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1. 发明授权

US06396784B1 Audio compact disc title with a relatively high density format 有权
标题翻译：具有较高密度格式的音频光盘标题
公开(公告)号：US06396784B1
公开(公告)日：2002-05-28
申请号：US09292898
申请日：1999-04-16
申请人： Hung-Min Wang , Chung-Ying Chen , Wen-Hsin Wang
发明人： Hung-Min Wang , Chung-Ying Chen , Wen-Hsin Wang
IPC分类号： G11B390
CPC分类号： G11B27/329 , G11B7/007 , G11B27/105 , G11B27/3027 , G11B2220/2545 , G11B2220/2562
摘要： An audio compact disc title with a high density format adapted to be used in a compact disc player is disclosed. The audio compact disc title includes a plurality of tracks, each of the tracks has a plurality of audio sectors for storing audio data, wherein the audio data are divided into a plurality of audio signals alternately stored in the audio sectors, and a compact disc identifying code for representing the relatively high density format of the audio compact disc title for the compact disc player. A method for recording audio data in an audio compact disc title with a high density format is also disclosed. The method includes steps of dividing the audio data into a plurality of audio signals, rearranging the plurality of audio signals to space any two continuous audio signals by other audio signals, and recording the rearranged audio signals in the audio compact disc title.
摘要翻译：公开了一种具有适用于光盘播放器中的高密度格式的音频光盘标题。音频光盘标题包括多个轨道，每个轨道具有用于存储音频数据的多个音频扇区，其中音频数据被划分为交替存储在音频扇区中的多个音频信号，以及光盘识别用于表示光盘播放器的音频光盘标题的相对高密度格式的代码。还公开了一种在高密度格式的音频光盘标题中记录音频数据的方法。该方法包括以下步骤：将音频数据划分成多个音频信号，重新布置多个音频信号以通过其它音频信号来放置任何两个连续的音频信号，并将重新排列的音频信号记录在音频光盘标题中。

2. 发明授权

US08168902B2 Electrical device with a waterproof keypad 有权
标题翻译：电气设备带防水键盘
公开(公告)号：US08168902B2
公开(公告)日：2012-05-01
申请号：US12350569
申请日：2009-01-08
申请人： Wen-Lang Tang , Wen-Hsin Wang
发明人： Wen-Lang Tang , Wen-Hsin Wang
IPC分类号： H01H9/04
CPC分类号： H01H13/86 , H01H2209/002 , H01H2209/01 , H01H2209/012 , H01H2223/002 , H01H2223/003 , H01H2229/046 , H01H2229/048 , H01H2233/03
摘要： An electrical device includes a housing, a circuit unit disposed in the housing, a waterproof keypad disposed in the housing at a position above the circuit unit, and a press member. The waterproof keypad includes a rigid layer, a resilient pad body, a waterproofing ring, and a plurality of keys. The press member is connected to the housing and presses against the rigid layer. The waterproofing ring is connected to a bottom face of the resilient pad body, abuts against the housing, and surrounds the circuit unit. A portion of a top face of the resilient pad body is connected immovably to a bottom face of the rigid layer. Another portion of the top face of the resilient pad body is exposed from the rigid layer. The keys are connected to the exposed portion of the top face of the resilient pad body and are exposed from the rigid layer.
摘要翻译：电气设备包括壳体，设置在壳体中的电路单元，设置在壳体中的电路单元上方的防水键盘和按压构件。防水键盘包括刚性层，弹性垫体，防水环和多个键。压力构件连接到壳体并压靠刚性层。防水环连接到弹性垫体的底面，与壳体抵接并围绕电路单元。弹性垫体的顶面的一部分不可移动地连接到刚性层的底面。弹性垫体的顶面的另一部分从刚性层露出。键连接到弹性垫体的顶面的暴露部分并且暴露于刚性层。

3. 发明授权

US08138434B2 Waterproof press key and assembly of an electronic device housing and the waterproof press key 有权
标题翻译：防水按键和电子装置外壳的组装和防水按键
公开(公告)号：US08138434B2
公开(公告)日：2012-03-20
申请号：US12456413
申请日：2009-06-16
申请人： Wen-Lang Tang , Wen-Hsin Wang
发明人： Wen-Lang Tang , Wen-Hsin Wang
IPC分类号： H01H13/06
CPC分类号： H01H13/06
摘要： A waterproof press key includes a key body, a rigid support component, and a waterproofing ring. The key body is made of a resilient material, and includes a top wall and a surrounding wall extending downwardly from the top wall. The rigid support component includes a supporting portion that is disposed at the surrounding wall. The waterproofing ring projects from the outer wall surface of the surrounding wall. The supporting portion overlaps with at least a part of a height section of the surrounding wall from which the waterproofing ring projects to thereby enhance the waterproofing effect of the waterproof press key.
摘要翻译：防水按键包括键体，刚性支撑部件和防水环。钥匙主体由弹性材料制成，并包括从顶壁向下延伸的顶壁和周围壁。刚性支撑部件包括设置在周围壁上的支撑部分。防水环从周壁的外壁表面突出。支撑部分与防水环突出的周围壁的高度部分的至少一部分重叠，从而增强防水按键的防水效果。

4. 发明申请

US20100059347A1 ELECTRICAL DEVICE WITH A WATERPROOF KEYPAD 有权
标题翻译：带防水键盘的电气设备
公开(公告)号：US20100059347A1
公开(公告)日：2010-03-11
申请号：US12350569
申请日：2009-01-08
申请人： Wen-Lang TANG , Wen-Hsin Wang
发明人： Wen-Lang TANG , Wen-Hsin Wang
IPC分类号： H01H9/04
CPC分类号： H01H13/86 , H01H2209/002 , H01H2209/01 , H01H2209/012 , H01H2223/002 , H01H2223/003 , H01H2229/046 , H01H2229/048 , H01H2233/03
摘要： An electrical device includes a housing, a circuit unit disposed in the housing, a waterproof keypad disposed in the housing at a position above the circuit unit, and a press member. The waterproof keypad includes a rigid layer, a resilient pad body, a waterproofing ring, and a plurality of keys. The press member is connected to the housing and presses against the rigid layer. The waterproofing ring is connected to a bottom face of the resilient pad body, abuts against the housing, and surrounds the circuit unit. A portion of a top face of the resilient pad body is connected immovably to a bottom face of the rigid layer. Another portion of the top face of the resilient pad body is exposed from the rigid layer. The keys are connected to the exposed portion of the top face of the resilient pad body and are exposed from the rigid layer.
摘要翻译：电气设备包括壳体，设置在壳体中的电路单元，设置在壳体中的电路单元上方的防水键盘和按压构件。防水键盘包括刚性层，弹性垫体，防水环和多个键。压力构件连接到壳体并压靠刚性层。防水环连接到弹性垫体的底面，与壳体抵接并围绕电路单元。弹性垫体的顶面的一部分不可移动地连接到刚性层的底面。弹性垫体的顶面的另一部分从刚性层露出。键连接到弹性垫体的顶面的暴露部分并且暴露于刚性层。

5. 发明申请

US20060060958A1 Semiconductor package, and fabrication method and carrier thereof 审中-公开
标题翻译：半导体封装及其制造方法及其载体
公开(公告)号：US20060060958A1
公开(公告)日：2006-03-23
申请号：US11222386
申请日：2005-09-07
申请人： Chien-Te Chen , Wen-Hsin Wang
发明人： Chien-Te Chen , Wen-Hsin Wang
IPC分类号： H01L23/48
CPC分类号： H05K1/114 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01079 , H01L2924/181 , H05K1/113 , H05K3/3452 , H05K2201/0959 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package, and a fabrication method and a carrier thereof are provided. The fabrication method includes: preparing a core layer having a first surface and an opposed second surface, wherein the first and second surfaces are electrically connected to each other by a plurality of conductive vias; forming a plurality of bond pads on the second surface, wherein the bond pads are electrically connected to the conductive vias, and each of the conductive vias is partly located within a boundary of a corresponding one of the bond pads and is partly located out of the boundary of the corresponding bond pad, such that the carrier is fabricated; mounting and electrically connecting a chip to the first surface; forming an encapsulant on the first surface to encapsulate the chip; and forming solder joints on the bond pads of the second surface. By this arrangement, a popcorn effect is avoided.
摘要翻译：提供半导体封装及其制造方法和载体。制造方法包括：制备具有第一表面和相对的第二表面的芯层，其中第一表面和第二表面通过多个导电通孔彼此电连接; 在所述第二表面上形成多个接合焊盘，其中所述接合焊盘电连接到所述导电通孔，并且每个所述导电通孔部分地位于所述接合焊盘的对应的一个接合焊盘的边界内，并且部分地位于边界，使得制造载体; 将芯片安装并电连接到第一表面; 在所述第一表面上形成密封剂以封装所述芯片; 以及在第二表面的接合焊盘上形成焊点。通过这种安排，可以避免爆米花效应。

6. 发明授权

US06465891B2 Integrated-circuit package with a quick-to-count finger layout design on substrate 有权
标题翻译：集成电路封装，在基板上具有快速计数的手指布局设计
公开(公告)号：US06465891B2
公开(公告)日：2002-10-15
申请号：US09766476
申请日：2001-01-19
申请人： Wen-Hsin Wang , Chih-Chin Liao
发明人： Wen-Hsin Wang , Chih-Chin Liao
IPC分类号： H01L2348
CPC分类号： H01L24/49 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/05554 , H01L2224/45144 , H01L2224/48237 , H01L2224/49171 , H01L2924/01005 , H01L2924/01006 , H01L2924/01079 , H01L2924/14 , H01L2924/00014
摘要： An integrated-circuit package with a quick-to-count finger layout design on substrate is proposed, which can help fabrication engineers to visually check the total number of fingers on the substrate in a quick and accurate manner. The proposed integrated-circuit package is characterized by the provision of a line-up array of fingers which includes a plurality of first-shape fingers partitioned equally in number into a plurality of subgroups; and a plurality of second-shape fingers, which are substantially visually distinguishable in outer appearance from the first-shape fingers, and which are interposed between adjacent subgroups of the first-shape fingers to serve as count tokens. This finger layout design allows the fabrication engineers to visually check the total number of the line-up array of fingers on the substrate simply by counting through the second-shape fingers that serve as count tokens and then multiply the result by the number of first-shape fingers in each subgroup plus one.
摘要翻译：提出了一种在基板上具有快速计数手指布局设计的集成电路封装，可以帮助制造工程师以快速准确的方式目视检查基板上的手指总数。所提出的集成电路封装的特征在于提供一个阵列阵列的指状阵列，其包括多个分成多个子组的数个等分的第一形状的指状物; 以及多个第二形状的手指，其在外观上与第一形状指状件基本上在视觉上可区分，并且被插入在第一形状指状物的相邻子组之间用作计数令牌。这种手指布局设计允许制造工程师通过仅通过用作计数令牌的第二形手指计数，然后将结果乘以第一形状的数量，目视地检查基板上的指状阵列的总数，每个子组中的形状手指加一个。

7. 发明申请

US20120223919A1 TOUCH PEN 审中-公开
标题翻译：触摸笔
公开(公告)号：US20120223919A1
公开(公告)日：2012-09-06
申请号：US13410008
申请日：2012-03-01
申请人： Ming-Chuan LIN , Wen-Hung Wang , Chih-Chiang Lin , Shyh-Jeng Chen , Jer-Yann Huang , Wen-Hsin Wang
发明人： Ming-Chuan LIN , Wen-Hung Wang , Chih-Chiang Lin , Shyh-Jeng Chen , Jer-Yann Huang , Wen-Hsin Wang
IPC分类号： G06F3/033
CPC分类号： G06F3/044 , G06F3/03545
摘要： A touch pen includes a power supply circuit, a signal-receiving electrode, an inverted amplifying circuit and a signal-emitting electrode. The power supply circuit provides the touch pen with a working voltage, and the signal-receiving electrode receives at least one surface signal of a touch-sensing structure of a capacitive touch-sensitive device. The inverted amplifying circuit reversely amplifies the surface signal to generate a reversely amplified signal, and the signal-emitting electrode emits the reversely amplified signal to attenuate a detection signal of the capacitive touch-sensitive device in a position coinciding with a touch point of the touch pen.
摘要翻译：触摸笔包括电源电路，信号接收电极，反相放大电路和信号发射电极。电源电路为触摸笔提供工作电压，并且信号接收电极接收电容式触敏装置的触摸感测结构的至少一个表面信号。反相放大电路反向放大表面信号以产生反向放大的信号，并且发射电极发射反向放大的信号，以便在与触摸的触摸点重合的位置中衰减电容式触敏装置的检测信号钢笔。

8. 发明申请

US20100044198A1 Waterproof press key and assembly of an electronic device housing and the waterproof press key 有权
标题翻译：防水按键和电子装置外壳的组装和防水按键
公开(公告)号：US20100044198A1
公开(公告)日：2010-02-25
申请号：US12456413
申请日：2009-06-16
申请人： Wen-Lang Tang , Wen-Hsin Wang
发明人： Wen-Lang Tang , Wen-Hsin Wang
IPC分类号： H01H13/06
CPC分类号： H01H13/06
摘要： A waterproof press key includes a key body, a rigid support component, and a waterproofing ring. The key body is made of a resilient material, and includes a top wall and a surrounding wall extending downwardly from the top wall. The rigid support component includes a supporting portion that is disposed at the surrounding wall. The waterproofing ring projects from the outer wall surface of the surrounding wall. The supporting portion overlaps with at least a part of a height section of the surrounding wall from which the waterproofing ring projects to thereby enhance the waterproofing effect of the waterproof press key.
摘要翻译：防水按键包括键体，刚性支撑部件和防水环。钥匙主体由弹性材料制成，并包括从顶壁向下延伸的顶壁和周围壁。刚性支撑部件包括设置在周围壁上的支撑部分。防水环从周壁的外壁表面突出。支撑部分与防水环突出的周围壁的高度部分的至少一部分重叠，从而增强防水按键的防水效果。

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