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    • 5. 发明授权
    • Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
    • 具有挠性铰链隔膜的冷凝器麦克风及其制造方法
    • US08422702B2
    • 2013-04-16
    • US11875996
    • 2007-10-22
    • Hye Jin KimSung Q LeeKang Ho ParkJong Dae Kim
    • Hye Jin KimSung Q LeeKang Ho ParkJong Dae Kim
    • H04R25/00
    • H04R31/003H04R19/005H04R31/00H04R2499/11
    • A micromini condenser microphone having a flexure hinge-shaped upper diaphragm and a back plate, and a method of manufacturing the same are provided.The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer to be used as a back plate on the first insulating layer; forming a plurality of sound holes by patterning the upper silicon layer; forming a second insulating layer on the upper silicon layer; forming a conductive layer on the upper silicon layer having the sound holes, and forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming a plurality of air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the sacrificial layer, the passivation layer, the conductive layer, the upper silicon layer, the first insulating layer and the lower silicon layer to form an air gap between the diaphragm and the upper silicon layer.Consequently, due to the flexible diaphragm, a manufacturing process using semiconductor MEMS technology may improve the sensitivity of the condenser microphone and reduce the size of the condenser microphone, thereby enabling integration into a portable terminal.
    • 提供具有弯曲铰链形上隔膜和背板的微型电容麦克风及其制造方法。 该方法包括以下步骤:形成下硅层和第一绝缘层; 在所述第一绝缘层上形成用作背板的上硅层; 通过图案化上硅层形成多个声孔; 在所述上硅层上形成第二绝缘层; 在具有所述声孔的所述上硅层上形成导电层,并在所述导电层上形成钝化层; 在钝化层上形成牺牲层; 在所述牺牲层上沉积隔膜,以及形成通过所述隔膜的多个空气孔; 在所述钝化层上形成电极焊盘和所述隔膜的区域; 蚀刻牺牲层,钝化层,导电层,上硅层,第一绝缘层和下硅层,以在隔膜和上硅层之间形成气隙。 因此,由于柔性隔膜,使用半导体MEMS技术的制造工艺可以提高电容式麦克风的灵敏度并减小电容式麦克风的尺寸,从而可以集成到便携式终端中。
    • 8. 发明申请
    • CONDENSER MICROPHONE HAVING FLEXURE HINGE DIAPHRAGM AND METHOD OF MANUFACTURING THE SAME
    • 具有挠性铰链膜片的冷凝器麦克风及其制造方法
    • US20080137884A1
    • 2008-06-12
    • US11875996
    • 2007-10-22
    • Hye Jin KIMSung Q. LeeKang Ho ParkJong Dae Kim
    • Hye Jin KIMSung Q. LeeKang Ho ParkJong Dae Kim
    • H04R25/00H01L21/64
    • H04R31/003H04R19/005H04R31/00H04R2499/11
    • A micromini condenser microphone having a flexure hinge-shaped upper diaphragm and a back plate, and a method of manufacturing the same are provided.The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer to be used as a back plate on the first insulating layer; forming a plurality of sound holes by patterning the upper silicon layer; forming a second insulating layer on the upper silicon layer; forming a conductive layer on the upper silicon layer having the sound holes, and forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming a plurality of air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the sacrificial layer, the passivation layer, the conductive layer, the upper silicon layer, the first insulating layer and the lower silicon layer to form an air gap between the diaphragm and the upper silicon layer.Consequently, due to the flexible diaphragm, a manufacturing process using semiconductor MEMS technology may improve the sensitivity of the condenser microphone and reduce the size of the condenser microphone, thereby enabling integration into a portable terminal.
    • 提供具有弯曲铰链形上隔膜和背板的微型电容麦克风及其制造方法。 该方法包括以下步骤:形成下硅层和第一绝缘层; 在所述第一绝缘层上形成用作背板的上硅层; 通过图案化上硅层形成多个声孔; 在所述上硅层上形成第二绝缘层; 在具有所述声孔的所述上硅层上形成导电层,并在所述导电层上形成钝化层; 在钝化层上形成牺牲层; 在所述牺牲层上沉积隔膜,以及形成通过所述隔膜的多个空气孔; 在所述钝化层上形成电极焊盘和所述隔膜的区域; 蚀刻牺牲层,钝化层,导电层,上硅层,第一绝缘层和下硅层,以在隔膜和上硅层之间形成气隙。 因此,由于柔性隔膜,使用半导体MEMS技术的制造工艺可以提高电容式麦克风的灵敏度并减小电容式麦克风的尺寸,从而可以集成到便携式终端中。