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1. 发明授权

US07173951B2 Semiconductor laser device with light receiving element 失效
标题翻译：具有光接收元件的半导体激光器件
公开(公告)号：US07173951B2
公开(公告)日：2007-02-06
申请号：US10777190
申请日：2004-02-13
申请人： Hisayuki Shinohara , Ayumi Yagi , Kazunori Matsubara , Tetsuyoshi Inoue
发明人： Hisayuki Shinohara , Ayumi Yagi , Kazunori Matsubara , Tetsuyoshi Inoue
IPC分类号： H01S3/04
CPC分类号： H01S5/02288 , G11B7/123 , H01L2224/48247 , H01L2224/49171 , H01S5/02216 , H01S5/02292
摘要： A semiconductor laser device includes a package having a front surface, a rear surface and an outer peripheral surface; a semiconductor laser element and a light receiving element provided on the front surface; a plurality of leads arranged in spaced relation on the front surface as extending outward from the package; and an optical element supported above the front surface with its optical axis perpendicular to the front surface for guiding a laser beam emitted from the semiconductor laser element toward an object and guiding light reflected on the object to the light receiving element; wherein the outer peripheral surface is configured so as to be fitted in a cylindrical hole having an axis parallel to the optical axis of the optical element, and has a recess extending from the front surface to the rear surface, and the leads are bent as extending from the front surface and passing through the recess with distal portions thereof extending along the optical axis of the optical element and with proximal ends thereof electrically connected to the semiconductor laser element and the light receiving element.
摘要翻译：半导体激光装置包括：具有前表面，后表面和外周面的封装; 半导体激光元件和设置在前表面上的光接收元件; 在前表面上以间隔开的方式布置成从包装向外延伸的多个引线; 以及支撑在前表面上的光学元件，其光轴垂直于前表面，用于将从半导体激光元件发射的激光束朝向物体引导并将在物体上反射的光引导到光接收元件; 其特征在于，所述外周面配置成具有与所述光学元件的光轴平行的轴的圆筒状孔，并且具有从所述前表面延伸到所述后表面的凹部，并且所述引线被弯曲成延伸从前表面通过凹部，其远端部分沿着光学元件的光轴延伸，并且其近端电连接到半导体激光元件和光接收元件。

2. 发明授权

US06989596B2 Semiconductor laser manufacturing method and semiconductor laser 失效
公开(公告)号：US06989596B2
公开(公告)日：2006-01-24
申请号：US09987010
申请日：2001-11-13
申请人： Tetsuyoshi Inoue , Kazunori Matsubara
发明人： Tetsuyoshi Inoue , Kazunori Matsubara
IPC分类号： H01L23/34
CPC分类号： H01S5/02212 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/83192 , H01L2924/12042 , H01L2924/12043 , H01S5/02272 , H01S5/024 , H01L2924/00
摘要： Silver paste is applied to a stem, and a semiconductor laser chip is mounted onto the stem on which the silver paste has been applied. Next, the semiconductor laser chip mounted on the stem, while kept pressurized toward the stem with a collet, is heated to make the silver paste temporarily cured, by which the semiconductor laser chip is fixed onto the stem. Then, after a temporary curing step, the silver paste is finally cured within a thermostat. The semiconductor laser device thus manufactured is low in thermal resistance and reduced in variations of operating current and prevented from short-circuiting of the semiconductor laser chip.

3. 发明授权

US07106767B2 Semiconductor laser device 失效
标题翻译：半导体激光器件
公开(公告)号：US07106767B2
公开(公告)日：2006-09-12
申请号：US10679497
申请日：2003-10-07
申请人： Tetsuyoshi Inoue
发明人： Tetsuyoshi Inoue
IPC分类号： H01S3/04
CPC分类号： G11B7/1353 , G11B7/123 , G11B7/127 , G11B7/1381 , G11B7/22 , H01S5/02216 , H01S5/02248 , H01S5/02292 , H01S5/02296 , H01S5/0683
摘要： The present invention provides a semiconductor laser device of which reliability is enhanced. In the semiconductor laser device of the present invention, a semiconductor laser element 3 emitting laser light in a plane direction, a reflection mirror 4 reflecting the laser light in an upper direction and a light acceptance unit 5 detecting signal of incident laser light are disposed inside an insulative frame 2. A plurality of leads 8 extending in a horizontal direction are fixed in the end walls 2a, 2b opposed to each other in the longitudinal direction of the insulative frame 2. The insulative frame 2 is made of liquid crystal polymer.
摘要翻译：本发明提供了可靠性提高的半导体激光装置。在本发明的半导体激光装置中，在平面方向上发射激光的半导体激光元件3，反射上述方向的激光的反射镜4和检测入射激光的信号的光接收部5配置在绝缘框架2。沿着水平方向延伸的多个引线8固定在绝缘框架2的纵向彼此相对的端壁2a，2b中。绝缘框架2由液晶聚合物制成。

4. 发明申请

US20100116330A1 SOLAR CELL MODULE, SOLAR CELL WIRING MEMBER, AND METHOD OF MANUFACTURING SOLAR CELL MODULE 审中-公开
标题翻译：太阳能电池模块，太阳能电池组件，以及制造太阳能电池模块的方法
公开(公告)号：US20100116330A1
公开(公告)日：2010-05-13
申请号：US12524927
申请日：2008-01-22
申请人： Tetsuyoshi Inoue
发明人： Tetsuyoshi Inoue
IPC分类号： H01L31/00 , H01L31/18
CPC分类号： H01L31/02013 , Y02E10/50
摘要： A solar cell module of the present invention is provided with: a unit solar cell (2) in which a first electrode (21) and a second electrode (22) are formed in a non-light-receiving face; a solar cell wiring member (1) including a first conductor wire (11) connected to the first electrode (21), a second conductor wire (12) connected to the second electrode (22), and a wiring sheet (10) in which the first conductor wire (11) and the second conductor wire (12) are formed; and a sealing resin sheet (33) that is laminated on the unit solar cell (2) and the solar cell wiring member (1) and that resin-seals the unit solar cell (2).
摘要翻译：本发明的太阳能电池模块设置有：在非光接收面上形成有第一电极（21）和第二电极（22）的单位太阳能电池（2）包括连接到第一电极（21）的第一导体线（11）和连接到第二电极（22）的第二导体线（12）的太阳能电池配线构件（1）和布线板（10）形成第一导线（11）和第二导线（12）; 以及层叠在单位太阳能电池（2）和太阳能电池配线构件（1）上并且树脂密封单元太阳能电池（2）的密封树脂片（33）。

5. 发明授权

US06922425B2 Semiconductor laser device and optical pickup device 失效
标题翻译：半导体激光器件和光学拾取器件
公开(公告)号：US06922425B2
公开(公告)日：2005-07-26
申请号：US10438044
申请日：2003-05-15
申请人： Tetsuyoshi Inoue
发明人： Tetsuyoshi Inoue
IPC分类号： G11B7/125 , H01S5/022 , H01S5/40 , H01S5/00 , H01S3/04
CPC分类号： G11B7/127 , H01L2224/05554 , H01L2224/49171 , H01S5/02252 , H01S5/4031 , H01S2301/14
摘要： In a semiconductor laser device, a plane of polarization of a laser beam emitted by a semiconductor laser (4) is inclined from a substrate surface (4A), allowing the semiconductor laser (4) to be higher in power and higher in reliability. Moreover, a die-bond surface (17) of this semiconductor laser (4) is inclined by a specified inclination angle θ with respect to the reference surface (3) of the stem body (1), so that the plane of polarization of the laser beam can be made generally parallel to the reference surface (3) of the stem body (1). Thus, there can be provided a semiconductor laser device which is capable of contributing to a thinning of an optical pickup device and easy to manufacture.
摘要翻译：在半导体激光装置中，由半导体激光器（4）发射的激光束的偏振面从衬底表面（4A）倾斜，使得半导体激光器（4）的功率更高并且可靠性更高。此外，该半导体激光器（4）的芯片接合表面（17）相对于主体（1）的参考表面（3）倾斜指定的倾斜角度θ，使得该半导体激光器激光束可以大致平行于茎体（1）的参考表面（3）制成。因此，可以提供能够有助于光学拾取装置的薄型化并且易于制造的半导体激光装置。

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