： H01L21/00 , H01L21/84 , H01L29/04
CPC分类号： H01L29/78678 , H01L21/268 , H01L27/1285 , H01L29/66765 , H01L29/78609 , H01L29/78684 , H01L29/78696
摘要： A method of manufacturing a bottom gate thin film transistor (“TFT”) in which a polycrystalline channel region having a large grain size is formed relatively simply and easily. The method of manufacturing a bottom gate thin film transistor includes forming a bottom gate electrode on a substrate, forming a gate insulating layer on the substrate to cover the bottom gate electrode, forming an amorphous semiconductor layer, an N-type semiconductor layer and an electrode layer on the gate insulating layer sequentially, etching an electrode region and an N-type semiconductor layer region formed on the bottom gate electrode sequentially to expose an amorphous semiconductor layer region, melting the amorphous semiconductor layer region using a laser annealing method, and crystallizing the melted amorphous semiconductor layer region to form a laterally grown polycrystalline channel region.
摘要翻译：相对简单且容易地形成具有大晶粒尺寸的多晶沟道区的底栅薄膜晶体管（“TFT”）的制造方法。制造底栅极薄膜晶体管的方法包括在衬底上形成底栅电极，在衬底上形成栅极绝缘层以覆盖底栅电极，形成非晶半导体层，N型半导体层和电极依次在栅极绝缘层上蚀刻形成在底栅电极上的电极区域和N型半导体层区域，以暴露非晶半导体层区域，使用激光退火法熔化非晶半导体层区域，并使熔融的非晶半导体层区域以形成横向生长的多晶沟道区域。

4. 发明申请

US20080118754A1 Single crystal silicon rod fabrication methods and a single crystal silicon rod structure 有权
标题翻译：单晶硅棒制造方法和单晶硅棒结构
公开(公告)号：US20080118754A1
公开(公告)日：2008-05-22
申请号：US11976009
申请日：2007-10-19
申请人： Wenxu Xianyu , Young-soo Park , Hans S. Cho , Huaxiang Yin , Hyuck Lim
发明人： Wenxu Xianyu , Young-soo Park , Hans S. Cho , Huaxiang Yin , Hyuck Lim
IPC分类号： C30B13/06 , B32B9/00
CPC分类号： C30B29/06 , C30B13/24 , C30B25/02 , C30B29/60 , H01L21/02381 , H01L21/02488 , H01L21/02532 , H01L21/02664 , H01L21/02675 , H01L29/42392 , H01L29/78696 , Y10T428/2962
摘要： A method of fabricating a single crystal silicon rod may include forming an insulation layer on a substrate, forming a hole in the insulation layer, selectively growing silicon in the hole, forming a silicon layer on the hole and on the insulation layer, forming a rod pattern on the silicon layer in a direction that is non-radial with respect to the hole, and melting the silicon layer and crystallizing the silicon layer by illuminating a laser beam on the silicon layer where the rod pattern is formed to generate a nucleation site at a position corresponding to the hole. According to the method, a single crystal silicon rod having no defects may be formed.
摘要翻译：制造单晶硅棒的方法可以包括在衬底上形成绝缘层，在绝缘层中形成孔，选择性地生长孔中的硅，在孔和绝缘层上形成硅层，形成棒在相对于孔的非径向的方向上在硅层上形成图案，并且通过照射形成棒图案的硅层上的激光束来熔化硅层并使硅层结晶，从而在硅层上产生成核位置对应于孔的位置。根据该方法，可以形成没有缺陷的单晶硅棒。

5. 发明申请

US20060292313A1 Methods of forming a more highly-oriented silicon layer and substrate having the same 有权
标题翻译：形成更高取向硅层的方法和具有该硅层的基板的方法
公开(公告)号：US20060292313A1
公开(公告)日：2006-12-28
申请号：US11473067
申请日：2006-06-23
申请人： Wenxu Xianyu , Hans Cho , Takashi Noguchi , Young-Soo Park , Xiaoxin Zhang , Huaxiang Yin , Hyuck Lim , Kyung-Bae Park , Suk-Pil Kim
发明人： Wenxu Xianyu , Hans Cho , Takashi Noguchi , Young-Soo Park , Xiaoxin Zhang , Huaxiang Yin , Hyuck Lim , Kyung-Bae Park , Suk-Pil Kim
IPC分类号： C09K19/00
CPC分类号： C30B29/06 , Y10T428/10
摘要： Provided are methods of forming a more highly-oriented silicon thin layer having a larger grain size, and a substrate having the same. The methods may include forming an aluminum (Al) layer on a base substrate, forming a more highly-oriented Al layer by recrystallizing the Al layer under vacuum, forming a more highly-oriented γ-Al2O3 layer on the more highly-oriented Al layer and/or epitaxially growing a silicon layer on the more highly-oriented γ-Al2O3 layer. The method may be used to manufacture a semiconductor device having higher carrier mobility.
摘要翻译：提供了形成具有较大晶粒尺寸的更高取向硅薄层的方法以及具有其的基板。所述方法可以包括在基底基板上形成铝（Al）层，通过在真空下重结晶Al层，形成更高取向的Al层，形成更高取向的γ-Al 2 O 在更高取向的Al层上和/或在更高取向的γ-Al 2 O 3上外延生长硅层3层 >层。该方法可用于制造具有较高载流子迁移率的半导体器件。

6. 发明授权

US08508009B2 Microlens and an image sensor including a microlens 失效
标题翻译：微透镜和包括微透镜的图像传感器
公开(公告)号：US08508009B2
公开(公告)日：2013-08-13
申请号：US12662607
申请日：2010-04-26
申请人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
发明人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
IPC分类号： H01L31/062 , H01L27/146 , H01L31/107
CPC分类号： H01L27/14627 , H01L27/14621 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/02327
摘要： A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.
摘要翻译：提供微透镜，包括微透镜的图像传感器，形成微透镜的方法和制造图像传感器的方法。微透镜包括形成在基板上的具有圆柱形状的多晶硅图案和包围多晶硅图案的圆形外壳部分。微透镜还可以包括填充壳体部分的内部的填充材料或覆盖第一壳体部分的第二壳体部分。形成微透镜的方法包括在具有较低结构的半导体衬底上形成硅图案，在硅图案上的半导体衬底上形成覆盖膜，使硅图案和覆盖膜退火，将硅图案改变为具有圆筒形，并且封盖膜用于圆形微透镜的外壳部分，并且通过半导体基板和外壳部分的边缘之间的开口用透镜材料填充外壳部分的内部。图像传感器包括通过类似方法形成的微透镜和具有圆柱形状的光电二极管。

7. 发明授权

US08187905B2 Method of forming a microlens and a method for manufacturing an image sensor 失效
标题翻译：形成微透镜的方法和图像传感器的制造方法
公开(公告)号：US08187905B2
公开(公告)日：2012-05-29
申请号：US12805821
申请日：2010-08-20
申请人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
发明人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
IPC分类号： H01L31/062 , H01L31/107
CPC分类号： H01L27/14627 , H01L27/14621 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/02327
摘要： A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.
摘要翻译：提供微透镜，包括微透镜的图像传感器，形成微透镜的方法和制造图像传感器的方法。微透镜包括形成在基板上的具有圆柱形状的多晶硅图案和包围多晶硅图案的圆形外壳部分。微透镜还可以包括填充壳体部分的内部的填充材料或覆盖第一壳体部分的第二壳体部分。形成微透镜的方法包括在具有较低结构的半导体衬底上形成硅图案，在硅图案上的半导体衬底上形成覆盖膜，使硅图案和覆盖膜退火，将硅图案改变为具有圆筒形，并且封盖膜用于圆形微透镜的外壳部分，并且通过半导体基板和外壳部分的边缘之间的开口用透镜材料填充外壳部分的内部。图像传感器包括通过类似方法形成的微透镜和具有圆柱形状的光电二极管。

8. 发明申请

US20110008920A1 Microlens, an image sensor including a microlens, method of forming a microlens and method for manufacturing an image sensor 失效
标题翻译：微透镜，包括微透镜的图像传感器，形成微透镜的方法和用于制造图像传感器的方法
公开(公告)号：US20110008920A1
公开(公告)日：2011-01-13
申请号：US12805821
申请日：2010-08-20
申请人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
发明人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
IPC分类号： H01L33/00 , H01L31/18
CPC分类号： H01L27/14627 , H01L27/14621 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/02327
摘要： A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.
摘要翻译：提供微透镜，包括微透镜的图像传感器，形成微透镜的方法和制造图像传感器的方法。微透镜包括形成在基板上的具有圆柱形状的多晶硅图案和包围多晶硅图案的圆形外壳部分。微透镜还可以包括填充壳体部分的内部的填充材料或覆盖第一壳体部分的第二壳体部分。形成微透镜的方法包括在具有较低结构的半导体衬底上形成硅图案，在硅图案上的半导体衬底上形成覆盖膜，使硅图案和覆盖膜退火，将硅图案改变为具有圆筒形，并且封盖膜用于圆形微透镜的外壳部分，并且通过半导体基板和外壳部分的边缘之间的开口用透镜材料填充外壳部分的内部。图像传感器包括通过类似方法形成的微透镜和具有圆柱形状的光电二极管。

9. 发明申请

US20100208368A1 Microlens, an image sensor including a microlens, method of forming a microlens and method for manufacturing an image sensor 失效
标题翻译：微透镜，包括微透镜的图像传感器，形成微透镜的方法和用于制造图像传感器的方法
公开(公告)号：US20100208368A1
公开(公告)日：2010-08-19
申请号：US12662607
申请日：2010-04-26
申请人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
发明人： Huaxiang Yin , Hyuck Lim , Young-soo Park , Wenxu Xianyu , Hans S. Cho
IPC分类号： G02B7/02
CPC分类号： H01L27/14627 , H01L27/14621 , H01L27/14632 , H01L27/14685 , H01L27/14687 , H01L31/02327
摘要： A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.
摘要翻译：提供微透镜，包括微透镜的图像传感器，形成微透镜的方法和制造图像传感器的方法。微透镜包括形成在基板上的具有圆柱形状的多晶硅图案和包围多晶硅图案的圆形外壳部分。微透镜还可以包括填充壳体部分的内部的填充材料或覆盖第一壳体部分的第二壳体部分。形成微透镜的方法包括在具有较低结构的半导体衬底上形成硅图案，在硅图案上的半导体衬底上形成覆盖膜，使硅图案和覆盖膜退火，将硅图案改变为具有圆筒形，并且封盖膜用于圆形微透镜的外壳部分，并且通过半导体基板和外壳部分的边缘之间的开口用透镜材料填充外壳部分的内部。图像传感器包括通过类似方法形成的微透镜和具有圆柱形状的光电二极管。

10. 发明授权

US08445332B2 Single crystal silicon rod fabrication methods and a single crystal silicon rod structure 有权
标题翻译：单晶硅棒制造方法和单晶硅棒结构
公开(公告)号：US08445332B2
公开(公告)日：2013-05-21
申请号：US11976009
申请日：2007-10-19
申请人： Wenxu Xianyu , Young-soo Park , Hans S. Cho , Huaxiang Yin , Hyuck Lim
发明人： Wenxu Xianyu , Young-soo Park , Hans S. Cho , Huaxiang Yin , Hyuck Lim
IPC分类号： H01L21/00 , H01L21/84
CPC分类号： C30B29/06 , C30B13/24 , C30B25/02 , C30B29/60 , H01L21/02381 , H01L21/02488 , H01L21/02532 , H01L21/02664 , H01L21/02675 , H01L29/42392 , H01L29/78696 , Y10T428/2962
摘要： A method of fabricating a single crystal silicon rod may include forming an insulation layer on a substrate, forming a hole in the insulation layer, selectively growing silicon in the hole, forming a silicon layer on the hole and on the insulation layer, forming a rod pattern on the silicon layer in a direction that is non-radial with respect to the hole, and melting the silicon layer and crystallizing the silicon layer by illuminating a laser beam on the silicon layer where the rod pattern is formed to generate a nucleation site at a position corresponding to the hole. According to the method, a single crystal silicon rod having no defects may be formed.
摘要翻译：制造单晶硅棒的方法可以包括在衬底上形成绝缘层，在绝缘层中形成孔，选择性地生长孔中的硅，在孔和绝缘层上形成硅层，形成棒在相对于孔的非径向的方向上在硅层上形成图案，并且通过照射形成棒图案的硅层上的激光束来熔化硅层并使硅层结晶，从而在硅层上产生成核位置对应于孔的位置。根据该方法，可以形成没有缺陷的单晶硅棒。

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