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1. 发明授权

US07365979B2 Heat dissipating assembly with fan fastening device 失效
标题翻译：散热组件，带风扇固定装置
公开(公告)号：US07365979B2
公开(公告)日：2008-04-29
申请号：US11265368
申请日：2005-11-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Guang Yu , Yong-Dong Chen
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Guang Yu , Yong-Dong Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device (8) includes a heat sink (40), a first and a second fixing members (2, 3) mounted on the heat sink, a lever (1) pivotably mounted to the second fixing member, a fan holder (5) and a fan (6) mounted on the fan holder. A pair of mounting holes (26) is defined in the first fixing member. A catch (38) is bent from the second fixing member for clasping the lever. The fan holder includes a pair of tongues engaged in the mounting holes of the first fixing member, and a U-shaped receiving portion (58) receiving and downwardly pressed by the lever.
摘要翻译：散热装置（8）包括散热器（40），安装在散热器上的第一和第二固定部件（2,3），可枢转地安装在第二固定部件上的杠杆（1），风扇支架 5）和安装在风扇支架上的风扇（6）。一对安装孔（26）被限定在第一固定构件中。夹子（38）从第二固定构件弯曲以夹紧杆。风扇架包括一对接合在第一固定构件的安装孔中的舌片，以及由杆接收和向下按压的U形接收部分（58）。

2. 发明申请

US20070097625A1 Printed circuit board with a heat dissipation device 失效
标题翻译：具有散热装置的印刷电路板
公开(公告)号：US20070097625A1
公开(公告)日：2007-05-03
申请号：US11265367
申请日：2005-11-01
申请人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
发明人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0203 , H05K1/181 , H05K3/0061 , H05K2201/0209 , H05K2201/09909
摘要： An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.
摘要翻译：电子组件包括印刷电路板，CPU，电子部件和附接到印刷电路板的散热垫。 CPU和电子部件位于印刷电路板的第一面上。电子元件位于CPU附近。散热焊盘安装在与印刷电路板的第一面相对的第二面上，并位于电子部件正下方。

3. 发明申请

US20070097632A1 Heat dissipating assembly with fan fastening device 失效
标题翻译：散热组件，带风扇固定装置
公开(公告)号：US20070097632A1
公开(公告)日：2007-05-03
申请号：US11265368
申请日：2005-11-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Guang Yu , Yong-Dong Chen
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Guang Yu , Yong-Dong Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device (8) includes a heat sink (40), a first and a second fixing members (2, 3) mounted on the heat sink, a lever (1) pivotably mounted to the second fixing member, a fan holder (5) and a fan (6) mounted on the fan holder. A pair of mounting holes (26) is defined in the first fixing member. A catch (38) is bent from the second fixing member for clasping the lever. The fan holder includes a pair of tongues engaged in the mounting holes of the first fixing member, and a U-shaped receiving portion (58) receiving and downwardly pressed by the lever.
摘要翻译：散热装置（8）包括散热器（40），安装在散热器上的第一和第二固定部件（2,3），可枢转地安装在第二固定部件上的杠杆（1），风扇支架 5）和安装在风扇支架上的风扇（6）。一对安装孔（26）被限定在第一固定构件中。夹子（38）从第二固定构件弯曲以夹紧杆。风扇架包括一对接合在第一固定构件的安装孔中的舌片，以及由杆接收和向下按压的U形接收部分（58）。

4. 发明授权

US07254029B2 Printed circuit board with a heat dissipation device 失效
公开(公告)号：US07254029B2
公开(公告)日：2007-08-07
申请号：US11265367
申请日：2005-11-01
申请人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
发明人： Yong-Dong Chen , Guang Yu , Shin-Hsuu Wung , Chun-Chi Chen , Hsieh-Kun Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/205 , H05K1/0203 , H05K1/181 , H05K3/0061 , H05K2201/0209 , H05K2201/09909
摘要： An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.

5. 发明授权

US07254028B2 Heat dissipating device with back plate for electronic assembly 失效
标题翻译：散热装置，带背板用于电子组装
公开(公告)号：US07254028B2
公开(公告)日：2007-08-07
申请号：US11269379
申请日：2005-11-08
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly includes a PCB (20), a socket (22) mounted on the PCB, a CPU (24) connected with the socket, a heat sink (10) in thermal contact with the CPU, a foldable back plate (30) attached to an underside of the PCB and a base plane (40) forming four bridges (42). The back plate includes a first piece section (32) and a second piece section (34) pivotally joined together by a pivot (36). The first and the second piece sections each comprise two legs inserted into two corresponding bridges. Screws are used to extend through the heat sink, the PCB, the bridges to threadedly engage with the legs of the back plate, respectively. The pivot is located under a part of the PCB at which the CPU is mounted.
摘要翻译：电子组件包括PCB（20），安装在PCB上的插座（22），与插座连接的CPU（24），与CPU热接触的散热器（10），可折叠背板（30）附接到PCB的下侧和形成四个桥（42）的基面（40）。后板包括通过枢轴（36）枢轴连接在一起的第一片段（32）和第二片段（34）。第一和第二片段各自包括插入到两个对应的桥中的两个腿。螺丝用于延伸穿过散热片，PCB，桥接件分别与背板的腿部螺纹接合。枢轴位于安装有CPU的PCB的一部分下方。

6. 发明申请

US20060279933A1 Heat dissipating device with back plate for electronic assembly 失效
标题翻译：散热装置，带背板用于电子组装
公开(公告)号：US20060279933A1
公开(公告)日：2006-12-14
申请号：US11269379
申请日：2005-11-08
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly includes a PCB (20), a socket (22) mounted on the PCB, a CPU (24) connected with the socket, a heat sink (10) in thermal contact with the CPU, a foldable back plate (30) attached to an underside of the PCB and a base plane (40) forming four bridges (42). The back plate includes a first piece section (32) and a second piece section (34) pivotally joined together by a pivot (36). The first and the second piece sections each comprise two legs inserted into two corresponding bridges. Screws are used to extend through the heat sink, the PCB, the bridges to threadedly engage with the legs of the back plate, respectively. The pivot is located under a part of the PCB at which the CPU is mounted.
摘要翻译：电子组件包括PCB（20），安装在PCB上的插座（22），与插座连接的CPU（24），与CPU热接触的散热器（10），可折叠背板（30）附接到PCB的下侧和形成四个桥（42）的基面（40）。后板包括通过枢轴（36）枢轴连接在一起的第一片段（32）和第二片段（34）。第一和第二片段各自包括插入到两个对应的桥中的两个腿。螺丝用于延伸穿过散热片，PCB，桥接件分别与背板的腿部螺纹接合。枢轴位于安装有CPU的PCB的一部分下方。

7. 发明授权

US07254021B2 Electronic system having a fan duct 失效
标题翻译：具有风扇导管的电子系统
公开(公告)号：US07254021B2
公开(公告)日：2007-08-07
申请号：US11264986
申请日：2005-11-01
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shin-Hsuu Wung , Yu Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A fan duct (8) buckled to a fan (7) is mounted in a computer enclosure (4) having an upper panel (44) defining a plurality of apertures (440). The fan duct includes a first open portion (80) having a first opening (804) and a second open portion (82) having a second opening (822). The first open portion comprises two opposite lateral flanges (802). Each flange forms a pair of latches (806, 808) buckled to the fan to prevent removal of the fan duct in the horizontal direction. A pair of resilient tabs (824) is formed at two opposite lateral sides of the second opening. The tabs are pressed by the upper panel of the computer enclosure to confine the fan duct to move upwardly. The second opening communicates with the apertures and the first opening communicates with the fan.
摘要翻译：与风扇（7）接合的风扇导管（8）安装在具有限定多个孔（440）的上面板（44）的计算机外壳（4）中。风扇管道包括具有第一开口（804）和具有第二开口（822）的第二开口部分（82）的第一开口部分（80）。第一开口部分包括两个相对的侧向凸缘（802）。每个凸缘形成一对锁扣（806,808），其抵靠风扇以防止在水平方向上移除风扇导管。一对弹性突片（824）形成在第二开口的两个相对的横向侧上。凸起被计算机外壳的上面板按压以限制风扇导管向上移动。第二开口与孔连通，第一开口与风扇连通。

8. 发明申请

US20070097649A1 UNIVERSAL LOCKING DEVICE FOR HEAT SINK 失效
标题翻译：通用锁止装置
公开(公告)号：US20070097649A1
公开(公告)日：2007-05-03
申请号：US11265369
申请日：2005-11-01
申请人： Bo-Yong Yang , Shin-Hsuu Wung , Chun-Chi Chen
发明人： Bo-Yong Yang , Shin-Hsuu Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device includes a flat plate for contacting with a heat-generating electronic component, a plurality of fins mounted on the flat plate, four locking feet and four fasteners. The flat plate includes two locking portions at opposite sides thereof. Each locking foot includes two spaced pivot plates at an end thereof, wherein the locking portions of the flat plate are sandwiched between the pivot plates. The locking feet are pivotably connected to the locking portions. The fasteners are secured to ends of the locking feet respectively, opposite to the ends where the spaced pivot plates are formed. The locking feet are pivotably movable between first and second positions. The locking device can be mounted to a first-typed PCB at the first position and a second-typed PCB at the second position.
摘要翻译：锁定装置包括用于与发热电子部件接触的平板，安装在平板上的多个翅片，四个锁定脚和四个紧固件。平板在其相对侧包括两个锁定部分。每个锁定脚在其一端包括两个间隔开的枢转板，其中平板的锁定部分夹在枢转板之间。锁定脚可枢转地连接到锁定部分。紧固件分别固定到锁定脚的端部，与形成间隔开的枢轴板的端部相对。锁定脚在第一和第二位置之间可枢转地移动。锁定装置可以安装在第一位置处的第一类PCB，在第二位置安装第二类PCB。

9. 发明授权

US07239518B2 Universal locking device for heat sink 失效
标题翻译：通用散热器锁紧装置
公开(公告)号：US07239518B2
公开(公告)日：2007-07-03
申请号：US11265369
申请日：2005-11-01
申请人： Bo-Yong Yang , Shin-Hsuu Wung , Chun-Chi Chen
发明人： Bo-Yong Yang , Shin-Hsuu Wung , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A locking device includes a flat plate for contacting with a heat-generating electronic component, a plurality of fins mounted on the flat plate, four locking feet and four fasteners. The flat plate includes two locking portions at opposite sides thereof. Each locking foot includes two spaced pivot plates at an end thereof, wherein the locking portions of the flat plate are sandwiched between the pivot plates. The locking feet are pivotably connected to the locking portions. The fasteners are secured to ends of the locking feet respectively, opposite to the ends where the spaced pivot plates are formed. The locking feet are pivotably movable between first and second positions. The locking device can be mounted to a first-typed PCB at the first position and a second-typed PCB at the second position.
摘要翻译：锁定装置包括用于与发热电子部件接触的平板，安装在平板上的多个翅片，四个锁定脚和四个紧固件。平板在其相对侧包括两个锁定部分。每个锁定脚在其一端包括两个间隔开的枢转板，其中平板的锁定部分夹在枢转板之间。锁定脚可枢转地连接到锁定部分。紧固件分别固定到锁定脚的端部，与形成间隔开的枢轴板的端部相对。锁定脚在第一和第二位置之间可枢转地移动。锁定装置可以安装在第一位置处的第一类PCB，在第二位置安装第二类PCB。

10. 发明申请

US20050286232A1 Heat sink 审中-公开
标题翻译：散热器
公开(公告)号：US20050286232A1
公开(公告)日：2005-12-29
申请号：US11135164
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Shin-Hsuu Wung , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Shin-Hsuu Wung , Zhan Wu
IPC分类号： G06F1/20 , H01L23/34 , H01L23/367 , H01L23/467 , H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a base and a plurality of spaced parallel fins arranged on the base. Adjacent fins define a plurality of passages there between. Each passage includes an inlet and at least one outlet. The base and the fins made separately, and the fins is thin, such that amount of the fins arranged on the base increases. And the fins are disposed on the base alternately or/and staggered such that the inlet and the outlet are wider than a middle part of the passage to lower airflow resistance thereat. Thus, the heat sink has large heat dissipating area and low airflow resistance synchronously.
摘要翻译：散热器包括基部和布置在基部上的多个间隔开的平行翅片。相邻的翅片在其间限定多个通道。每个通道包括入口和至少一个出口。底座和翅片单独制造，并且翅片较薄，使得布置在基座上的翅片的数量增加。并且翅片交替地或/并交错设置在基座上，使得入口和出口比通道的中间部分宽，以降低通风阻力。因此，散热器同时具有大的散热面积和低气流阻力。

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