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    • 4. 发明授权
    • Method for increasing polysilicon grain size
    • 增加多晶硅粒度的方法
    • US07446056B2
    • 2008-11-04
    • US11293709
    • 2005-12-01
    • Yao-Hui HuangTung-Li LeeChih-Hao LinYen-Fei LinJames SunChen Pu-FangDavid Huang
    • Yao-Hui HuangTung-Li LeeChih-Hao LinYen-Fei LinJames SunChen Pu-FangDavid Huang
    • H01L21/44H01L21/31H01L21/469
    • C23C16/0218C23C16/24H01L21/28525
    • The present invention relates to a method for increasing the grain size of a polysilicon layer, which includes exposing a silicon oxide wafer in a deposition chamber to an amount, effective for the purpose, of nitrogen at a flow rate of at least about 240 standard liters per minute (slm). The instant invention further relates to a method for inhibiting the formation of a polysilicon seed in a furnace, which includes the treatment as noted above. The invention also relates to a method for forming a polysilicon layer, including: forming a silicon oxide layer on a substrate, the silicon oxide layer having a plurality of oxygen molecules therein; exposing the silicon oxide layer to a predetermined amount of nitrogen-containing gas in a furnace, whereby a plurality of nitrogen molecules in the nitrogen-containing gas replaces at least part of the oxygen molecules in the silicon oxide layer; and forming a polysilicon layer on the silicon oxide layer.
    • 本发明涉及一种用于增加多晶硅层的晶粒尺寸的方法,该方法包括将沉积室中的氧化硅晶片暴露于至少约240标准升的流速下的氮的有效量 每分钟(slm)。 本发明还涉及一种用于抑制在炉中形成多晶硅种子的方法,其包括如上所述的处理。 本发明还涉及一种用于形成多晶硅层的方法,包括:在衬底上形成氧化硅层,所述氧化硅层中具有多个氧分子; 在炉中将氧化硅层暴露于预定量的含氮气体,由此在含氮气体中的多个氮分子取代氧化硅层中的至少一部分氧分子; 以及在所述氧化硅层上形成多晶硅层。
    • 5. 发明申请
    • Method for increasing polysilicon grain size
    • 增加多晶硅粒度的方法
    • US20060134926A1
    • 2006-06-22
    • US11293709
    • 2005-12-01
    • Yao-Hui HuangTung-Li LeeChih-Hao LinYen-Fei LinJames SunChen Pu-FangDavid Huang
    • Yao-Hui HuangTung-Li LeeChih-Hao LinYen-Fei LinJames SunChen Pu-FangDavid Huang
    • H01L21/31
    • C23C16/0218C23C16/24H01L21/28525
    • The present invention relates to a method for increasing the grain size of a polysilicon layer, which includes exposing a silicon oxide wafer in a deposition chamber to an amount, effective for the purpose, of nitrogen at a flow rate of at least about 240 standard liters per minute (slm). The instant invention further relates to a method for inhibiting the formation of a polysilicon seed in a furnace, which includes the treatment as noted above. The invention also relates to a method for forming a polysilicon layer, including: forming a silicon oxide layer on a substrate, the silicon oxide layer having a plurality of oxygen molecules therein; exposing the silicon oxide layer to a predetermined amount of nitrogen-containing gas in a furnace, whereby a plurality of nitrogen molecules in the nitrogen-containing gas replaces at least part of the oxygen molecules in the silicon oxide layer; and forming a polysilicon layer on the silicon oxide layer.
    • 本发明涉及一种用于增加多晶硅层的晶粒尺寸的方法,该方法包括将沉积室中的氧化硅晶片暴露于至少约240标准升的流速下的氮的有效量 每分钟(slm)。 本发明还涉及一种用于抑制在炉中形成多晶硅种子的方法,其包括如上所述的处理。 本发明还涉及一种用于形成多晶硅层的方法,包括:在衬底上形成氧化硅层,所述氧化硅层中具有多个氧分子; 在炉中将氧化硅层暴露于预定量的含氮气体,由此在含氮气体中的多个氮分子取代氧化硅层中的至少一部分氧分子; 以及在所述氧化硅层上形成多晶硅层。