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    • 8. 再颁专利
    • Wireless communication medium and method for operating the same
    • 无线通信介质及其操作方法
    • USRE43001E1
    • 2011-12-06
    • US12368589
    • 2009-02-10
    • Ji Man ParkYong-sung JeonHong-il JuYoung-soo ParkSung-ik JunKyo-ill Chung
    • Ji Man ParkYong-sung JeonHong-il JuYoung-soo ParkSung-ik JunKyo-ill Chung
    • H04B1/16
    • G06K19/0723
    • A wireless communication medium includes an antenna, an analog signal processor, a digital signal processor, and a central processing unit & logic module. The antenna transmits and receives a signal to and from an external apparatus. The analog signal processor converts an analog signal to a digital signal, and converts a digital signal to an analog signal. The digital signal processor demodulates the digital signal, detects the start and end of data, and generates a first control signal for determining whether data is transmitted to the external apparatus and a second control signal for perceiving the end of data, blocking the reception of data, modulating data, and determining whether modulated data is transmitted to the external apparatus. The central processing unit & logic module processes data received from and transmitted to the external apparatus. Accordingly, an efficiency of processing a RF signal can be improved.
    • 无线通信介质包括天线,模拟信号处理器,数字信号处理器和中央处理单元和逻辑模块。 天线向外部设备发送和接收信号。 模拟信号处理器将模拟信号转换为数字信号,并将数字信号转换为模拟信号。 数字信号处理器解调数字信号,检测数据的开始和结束,并且产生用于确定数据是否被发送到外部设备的第一控制信号和用于感知数据结束的第二控制信号,阻止数据的接收 调制数据,以及确定调制数据是否被发送到外部设备。 中央处理单元和逻辑模块处理从外部设备接收和发送的数据。 因此,可以提高处理RF信号的效率。
    • 9. 发明申请
    • HAIRBRUSH
    • 发刷
    • US20110239390A1
    • 2011-10-06
    • US12667125
    • 2008-06-23
    • Young-soo Park
    • Young-soo Park
    • A46B15/00
    • A46B5/00A45D20/12A46B5/02A46B15/0002A46B15/0051A46B2200/104
    • A hairbrush in which air blown from a hair dryer to the rear face side of the hairbrush is smoothly guided to through-holes in the hairbrush to send the air to the front face side. In the hairbrush (1), divergent projections (4a-4g) are formed on a rear face (2a) of a base section (2) and through-holes (8a-8f) are respectively formed in depressions (3a-3f) located between the projections. A cushion member (5) of a brush section (9) is fixed to the front face (2e) side of the base section (2) of the hairbrush (1), and bristles (6) are embedded in the cushion member (5) through which holes (5a) are formed. Air blown from the hair dryer to the rear face (2a) side of the hair brush (1) is guided by the projections (4a-4g) to the depressions (3a-3f) located between the projections and enters the through-holes (8a-8f). The air passed through the through-holes (8a-8f) passes through the holes (5a) in the cushion member (5) and sent to the front face side of the hairbrush (1).
    • 将从吹风机吹送到发刷的背面侧的空气被顺利地引导到发刷中的通孔中以将空气送到正面侧的发刷。 在发刷(1)中,在基部(2)的后表面(2a)上形成有发散突起(4a-4g),并且通孔(8a-8f)分别形成在位于 在投影之间。 刷子部分(9)的缓冲构件(5)固定到发刷(1)的基部(2)的前表面(2e)侧,刷毛(6)嵌入缓冲构件(5) )形成有孔(5a)。 从吹风机吹送到毛刷(1)的背面(2a)侧的空气被突起(4a-4g)引导到位于突起之间的凹部(3a-3f),并进入通孔( 8a-8f)。 穿过通孔(8a-8f)的空气穿过缓冲构件(5)中的孔(5a)并被送到发刷(1)的正面侧。
    • 10. 发明授权
    • Method of manufacturing light emitting device
    • 制造发光器件的方法
    • US08003419B2
    • 2011-08-23
    • US12458900
    • 2009-07-27
    • Kyoung-kook KimSu-hee ChaeYoung-soo ParkTaek KimMoon-seung YangHyung-su JeongJae-chul ParkJun-youn Kim
    • Kyoung-kook KimSu-hee ChaeYoung-soo ParkTaek KimMoon-seung YangHyung-su JeongJae-chul ParkJun-youn Kim
    • H01L21/00
    • H01L33/0079H01L2924/0002H01L2924/00
    • Provided is a method of manufacturing a light emitting device from a large-area bonding wafer by using a wafer bonding method using. The method may include forming a plurality of semiconductor layers, each having an active region for emitting light, on a plurality of growth substrates. The method may also include arranging the plurality of growth substrates on which the semiconductor layers are formed on one bonding substrate and simultaneously processing each of the semiconductor layers formed on each of the growth substrates through subsequent processes. The bonding wafer may be formed of a material that reduces or prevents bending or warping due to a difference of thermal expansion coefficients between a wafer material, such as sapphire, and a bonding wafer. According to the above method, because a plurality of wafers may be processed by one process, mass production of LEDs may be possible which may reduce manufacturing costs.
    • 提供了一种使用晶片接合方法从大面积接合晶片制造发光器件的方法。 该方法可以包括在多个生长衬底上形成多个半导体层,每个半导体层具有发射光的有源区。 该方法还可以包括在其上形成半导体层的多个生长衬底布置在一个接合衬底上,并且通过后续处理同时处理在每个生长衬底上形成的每个半导体层。 接合晶片可以由减少或防止由于晶片材料(例如蓝宝石)和接合晶片之间的热膨胀系数的差异而导致的弯曲或翘曲的材料形成。 根据上述方法,由于可以通过一个处理来处理多个晶片,因此大量生产LED可能会降低制造成本。