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1. 发明授权

US08664687B2 Nitride semiconductor light-emitting device and process for producing the same 失效
标题翻译：氮化物半导体发光器件及其制造方法
公开(公告)号：US08664687B2
公开(公告)日：2014-03-04
申请号：US10898204
申请日：2004-07-26
申请人： Dong Hyun Cho , Masayoshi Koike , Yuiji Imai , Min Ho Kim , Bang Won Oh , Hun Joo Hahm
发明人： Dong Hyun Cho , Masayoshi Koike , Yuiji Imai , Min Ho Kim , Bang Won Oh , Hun Joo Hahm
IPC分类号： H01L33/00
CPC分类号： H01L33/0075 , H01L21/02389 , H01L21/02458 , H01L21/0254 , H01L21/02639 , H01L21/02647
摘要： Provided are a nitride semiconductor light-emitting device comprising a polycrystalline or amorphous substrate made of AlN; a plurality of dielectric patterns formed on the AlN substrate and having a stripe or lattice structure; a lateral epitaxially overgrown-nitride semiconductor layer formed on the AlN substrate having the dielectric patterns by Lateral Epitaxial Overgrowth; a first conductive nitride semiconductor layer formed on the nitride semiconductor layer; an active layer formed on the first conductive nitride semiconductor layer; and a second conductive nitride semiconductor layer formed on the active layer; and a process for producing the same.
摘要翻译：提供一种氮化物半导体发光器件，其包括由AlN制成的多晶或非晶衬底; 形成在所述AlN基板上并具有条纹或格子结构的多个电介质图案; 通过横向外延生长形成在具有电介质图案的AlN衬底上的侧向外延氮化半导体层; 形成在所述氮化物半导体层上的第一导电氮化物半导体层; 形成在所述第一导电氮化物半导体层上的有源层; 以及形成在所述有源层上的第二导电氮化物半导体层; 及其制造方法。

2. 发明授权

US07964885B2 White light emitting device and white light source module using the same 有权
公开(公告)号：US07964885B2
公开(公告)日：2011-06-21
申请号：US11987830
申请日：2007-12-05
申请人： Chul Hee Yoo , Young June Jeong , Young Sam Park , Seong Yeon Han , Ho Yeon Kim , Hun Joo Hahm , Hyung Suk Kim
发明人： Chul Hee Yoo , Young June Jeong , Young Sam Park , Seong Yeon Han , Ho Yeon Kim , Hun Joo Hahm , Hyung Suk Kim
IPC分类号： H01L33/00
CPC分类号： H05B33/12 , C09K11/0883 , C09K11/7731 , C09K11/7734 , F21K9/00 , G02F1/133603 , G02F1/133609 , H01L33/504 , Y02B20/181
摘要： A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

3. 发明申请

US20110127558A1 LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20110127558A1
公开(公告)日：2011-06-02
申请号：US12944401
申请日：2010-11-11
申请人： Young Sam PARK , Hun Joo Hahm
发明人： Young Sam PARK , Hun Joo Hahm
IPC分类号： H01L33/58 , H01L33/48
CPC分类号： H01L33/54 , H01L24/97 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.
摘要翻译：提供一种发光二极管封装及其制造方法。根据本发明的一个方面的发光二极管封装可以包括：LED芯片; 具有安装在其上的LED芯片的主体部分; 一对反射部件，其从身体部分延伸到彼此面对，同时插入LED芯片，并且反射从LED芯片发射的光; 以及设置在所述一对反射部件之间的模制部件，以封装所述LED芯片并具有其中心区域向内弯曲的顶表面。

4. 发明授权

US07914194B2 Backlight unit having light emititng diodes and method of manufacturing the same 有权
标题翻译：具有发光二极管的背光单元及其制造方法
公开(公告)号：US07914194B2
公开(公告)日：2011-03-29
申请号：US12071836
申请日：2008-02-27
申请人： Jung Kyu Park , Hun Joo Hahm , Chul Hee Yoo , Young June Jeong , Young Sam Park , Seong Yeon Han
发明人： Jung Kyu Park , Hun Joo Hahm , Chul Hee Yoo , Young June Jeong , Young Sam Park , Seong Yeon Han
IPC分类号： F21V7/04
CPC分类号： H05K1/053 , G02F1/133603 , G02F2001/133612 , H05K1/092 , H05K3/1216 , H05K3/125 , H05K2201/10106 , H05K2203/013
摘要： There is provided a backlight unit including: a chassis having an insulating layer formed on a top thereof; a circuit pattern formed on the insulating layer; a plurality of light emitting diodes formed on the insulating layer to electrically connect to the circuit pattern.
摘要翻译：提供了一种背光单元，包括：具有形成在其顶部上的绝缘层的底架; 形成在绝缘层上的电路图案; 多个发光二极管形成在绝缘层上以电连接到电路图案。

5. 发明授权

US07894017B2 Plane light source and LCD backlight unit having the same 有权
标题翻译：平面光源和具有相同的LCD背光单元
公开(公告)号：US07894017B2
公开(公告)日：2011-02-22
申请号：US12199327
申请日：2008-08-27
申请人： Seong Yeon Han , Hun Joo Hahm , Hyung Suk Kim , Young June Jeong , Young Sam Park , Chul Hee Yoo
发明人： Seong Yeon Han , Hun Joo Hahm , Hyung Suk Kim , Young June Jeong , Young Sam Park , Chul Hee Yoo
IPC分类号： G02F1/1335
CPC分类号： G02F1/133603
摘要： There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm≦P1≦29 mm, and a pitch P2 between the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm≦P2≦38 mm.
摘要翻译：提供有平面光源和具有该平面光源的LCD背光单元。根据本发明的一个方面的包括发光器件矩阵的平面光源包括：具有排列成行和列的多个发光器件的发光器件矩阵，包括：具有排列成行和列的多个发光器件的第一矩阵; 以及具有排列成行和列的多个发光器件的第二矩阵，所述发光器件各自位于由包括在所述第一矩阵中的四个相邻的发光器件形成的矩形内，并且形成角度和所述角度; 在水平方向的基础上满足45°＆amp; nlE;＆hell; n; 55°的条件，其中在包括在发光器件矩阵中的一个发光器件和与发光器件相邻的另一个照明发光器件之间的间距中发光器件与发光器件对角地对应的发光器件之间的间距P1满足条件为25mm＆lt; L1; P1＆nlE; 29mm，并且发光器件和位于发光器件中的另一个发光器件之间的间距P2 水平方向满足34 mm＆nlE; P2＆nlE; 38 mm的条件。

6. 外观设计

USD599750S1 Case for light emitting diode 有权
标题翻译：发光二极管的情况
公开(公告)号：USD599750S1
公开(公告)日：2009-09-08
申请号：US29325554
申请日：2008-10-02
申请人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han
设计人： Dae Hyun Kim , Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim , Young Sam Park , Do Hun Kim , Seong Yeon Han

7. 发明申请

US20090135332A1 Backlight unit and liquid crystal display device having the same 有权
标题翻译：背光单元和具有该背光单元的液晶显示装置
公开(公告)号：US20090135332A1
公开(公告)日：2009-05-28
申请号：US12073386
申请日：2008-03-05
申请人： Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim
发明人： Hun Joo Hahm , Hyung Suk Kim , Dae Yeon Kim
IPC分类号： G02F1/1335
CPC分类号： G02F1/133603 , G02F1/133605 , G02F1/133608
摘要： Provided is a backlight unit of an LCD device including a printed circuit board; a plurality of light emitting diodes (LEDs) mounted on the printed circuit board; and a bottom chassis formed with only an outer frame and having the printed circuit board housed thereon.
摘要翻译：提供了包括印刷电路板的LCD装置的背光单元; 安装在印刷电路板上的多个发光二极管（LED）; 以及仅具有外框架并且其上容纳有印刷电路板的底架。

8. 发明授权

US07513632B2 Direct-illumination backlight apparatus having transparent plate acting as light guide plate 失效
标题翻译：具有用作导光板的透明板的直接照明背光装置
公开(公告)号：US07513632B2
公开(公告)日：2009-04-07
申请号：US11860391
申请日：2007-09-24
申请人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
发明人： Hyung Suk Kim , Jung Kyu Park , Ho Sik Ahn , Young June Jeong , Young Sam Park , Hun Joo Hahm , Bum Jin Kim
IPC分类号： G01D11/28
CPC分类号： G02B6/0021 , G02B6/0038 , G02B6/0041 , G02F1/133603
摘要： A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.
摘要翻译：使用LED的直接照明背光装置包括平面反射板，LED光源，透明板，散射图案和导光体。该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而散射的光束从透明板向LCD面板逸出。

9. 发明申请

US20080076198A1 Method of manufacturing light emitting diode package and white light source module 审中-公开
标题翻译：制造发光二极管封装和白光源模块的方法
公开(公告)号：US20080076198A1
公开(公告)日：2008-03-27
申请号：US11902233
申请日：2007-09-20
申请人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim
发明人： Young Sam Park , Hun Joo Hahm , Hyung Suk Kim
IPC分类号： H01L21/00 , H01J9/02
CPC分类号： H01L33/507 , H01L2933/0041
摘要： A method of manufacturing a light emitting diode package, the method including: forming a resin mold encapsulating a light emitting diode chip; and forming a phosphor thin film on a surface of the resin mold by applying a phosphor-containing coating material on the surface of the resin mold.
摘要翻译：一种制造发光二极管封装的方法，所述方法包括：形成封装发光二极管芯片的树脂模; 以及通过在树脂模具的表面上涂布含磷的涂料，在树脂模具的表面上形成荧光体薄膜。

10. 发明申请

US20080061458A1 Mold for forming lens of light emitting diode package and method of manufacturing light emitting diode package using the same 审中-公开
标题翻译：用于形成发光二极管封装透镜的模具及使用其的制造发光二极管封装的方法
公开(公告)号：US20080061458A1
公开(公告)日：2008-03-13
申请号：US11896975
申请日：2007-09-07
申请人： Young Sam Park , Hun Joo Hahm , Seong Yeon Han , Chul Hee Yoo
发明人： Young Sam Park , Hun Joo Hahm , Seong Yeon Han , Chul Hee Yoo
IPC分类号： B29D11/00 , B28B7/36
CPC分类号： B29D11/00278 , B29C33/62 , G02B3/0031 , G02B3/0037
摘要： There is provided a mold formed of fluorocarbon resin to prevent a resin, which is a material of a lens of a LED package, from adhering to the mold even without using a separate release film, and a method of manufacturing the light emitting package using the mold. The mold includes a plurality of cavities formed in an upper surface thereof to hold a resin for forming lenses of the light emitting diode package. The mold and the method using the mold prevents adherence of the resin without using a separate release film, allowing formation of a lens with a smooth surface and formation of a protrusion or an indentation on the surface of the lens.
摘要翻译：提供一种由碳氟树脂形成的模具，以防止作为LED封装的透镜的材料的树脂即使不使用单独的脱模膜也粘附到模具上，以及使用该方法制造发光封装模子。模具包括形成在其上表面中的多个空腔，以容纳用于形成发光二极管封装的透镜的树脂。使用模具的模具和方法防止树脂粘附，而不使用单独的脱模膜，允许形成具有光滑表面的透镜并在透镜表面上形成突起或凹陷。

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