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1. 发明授权

US06180964B2 Low leakage wire bond pad structure for integrated circuits 有权
标题翻译：用于集成电路的低漏导线焊盘结构
公开(公告)号：US06180964B2
公开(公告)日：2001-01-30
申请号：US09205112
申请日：1998-12-03
申请人： Ho-Yin Yiu , Lin-June Wu , T. Cheng
发明人： Ho-Yin Yiu , Lin-June Wu , T. Cheng
IPC分类号： H01L2974
CPC分类号： H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05556 , H01L2224/05558 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/4807 , H01L2224/48453 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/85399 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01079 , H01L2924/014 , H01L2924/12036 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00
摘要： An improved bond pad structure for semiconductor devices provides improved electrical isolation between adjacent bond pads by incorporating a pair of pn junctions between the pad and substrate. The pn junctions are defined by a first well of either P of N type material, formed within a substrate, and a second well or region of a P or N type material formed wholly within the first well. A bond wire is secured to an upper surface of the second region such that the wire, first and second regions and substrate are connected in electrical series relationship and provide an equivalent circuit of two series connected diodes reversed in polarity so as to block both negative and positive components of an applied voltage, thus providing electrical isolation for the bond pad structure.
摘要翻译：用于半导体器件的改进的接合焊盘结构通过在焊盘和衬底之间并入一对pn结来提供相邻接合焊盘之间的改善的电隔离。 pn结由在衬底内形成的N型材料的P的第一阱和完全在第一阱内形成的P或N型材料的第二阱或区域限定。接合线被固定到第二区域的上表面，使得电线，第一和第二区域和衬底以电串联连接并且提供两个串联连接的二极管极性反转的等效电路，以阻止负极和施加电压的正分量，从而为接合焊盘结构提供电隔离。

2. 发明申请

US20070041187A1 Preset welding spot structure of a backlight module 审中-公开
标题翻译：预设背光模组的焊点结构
公开(公告)号：US20070041187A1
公开(公告)日：2007-02-22
申请号：US11204240
申请日：2005-08-16
申请人： T. Cheng
发明人： T. Cheng
IPC分类号： F21V5/00
CPC分类号： G02F1/133603 , H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： A backlight module with at least one backup welding spot comprises a backlight module having a support substrate; at least one light emitting diode; at lease one welding spot located near a respective one of the at least one light emitting diode; wherein the welding spot serves to be welded with another light emitting diode so that the another light emitting diode is electrically connected to the support substrate. The support substrate has at least one groove for receiving the light emitting diode. The light emitting diode is enclosed by a lens. When any one of the light emitting diodes on the support substrate cannot work, it is not necessary to detach the lens and the fault light emitting diode. It is only necessary to weld another light emitting diode aside the respective welding spot.
摘要翻译：具有至少一个备用焊接点的背光模块包括具有支撑衬底的背光模块; 至少一个发光二极管; 至少一个位于所述至少一个发光二极管的相应一个附近的焊接点; 其中所述焊接点用于与另一个发光二极管焊接，使得所述另一个发光二极管电连接到所述支撑衬底。支撑基板具有用于接收发光二极管的至少一个凹槽。发光二极管由透镜包围。当支撑基板上的任何一个发光二极管不能工作时，不需要分离透镜和故障发光二极管。只需要焊接另一个发光二极管，除了相应的焊接点。

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