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    • 4. 发明授权
    • Thin-film magnetic head with closure and manufacturing method of the head
    • 薄膜磁头封头及头部制造方法
    • US07764466B2
    • 2010-07-27
    • US11553706
    • 2006-10-27
    • Mitsuyoshi KawaiTomonaga NishikawaTsutomu ChikamatsuMakoto Yoshida
    • Mitsuyoshi KawaiTomonaga NishikawaTsutomu ChikamatsuMakoto Yoshida
    • G11B5/31
    • G11B5/3106G11B5/012G11B5/3133G11B5/3163
    • A thin-film magnetic head where the closure is bonded with sufficiently high adhesive strength by the adhesive layer thinner than conventional and that is free from the problem of fine dusts, is provided. The head comprises: a substrate having an element-formed surface and an opposed-to-medium surface; at least one magnetic head element provided on/above the element-formed surface; an overcoat layer formed on the element-formed surface; an etching pattern formed on a part of an upper surface of the overcoat layer, the whole or a part of the etching pattern being filled up by adhesive; a closure provided on the etching pattern of the overcoat layer; and an opening portion formed close to an edge on the opposite side to the opposed-to-medium surface of an adhesive surface of the closure, being a portion exposed from the closure of the etching pattern.
    • 提供了一种薄膜磁头,其中封闭物通过比常规更薄的粘合剂层以足够高的粘合强度粘结,并且没有细粉尘的问题。 头部包括:具有元件形成表面和相对中间表面的基底; 设置在所述元件形成表面上/上的至少一个磁头元件; 形成在所述元件形成表面上的外涂层; 形成在外涂层的上表面的一部分上的蚀刻图案,蚀刻图案的全部或一部分被粘合剂填充; 设置在外涂层的蚀刻图案上的封闭件; 以及开口部分,其形成在与封闭件的粘合剂表面的相对中间表面的相对侧上的边缘附近,该部分是从蚀刻图案的封闭体露出的部分。
    • 6. 发明授权
    • Magnetic head device
    • 磁头装置
    • US06339519B1
    • 2002-01-15
    • US09437680
    • 1999-11-10
    • Izumi NomuraHaruyuki MoritaMasashi ShiraishiMitsuyoshi KawaiTakeshi Wada
    • Izumi NomuraHaruyuki MoritaMasashi ShiraishiMitsuyoshi KawaiTakeshi Wada
    • G11B560
    • G11B5/4853G11B5/486
    • There is disclosed a magnetic head device in which a head IC chip may be located relatively closer to a magnetic head and a thermal effect may be controlled to be within a range of acceptable degree. Said magnetic head device comprises a head slider having a magnetic head, a suspension member which is made of thin resilient material and supports the head slider at one end thereof, and a head IC chip, wherein the suspension member is attached to other member at the other end thereof. The IC chip is mounted on the suspension member. When the IC chip is selected to have appropriate disc side area and is mounted on the suspension member, the temperature of the IC chip itself may be maintained within a range of acceptable degree and that of the magnetic head may be also kept to be lower. When the electric power consumption of the IC chip is equal to or less than 410 mW, the disc side area thereof should be equal to or more than 1.1 mm2. The IC chip is mounted on a surface of the suspension member at a side facing to the disc at a position where a relative linear velocity equal to or more than 25 m/sec is generated with respect to said disc.
    • 公开了一种磁头装置,其中头部IC芯片可以相对靠近磁头定位,并且可以将热效应控制在可接受的程度的范围内。 所述磁头装置包括具有磁头的磁头滑动器,由薄弹性材料制成的悬架构件,并在其一端支撑磁头滑块,以及磁头IC芯片,其中所述悬挂构件在所述磁头滑块 的另一端。 IC芯片安装在悬挂构件上。 当IC芯片被选择为具有适当的盘侧面积并安装在悬挂构件上时,IC芯片本身的温度可以保持在可接受的程度的范围内,并且磁头的温度也可以保持较低。 当IC芯片的电力消耗等于或小于410mW时,其盘侧面积应等于或大于1.1mm 2。 IC芯片在相对于所述盘产生相对线速度等于或大于25m / sec的位置处,在面对盘的一侧安装在悬挂构件的表面上。