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    • 1. 发明授权
    • Heat dissipation system
    • 散热系统
    • US08659891B2
    • 2014-02-25
    • US13095868
    • 2011-04-28
    • Hua HuangXiang-Kun ZengZhi-Jiang YaoLi-Fu Xu
    • Hua HuangXiang-Kun ZengZhi-Jiang YaoLi-Fu Xu
    • H05K7/20
    • G06F1/20
    • A heat dissipation system includes a computer case has a base plate and a back plate, a heat sink, a second heat source, and an air partition panel. The back plate defines a plurality of first air outlet holes aligned with the heat sink, and a plurality of second air outlet holes aligned with the second heat source. The heat sink is positioned on the base plate in contact with a first heat source. The second heat source is positioned on the base plate adjacent to the base plate. The air partition panel is positioned on the base plate between the motherboard and the second heat source. A first air path is defined between the air partition panel and the plurality of first air outlet holes. A second air path is defined between the air partition panel and the plurality of second air outlet holes.
    • 散热系统包括具有基板和背板,散热器,第二热源和空气隔板的计算机外壳。 后板限定与散热器对准的多个第一空气出口孔和与第二热源对准的多个第二空气出口孔。 散热器位于与第一热源接触的基板上。 第二热源位于与基板相邻的基板上。 空气分隔板位于主板和第二热源之间的基板上。 在空气隔板和多个第一空气出口孔之间限定第一空气通道。 在空气隔板和多个第二空气出口孔之间限定第二空气路径。
    • 2. 发明授权
    • Heat dissipation system
    • 散热系统
    • US08737070B2
    • 2014-05-27
    • US13195004
    • 2011-08-01
    • Chao-Jun ZhuXiang-Kun ZengZhi-Jiang YaoLi-Fu Xu
    • Chao-Jun ZhuXiang-Kun ZengZhi-Jiang YaoLi-Fu Xu
    • H05K7/20
    • G06F1/20
    • A heat dissipation system includes an enclosure, a first heat sink, a second heat sink, and a fan. The enclosure includes a bottom plate, a first side plate, and a second side plate. A first air vent area is located on the first side plate. A second air vent area is located on the second side plate. A first heat generation apparatus and a second heat generation apparatus is mounted on the bottom plate and located between the first air vent area and the second air vent area. A first heat sink is mounted on the bottom plate and contacts the first heat generation apparatus. A second heat sink is mounted on the bottom plate and contacts the second heat generation apparatus. A plurality of second fins is located on the second heat sink. Each second fin is wavy. A fan is located between the first air vent area and the second air vent area. The fan is adapted to drive air to flow through the first air vent area, the first heat sink, the plurality of second fins, and the second air vent area.
    • 散热系统包括外壳,第一散热器,第二散热器和风扇。 外壳包括底板,第一侧板和第二侧板。 第一排气区位于第一侧板上。 第二通气区域位于第二侧板上。 第一发热装置和第二发热装置安装在底板上并且位于第一通气区域和第二通气区域之间。 第一散热器安装在底板上并接触第一发热装置。 第二散热器安装在底板上并接触第二发热装置。 多个第二散热片位于第二散热器上。 每个第二个鳍都是波浪的。 风扇位于第一通气区域和第二通气区域之间。 风扇适于驱动空气流过第一通气区域,第一散热器,多个第二散热片和第二通气区域。
    • 3. 发明授权
    • Computer system with airflow guiding duct
    • 带导气管的电脑系统
    • US08081444B2
    • 2011-12-20
    • US12697219
    • 2010-01-30
    • Bo XiaoXiang-Kun ZengZhi-Guo ZhangLi-Fu Xu
    • Bo XiaoXiang-Kun ZengZhi-Guo ZhangLi-Fu Xu
    • H05K5/00H05K7/20G06F1/20A47B81/00
    • G06F1/20
    • A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.
    • 计算机系统包括底盘和气流引导导管。 底盘包括机箱底壁,底盘前壁和底盘后壁。 底盘前壁限定第一通风孔,底盘后壁限定第二通风孔。 主机板固定在机箱前壁和底盘后墙之间的机箱底壁上。 存储卡固定在主板上。 气流引导管固定在底盘中,并包括入口部分。 入口部分覆盖存储卡的一部分,以引导气流。 气流通过第一个通气孔,存储卡上方流过底盘,然后通过第二个通风孔流出机箱。
    • 4. 发明授权
    • Electronic device with cooler
    • 带冷却器的电子设备
    • US08625278B2
    • 2014-01-07
    • US13300735
    • 2011-11-21
    • Rui WangZhi-Jiang YaoLi-Fu Xu
    • Rui WangZhi-Jiang YaoLi-Fu Xu
    • H05K7/20
    • G06F1/20H01L23/4006H01L23/467H01L2924/0002H01L2924/00
    • An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.
    • 电子装置包括一个包括多个第一锁定件,一个限定多个第一和第二定位孔的背板和一个电路板的冷却器。 背板通过与第二定位孔接合的第一锁定构件连接到冷却器。 第一安装构件和第二安装构件适于容纳发热构件。 第一安装构件限定多个锁定孔。 第一定位孔位于第二定位孔之中。 第二安装构件接收发热部件,电路板位于第二安装构件和背板之间,第一安装构件固定在电路板上; 当第一安装构件接收到发热部件时,电路板在第一安装构件和背板之间,第一安装构件固定在背板上。
    • 5. 发明授权
    • Fan speed control circuit
    • 风扇转速控制电路
    • US08513908B2
    • 2013-08-20
    • US13166364
    • 2011-06-22
    • Xiang-Ji HuangJian FuZhi-Jiang YaoLi-Fu Xu
    • Xiang-Ji HuangJian FuZhi-Jiang YaoLi-Fu Xu
    • H02P7/00
    • F04D27/004
    • A fan speed control circuit includes a first fan, a second fan, a first temperature sensor, a second temperature sensor, a PWM regulator, and a driving module. The first temperature sensor senses a temperature of the first component to generate a first temperature signal. The second temperature sensor senses a temperature of a second component to generate a second temperature signal. The PWM regulator is connected to the first temperature sensor and the second temperature sensor. The PWM regulator generates a first PWM signal according to the first temperature signal and generates a second PWM signal according to the second temperature signal. The driving module is connected to the PWM regulator. The driving module generates a first driving voltage provided to the first fan according to the first PWM signal. The driving module also generates a second driving voltage provided to the second fan according to the second PWM signal.
    • 风扇速度控制电路包括第一风扇,第二风扇,第一温度传感器,第二温度传感器,PWM调节器和驱动模块。 第一温度传感器感测第一部件的温度以产生第一温度信号。 第二温度传感器感测第二部件的温度以产生第二温度信号。 PWM调节器连接到第一温度传感器和第二温度传感器。 PWM调节器根据第一温度信号产生第一PWM信号,并根据第二温度信号产生第二PWM信号。 驱动模块连接到PWM调节器。 驱动模块根据第一PWM信号产生提供给第一风扇的第一驱动电压。 驱动模块还根据第二PWM信号产生提供给第二风扇的第二驱动电压。
    • 6. 发明授权
    • Computer system with airflow guiding duct
    • 带导气管的电脑系统
    • US08120909B2
    • 2012-02-21
    • US12697304
    • 2010-02-01
    • Jian FuXiao-Su ZhuZhi-Jiang YaoLi-Fu Xu
    • Jian FuXiao-Su ZhuZhi-Jiang YaoLi-Fu Xu
    • H05K7/20
    • G06F1/203
    • A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct.
    • 计算机系统包括底盘,母板,散热器和气流引导导管。 底盘包括底盘底壁,第一底盘侧壁和第二底盘侧壁。 第一底盘侧壁限定第一通风孔。 第二底盘侧壁限定第二通风孔。 具有芯片的主板固定在机箱底壁上。 散热片固定在主板上以冷却芯片。 气流引导管被构造成引导从第二通风流向第一通风孔的气流。 风扇被容纳在气流引导管内。
    • 7. 发明授权
    • Heat sink assembly
    • 散热器组件
    • US08593814B2
    • 2013-11-26
    • US13180836
    • 2011-07-12
    • Jin-Biao JiZhi-Jiang YaoLi-Fu Xu
    • Jin-Biao JiZhi-Jiang YaoLi-Fu Xu
    • H05K7/20F28F7/00
    • G06F1/20H01L23/3672H01L23/4006H01L23/467H01L2924/0002H01L2924/00
    • A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.
    • 散热器包括接触部分,第一支撑肋,第二支撑肋,第三支撑肋和从接触部分径向延伸的第四支撑肋,以及从第一支撑肋径向延伸的多个平行翅片,第二支撑肋 支撑肋,第三支撑肋和位于两个相邻的支撑肋之间的第四支撑肋。 接触部分与第一热源接触。 从第一支撑肋和第二支撑肋之间的多个平行翅片的接触部分到边缘的距离是第一距离。 距第三支撑肋和第四支撑肋之间的多个平行翅片的接触部分到边缘的距离为第二距离。 第一距离小于第二距离。
    • 8. 发明授权
    • Mounting assembly for heat dissipating device
    • 散热装置用安装组件
    • US08498118B2
    • 2013-07-30
    • US13118070
    • 2011-05-27
    • Tao WangJian FuZhi-Jiang YaoLi-Fu Xu
    • Tao WangJian FuZhi-Jiang YaoLi-Fu Xu
    • H05K7/20
    • G06F1/20H01L23/4093H01L2924/0002Y10T24/44026H01L2924/00
    • A mounting assembly includes a circuit board, a securing member and a heat dissipating device. A retainer is located on the circuit board. The securing member includes a positioning portion and a claw connected to the positioning portion. The heat dissipating device includes a base attached to the circuit board and a number of fins perpendicularly located on the base. The number of fins defines a number of first air paths and a number of second air paths substantially perpendicular to the number of first air paths. The positioning portion is received in at least one of the number of first air paths and at least one of the number of second air paths, and the claw is engaged with the retainer.
    • 安装组件包括电路板,固定构件和散热装置。 保持架位于电路板上。 固定构件包括与定位部连接的定位部和爪。 散热装置包括附接到电路板的基座和垂直地位于基座上的多个翅片。 翅片的数量限定了多个第一空气路径和多个基本上垂直于第一空气路径的数量的第二空气路径。 定位部分被容纳在多个第一空气通道中的至少一个和多个第二空气通道中的至少一个中,并且爪与保持器接合。
    • 9. 发明授权
    • Connector assembly
    • 连接器组件
    • US08357004B2
    • 2013-01-22
    • US13241235
    • 2011-09-23
    • Heng TaoBiao ZengZhi-Guo ZhangLi-Fu Xu
    • Heng TaoBiao ZengZhi-Guo ZhangLi-Fu Xu
    • H01R13/62
    • H01R13/6272H01R13/64
    • A connector assembly includes a first connector with a positioning portion and a second connector with a latch. A blocking portion is located on a second side of the first connector. The latch defines an oblique latching plane, the positioning portion defines an oblique sliding plane, and the blocking portion defines an oblique blocking plane. If the latch is aligned with the positioning portion and is slid towards the first connector, the oblique direction of the second latching plane is substantially the same as the oblique positioning plane. If the latch is aligned with the blocking portion and is slid towards the first connector, an acute angle is defined between the oblique direction of the second latching plane and the oblique direction of the blocking plane.
    • 连接器组件包括具有定位部分的第一连接器和具有闩锁的第二连接器。 阻挡部分位于第一连接器的第二侧上。 闩锁限定倾斜的锁定平面,定位部分限定倾斜的滑动平面,并且阻挡部分限定倾斜的阻挡平面。 如果闩锁与定位部对准并且朝向第一连接器滑动,则第二闩锁平面的倾斜方向与倾斜定位平面基本相同。 如果闩锁与阻挡部分对准并且朝向第一连接器滑动,则在第二闩锁平面的倾斜方向和阻挡平面的倾斜方向之间限定锐角。